Q: He aha nā ʻenehana nui i hoʻohana ʻia i ka ʻoki ʻana a me ka hana ʻana i ka wafer SiC?
A:Karbida silika ʻO ka paʻakikī o (SiC) ka lua o ka daimana a ua manaʻo ʻia he mea paʻakikī loa a palupalu. ʻO ke kaʻina hana ʻokiʻoki, e pili ana i ka ʻoki ʻana i nā kristal i ulu ʻia i loko o nā wafers lahilahi, he manawa lōʻihi a maʻalahi hoʻi i ka chipping. Ma ke ʻano he hana mua i lokoSiCHoʻopili nui ka maikaʻi o ka ʻoki ʻana i ka wili ʻana, ka poli ʻana, a me ka lahilahi ma hope. Hoʻokomo pinepine ka ʻoki ʻana i nā māwae ʻili a me lalo, e hoʻonui ana i nā helu haki wafer a me nā kumukūʻai hana. No laila, ʻo ka kaohi ʻana i ka pōʻino o ka māwae ʻili i ka wā o ka ʻoki ʻana he mea nui ia no ka hoʻolaha ʻana i ka hana ʻana o nā hāmeʻa SiC.
ʻO nā ʻano hana ʻokiʻoki SiC i hōʻike ʻia i kēia manawa e komo pū ana me ka fixed-abrasive, free-abrasive slicing, laser cutting, layer transfer (cold separation), a me ka electrical discharge slicing. Ma waena o kēia mau mea, ʻo ka reciprocating multi-wire slicing me nā fixed diamond abrasives ke ʻano i hoʻohana pinepine ʻia no ka hana ʻana i nā kristal SiC hoʻokahi. Eia nō naʻe, i ka hiki ʻana o ka nui o ka ingot i 8 ʻīniha a ʻoi aku, lilo ka ʻokiʻoki uea kuʻuna i mea pono ʻole ma muli o ke koi nui o nā lako, nā kumukūʻai, a me ka pono haʻahaʻa. Aia kahi pono wikiwiki no nā ʻenehana ʻokiʻoki haʻahaʻa ke kumukūʻai, haʻahaʻa ka pohō, a me ka pono kiʻekiʻe.
Q: He aha nā pono o ka ʻoki ʻana i ka laser ma mua o ka ʻoki ʻana i nā uea he nui maʻamau?
A: ʻO ka ʻoki uea kuʻuna e ʻoki ana i kaʻIkopa SiCma ke kuhikuhi kikoʻī i loko o nā ʻāpana he mau haneli microns ka mānoanoa. A laila wili ʻia nā ʻāpana me ka hoʻohana ʻana i nā slurries daimana e wehe i nā māka ʻoki a me nā hōʻino ma lalo o ka ʻili, a ukali ʻia e ka polishing mechanical chemical (CMP) e hoʻokō ai i ka planarization honua, a ma hope e hoʻomaʻemaʻe ʻia e loaʻa nā wafers SiC.
Eia nō naʻe, ma muli o ka paʻakikī kiʻekiʻe a me ka palupalu o ka SiC, hiki i kēia mau ʻanuʻu ke hoʻoulu maʻalahi i ka warping, ka haki ʻana, ka piʻi ʻana o nā helu haki, nā kumukūʻai hana kiʻekiʻe, a me ka hopena i ka ʻinoʻino o ka ʻili a me ka haumia (lepo, wai hoʻoneoneo, a pēlā aku). Eia kekahi, lohi ka ʻoki ʻana i ka uea a he haʻahaʻa ka hua. Hōʻike nā kuhi e loaʻa wale ana i ka ʻoki ʻana i nā uea he 50% wale nō ka hoʻohana ʻana i nā mea, a hiki i ka 75% o nā mea e nalowale ana ma hope o ka wili ʻana a me ka wili ʻana. Ua hōʻike mai nā ʻikepili hana mua mai nā ʻāina ʻē e hiki ke hala ma kahi o 273 mau lā o ka hana mau ʻana he 24 hola e hana ai i 10,000 wafers—he manawa nui loa.
Ma ka home, nui nā ʻoihana ulu kristal SiC e kālele ana i ka hoʻonui ʻana i ka mana o ka umu. Eia nō naʻe, ma kahi o ka hoʻonui wale ʻana i ka hana, ʻoi aku ka nui o ka noʻonoʻo ʻana pehea e hōʻemi ai i nā pohō—ʻoiai ke kūpono ʻole ka ulu ʻana o ka kristal.
Hiki i nā lako ʻokiʻoki laser ke hōʻemi nui i ka nalowale o nā mea a hoʻomaikaʻi i ka hua. No ka laʻana, me ka hoʻohana ʻana i hoʻokahi 20 mmʻIkopa SiCHiki i ka ʻoki ʻana i ka uea ke hua mai ma kahi o 30 mau wafers o 350 μm ka mānoanoa. Hiki i ka ʻoki ʻana i ka laser ke hua mai ma mua o 50 mau wafers. Inā hoʻemi ʻia ka mānoanoa o ka wafer i 200 μm, hiki ke hana ʻia ma mua o 80 mau wafers mai ka ingot like. ʻOiai ua hoʻohana nui ʻia ka ʻoki ʻana i ka uea no nā wafers 6 ʻīniha a liʻiliʻi, ʻo ka ʻoki ʻana i kahi ingot SiC 8-ʻīniha e hala paha i 10-15 mau lā me nā ʻano kuʻuna, e koi ana i nā lako hana kiʻekiʻe a me ke kumukūʻai kiʻekiʻe me ka pono haʻahaʻa. Ma lalo o kēia mau kūlana, ua maopopo nā pono o ka ʻoki ʻana i ka laser, e lilo ia i ʻenehana nui no ka wā e hiki mai ana no nā wafers 8-ʻīniha.
Me ka ʻoki ʻana me ka laser, ʻo ka manawa ʻoki ʻana no kēlā me kēia wafer 8-'īniha hiki ke emi ma lalo o 20 mau minuke, me ka pohō mea no kēlā me kēia wafer ma lalo o 60 μm.
I ka hōʻuluʻulu manaʻo, i ka hoʻohālikelike ʻana i ka ʻoki ʻana i nā uea he nui, hāʻawi ka ʻoki ʻana i ka laser i ka wikiwiki kiʻekiʻe, ka hua maikaʻi aʻe, ka pohō mea haʻahaʻa, a me ka hana ʻana maʻemaʻe.
Q: He aha nā pilikia loea nui i ka ʻoki ʻana i ka laser SiC?
A: ʻO ke kaʻina hana ʻoki laser e pili ana i ʻelua mau ʻanuʻu nui: ka hoʻololi ʻana o ka laser a me ka hoʻokaʻawale ʻana o ka wafer.
ʻO ke kumu o ka hoʻololi ʻana o ka laser ka hoʻopili ʻana i ke kukuna a me ka hoʻonui ʻana i nā palena. ʻO nā palena e like me ka mana laser, ke anawaena kiko, a me ka wikiwiki o ka scan e pili ana i ka maikaʻi o ka ablation mea a me ka holomua o ka hoʻokaʻawale wafer ma hope. ʻO ke ʻano o ka ʻāpana i hoʻololi ʻia e hoʻoholo i ka ʻoʻoleʻa o ka ʻili a me ka paʻakikī o ka hoʻokaʻawale ʻana. ʻO ka ʻoʻoleʻa o ka ʻili kiʻekiʻe e hoʻopilikia i ka wili ʻana ma hope a hoʻonui i ka nalowale o nā mea.
Ma hope o ka hoʻololi ʻana, hoʻokō pinepine ʻia ka hoʻokaʻawale ʻana o ka wafer ma o nā ikaika shear, e like me ka haki anu a i ʻole ke kaumaha mechanical. Hoʻohana kekahi mau ʻōnaehana home i nā transducers ultrasonic e hoʻoulu i nā haʻalulu no ka hoʻokaʻawale ʻana, akā hiki i kēia ke hana i ka chipping a me nā hemahema lihi, e hoʻohaʻahaʻa ana i ka hua hope loa.
ʻOiai ʻaʻole paʻakikī kēia mau ʻanuʻu ʻelua, ʻo nā kūlike ʻole o ke ʻano o ke kristal—ma muli o nā kaʻina hana ulu like ʻole, nā pae doping, a me nā hoʻolaha koʻikoʻi kūloko—e hoʻopilikia nui i ka paʻakikī o ka ʻoki ʻana, ka hua, a me ka pohō waiwai. ʻO ka ʻike wale ʻana i nā wahi pilikia a me ka hoʻoponopono ʻana i nā wahi scan laser ʻaʻole paha e hoʻomaikaʻi nui i nā hopena.
ʻO ke kī i ka hoʻohana nui ʻia ʻana, ʻo ia ka hoʻomohala ʻana i nā ʻano hana a me nā lako hana hou e hiki ke hoʻololi i nā ʻano like ʻole o ke aniani mai nā mea hana like ʻole, ka hoʻonui ʻana i nā palena hana, a me ke kūkulu ʻana i nā ʻōnaehana ʻoki laser me ka hoʻohana honua.
Q: Hiki ke hoʻopili ʻia ka ʻenehana ʻoki laser i nā mea semiconductor ʻē aʻe ma waho aʻe o SiC?
A: Ua hoʻohana ʻia ka ʻenehana ʻoki laser i nā ʻano mea like ʻole. I loko o nā semiconductors, ua hoʻohana mua ʻia no ka dicing wafer a ua hoʻonui ʻia i ka ʻoki ʻana i nā kristal nui hoʻokahi.
Ma waho aʻe o SiC, hiki ke hoʻohana ʻia ka ʻoki ʻana i ka laser no nā mea paʻakikī a palupalu paha e like me ke daimana, gallium nitride (GaN), a me ka gallium oxide (Ga₂O₃). Ua hōʻike nā haʻawina mua ma luna o kēia mau mea i ka hiki ke hana a me nā pono o ka ʻoki ʻana i ka laser no nā noi semiconductor.
Q: Aia kekahi mau huahana lako ʻoki laser kūloko i kēia manawa? I ke kahua hea kāu noiʻi?
A: Ua manaʻo nui ʻia nā lako ʻoki laser SiC nui-diameter ʻo ia nā lako koʻikoʻi no ka wā e hiki mai ana o ka hana wafer SiC 8-'īniha. I kēia manawa, ʻo Iapana wale nō ke hāʻawi i ia mau ʻōnaehana, a he pipiʻi lākou a kau ʻia i nā kapu hoʻokuʻu aku.
Ua manaʻo ʻia ka noi kūloko no nā ʻōnaehana ʻokiʻoki/thinning laser ma kahi o 1,000 mau ʻāpana, ma muli o nā hoʻolālā hana SiC a me ka hiki ke ʻoki uea i kēia manawa. Ua hoʻopukapuka nui nā ʻoihana kūloko nui i ka hoʻomohala ʻana, akā ʻaʻohe lako kūloko i loaʻa a paʻa i ka hoʻolaha ʻoihana.
Ua hoʻomohala nā hui noiʻi i ka ʻenehana hāpai laser ponoʻī mai ka makahiki 2001 a ua hoʻonui i kēia i ka ʻoki ʻana a me ka lahilahi ʻana o ka laser SiC nui. Ua hoʻomohala lākou i kahi ʻōnaehana prototype a me nā kaʻina hana ʻoki i hiki ke: ʻOki a lahilahi i nā wafers SiC semi-insulating 4-6 ʻīniha ʻOki ʻana i nā ingots SiC conductive 6-8 ʻīniha Nā pae hoʻohālikelike hana: 6-8 ʻīniha semi-insulating SiC: manawa ʻoki 10-15 mau minuke/wafer; pohō mea <30 μm 6-8 ʻīniha conductive SiC: manawa ʻoki 14-20 mau minuke/wafer; pohō mea <60 μm
Ua hoʻonui ʻia ka hua wafer i manaʻo ʻia ma mua o 50%
Ma hope o ka ʻoki ʻana, ua kūlike nā wafers i nā kūlana aupuni no ke ʻano geometry ma hope o ka wili ʻana a me ka wili ʻana. Hōʻike pū nā haʻawina ʻaʻole i hoʻopilikia nui nā hopena wela i hoʻokomo ʻia e ka laser i ke kaumaha a i ʻole ke ʻano geometry i loko o nā wafers.
Ua hoʻohana ʻia nā mea hana like e hōʻoia i ka hiki ke ʻokiʻoki i nā kristal daimana, GaN, a me Ga₂O₃.
Ka manawa hoʻouna: Mei-23-2025