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Hoʻololi i nā mea hoʻopau wela! Hoʻonohonoho ʻia ke koi ʻana o Silicon Carbide substrate e pahū!
Papa o na mea 1. Heat Dissipation Bottleneck in AI Chips and the Breakthrough of Silicon Carbide Materials 2. Nā ʻano a me nā pono ʻenehana o Silicon Carbide Substrates 3. Strategic Plans and Collaborative Development by NVIDIA and TSMC 4.Heluhelu hou aku -
ʻO ka holomua nui ma ka ʻenehana 12-inch Silicon Carbide Wafer Laser Lift-Off Technology
Papa o ka Maʻiʻo 1.Major Breakthrough in 12-Inch Silicon Carbide Wafer Laser Lift-Off Technology 2.Heluhelu hou aku -
Title: He aha ka FOUP ma Chip Manufacturing?
Papa Maʻiʻo.Heluhelu hou aku -
Wafer Cleaning Technology ma Semiconductor Manufacturing
ʻO ka ʻenehana hoʻomaʻemaʻe ʻo Wafer ma Semiconductor Manufacturing He hana koʻikoʻi ka hoʻomaʻemaʻe ʻana i ka wafer i loko o ke kaʻina hana semiconductor holoʻokoʻa a me kekahi o nā kumu koʻikoʻi e pili pono ana i ka hana a me ka hoʻoulu ʻana. I ka wā o ka hana ʻana i ka chip, ʻo ka hoʻohaumia liʻiliʻi loa ...Heluhelu hou aku -
Nā ʻenehana hoʻomaʻemaʻe Wafer a me nā palapala ʻenehana
Papa o ka Manaʻo 1.Nā Pahuhopu Koʻikoʻi a me ka Koʻikoʻi o ka Hoʻomaʻemaʻe Wafer 2. Ka Hoʻomaʻemaʻe Wafer 2. ʻO ka loiloi contamination a me nā ʻenehana Analytical Kiʻekiʻe 3. Nā ʻano hoʻomaʻemaʻe kiʻekiʻe a me nā kumu ʻenehana 4. Ka hoʻokō ʻenehana a me nā mea e pono ai ke kaʻina hana 5.Heluhelu hou aku -
Nā Kilika Hoʻokahi i ulu hou
He mea kakaikahi nā kristal hoʻokahi ma ke ʻano, a i ka wā e hiki mai ai, liʻiliʻi loa lākou - maʻamau ma ka pālākiō millimeter (mm) - a paʻakikī ke loaʻa. ʻO nā daimana i hōʻike ʻia, nā emeralds, agate, a me nā mea ʻē aʻe, ʻaʻole i komo i ke kaʻa ʻana ma ka mākeke, koe wale nō nā noi ʻoihana; hōʻike ʻia ka hapa nui ...Heluhelu hou aku -
ʻO ka mea kūʻai nui loa o ka alumina hoʻomaʻemaʻe kiʻekiʻe: pehea ka nui o kāu ʻike e pili ana i ka sapphire?
Hoʻoulu ʻia nā kristal Sapphire mai ka pauka alumina hoʻomaʻemaʻe kiʻekiʻe me ka maʻemaʻe o> 99.995%, e hoʻolilo iā lākou i wahi koi nui loa no ka alumina maʻemaʻe kiʻekiʻe. Hōʻike lākou i ka ikaika kiʻekiʻe, ka paʻakikī kiʻekiʻe, a me nā waiwai kemika paʻa, e hiki ai iā lākou ke hana i nā wahi paʻakikī e like me ke kiʻekiʻe kiʻekiʻe ...Heluhelu hou aku -
He aha ka manaʻo o TTV, BOW, WARP, a me TIR i nā Wafers?
Ke nānā nei mākou i nā wafers silicon semiconductor a i ʻole substrates i hana ʻia i nā mea ʻē aʻe, ʻike pinepine mākou i nā hōʻailona ʻenehana e like me: TTV, BOW, WARP, a me TIR, STIR, LTV, a me nā mea ʻē aʻe. He aha nā ʻāpana e hōʻike nei kēia? TTV — Hoʻololi ʻokoʻa mānoanoa holoʻokoʻa ʻo BOW — Bow WARP — Warp TIR — ...Heluhelu hou aku -
ʻO nā mea waiwai nui no ka hana semiconductor: nā ʻano o nā substrate wafer
ʻO Wafer Substrates ma ke ʻano he mea nui i loko o nā ʻōnaehana Semiconductor ʻo Wafer substrates nā mea lawe kino o nā mea semiconductor, a ʻo kā lākou waiwai waiwai e hoʻoholo pololei i ka hana o ka hāmeʻa, ke kumu kūʻai, a me nā kahua noi. Aia ma lalo iho nā ʻano nui o nā substrates wafer me kā lākou advanttag ...Heluhelu hou aku -
ʻO nā mea hoʻoheheʻe laser kiʻekiʻe no ka 8-inch SiC Wafers: ʻO ka ʻenehana kumu no ka hana ʻana i ka wā e hiki mai ana.
ʻO Silicon carbide (SiC) ʻaʻole ia he ʻenehana koʻikoʻi no ka pale aupuni akā he mea koʻikoʻi nō hoʻi no ka ʻoihana kaʻa honua a me ka ikehu. E like me ka hana koʻikoʻi mua i ka hoʻoili ʻana i ka kristal hoʻokahi SiC, ʻo ka wafer slicing e hoʻoholo pololei i ka maikaʻi o ka thinning a me ka polishing ma hope. Tr...Heluhelu hou aku -
ʻO nā makaanianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianianiauwaenalu.
E kū'ē i ke kua o ka hoʻololi AI, ke komo mālie nei nā aniani AR i ka ʻike lehulehu. Ma ke ʻano he paradigm e hoʻohui pono i nā honua virtual a me nā honua maoli, ʻokoʻa nā aniani AR mai nā polokalamu VR ma o ka ʻae ʻana i nā mea hoʻohana e ʻike i nā kiʻi kiʻi kiʻi ʻia a me nā kukui kūlohelohe ambient like ...Heluhelu hou aku -
Heteroepitaxial Growth o 3C-SiC ma nā Silicon Substrates me nā ʻano ʻokoʻa.
1. ʻŌlelo Hoʻomaka ʻOiai ʻo nā makahiki he nui o ka noiʻi ʻana, ʻaʻole i loaʻa i ka heteroepitaxial 3C-SiC i ulu ʻia ma luna o nā substrates silikoni i lawa ka maikaʻi aniani no nā noi uila ʻenehana. Hana ʻia ka ulu ʻana ma nā substrate Si(100) a i ʻole Si(111), e hōʻike ana kēlā me kēia i nā pilikia kūʻokoʻa: anti-phase ...Heluhelu hou aku