8inihi SiC Production papa wafer 4H-N SiC substrate
Hōʻike ka papa ma lalo nei i nā kikoʻī o kā mākou 8inch SiC wafers:
| 8 iniha N-type SiC DSP Specs | |||||
| Helu | 'ikamu | Unite | Hana ʻia | Ka noiʻi | Dummy |
| 1: nā ʻāpana | |||||
| 1.1 | polytype | -- | 4H | 4H | 4H |
| 1.2 | hoʻonohonoho ʻili | ° | <11-20>4±0.5 | <11-20>4±0.5 | <11-20>4±0.5 |
| 2:Ka palena uila | |||||
| 2.1 | dopant | -- | n-type Nitrogen | n-type Nitrogen | n-type Nitrogen |
| 2.2 | kūʻē | ohm ·cm | 0.015~0.025 | 0.01~0.03 | NA |
| 3:Ka palena mīkini | |||||
| 3.1 | anawaena | mm | 200±0.2 | 200±0.2 | 200±0.2 |
| 3.2 | mānoanoa | μm | 500±25 | 500±25 | 500±25 |
| 3.3 | ʻO ke kuhi notch | ° | [1- 100]±5 | [1- 100]±5 | [1- 100]±5 |
| 3.4 | Hohonu Notch | mm | 1~1.5 | 1~1.5 | 1~1.5 |
| 3.5 | LTV | μm | ≤5(10mm*10mm) | ≤5(10mm*10mm) | ≤10(10mm*10mm) |
| 3.6 | TTV | μm | ≤10 | ≤10 | ≤15 |
| 3.7 | Kakaka | μm | -25~25 | -45~45 | -65~65 |
| 3.8 | Warp | μm | ≤30 | ≤50 | ≤70 |
| 3.9 | AFM | nm | Ra≤0.2 | Ra≤0.2 | Ra≤0.2 |
| 4:Hoʻolālā | |||||
| 4.1 | micropipe density | ea/cm2 | ≤2 | ≤10 | ≤50 |
| 4.2 | mea metala | nā ʻātoma/cm2 | ≤1E11 | ≤1E11 | NA |
| 4.3 | TSD | ea/cm2 | ≤500 | ≤1000 | NA |
| 4.4 | BPD | ea/cm2 | ≤2000 | ≤5000 | NA |
| 4.5 | TED | ea/cm2 | ≤7000 | ≤10000 | NA |
| 5.Front maikaʻi | |||||
| 5.1 | mua | -- | Si | Si | Si |
| 5.2 | hoʻopau ʻili | -- | Si-maka CMP | Si-maka CMP | Si-maka CMP |
| 5.3 | ʻāpana | ea/wafer | ≤100 (nui≥0.3μm) | NA | NA |
| 5.4 | ʻūlū | ea/wafer | ≤5, Ka huina Length≤200mm | NA | NA |
| 5.5 | Kaulana chips/indents/cracks/stains/contamination | -- | ʻAʻohe | ʻAʻohe | NA |
| 5.6 | Nā wahi polytype | -- | ʻAʻohe | Wahi ≤10% | Wahi ≤30% |
| 5.7 | hoailona mua | -- | ʻAʻohe | ʻAʻohe | ʻAʻohe |
| 6: Ka maikaʻi hope | |||||
| 6.1 | hope hope | -- | C-maka MP | C-maka MP | C-maka MP |
| 6.2 | ʻūlū | mm | NA | NA | NA |
| 6.3 | lihi hemahema hope chips/indents | -- | ʻAʻohe | ʻAʻohe | NA |
| 6.4 | ʻōkalakala kua | nm | Ra≤5 | Ra≤5 | Ra≤5 |
| 6.5 | Kaha hope | -- | Notch | Notch | Notch |
| 7: lihi | |||||
| 7.1 | lihi | -- | Chamfer | Chamfer | Chamfer |
| 8: Pūʻolo | |||||
| 8.1 | kāʻei ʻana | -- | Epi-mākaukau me ka vacuum kāʻei ʻana | Epi-mākaukau me ka vacuum kāʻei ʻana | Epi-mākaukau me ka vacuum kāʻei ʻana |
| 8.2 | kāʻei ʻana | -- | Wafer nui hoʻopaʻa cassette | Wafer nui hoʻopaʻa cassette | Wafer nui hoʻopaʻa cassette |
Kiʻi kikoʻī
Nā Huahana Pili
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