Mīkini ʻoki daimana multi-wire no nā mea brittle SiC Sapphire Ultra-Hard

Mīkini ʻoki daimana multi-wire no nā mea SiC Sapphire Ultra-Hard Brittle Kiʻi i hōʻike ʻia

Wehewehe Pōkole:

ʻO ka mīkini ʻoki daimana multi-wire he ʻōnaehana ʻokiʻoki hou loa i hoʻolālā ʻia no ka hana ʻana i nā mea paʻakikī loa a palupalu. Ma ka hoʻolaha ʻana i nā uea i uhi ʻia i ka daimana like, hiki i ka mīkini ke ʻoki i nā wafers he nui i ka manawa like i hoʻokahi pōʻaiapuni, e hoʻokō ana i ka throughput kiʻekiʻe a me ka pololei.

E leka uila mai iā mākou

Nā hiʻohiʻona

Hoʻolauna i ka Mīkini ʻoki Diamond Multi-Wire

ʻO ka mīkini ʻoki daimana multi-wire he ʻōnaehana ʻokiʻoki hou loa i hoʻolālā ʻia no ka hana ʻana i nā mea paʻakikī loa a palupalu. Ma ka hoʻolaha ʻana i nā uea i uhi ʻia me ka daimana like, hiki i ka mīkini ke ʻoki i nā wafers he nui i ka manawa like i hoʻokahi pōʻaiapuni, e hoʻokō ana i ka throughput kiʻekiʻe a me ka pololei. Ua lilo kēia ʻenehana i mea hana koʻikoʻi i nā ʻoihana e like me semiconductors, solar photovoltaics, LEDs, a me nā keramika holomua, ʻoi aku hoʻi no nā mea e like me SiC, sapphire, GaN, quartz, a me alumina.

Ke hoʻohālikelike ʻia me ka ʻoki ʻana i hoʻokahi uea maʻamau, hāʻawi ka hoʻonohonoho multi-uea i nā ʻumi a i nā haneli o nā ʻāpana i kēlā me kēia pūʻulu, e hōʻemi nui ana i ka manawa pōʻaiapuni me ka mālama ʻana i ka palahalaha maikaʻi loa (Ra < 0.5 μm) a me ka pololei o ke ana (± 0.02 mm). Hoʻohui kāna hoʻolālā modular i ka hoʻopaʻa ʻana i ka uea aunoa, nā ʻōnaehana lawelawe ʻāpana hana, a me ka nānā ʻana ma ka pūnaewele, e hōʻoiaʻiʻo ana i ka hana lōʻihi, paʻa, a piha i ka hana aunoa.

Nā Kūlana ʻenehana o ka Mīkini ʻoki Diamond Multi-Wire

Mea	Nā kikoʻī	Mea	Nā kikoʻī
Ka nui o ka hana (Huinahā)	220 × 200 × 350 mm	Motika hoʻokele	17.8 kW × 2
Ka nui o ka hana (Poepoe)	Φ205 × 350 mm	Motika hoʻokele uea	11.86 kW × 2
Ka mamao o ke kaula	Φ250 ±10 × 370 × 2 axis (mm)	Motika hāpai papa hana	2.42 kW × 1
ʻO ke koʻi nui	650 mm	Motika hoʻoluliluli	0.8 kW × 1
Ka wikiwiki o ka holo ʻana o ka uea	1500 m/min	Motika hoʻonohonoho	0.45 kW × 2
Anawaena uea	Φ0.12–0.25 mm	Motika hoʻoluhi	4.15 kW × 2
Ka wikiwiki o ka hāpai ʻana	225 mm/min	Motika lepo	7.5 kW × 1
Ka hoʻohuli papa ʻaina kiʻekiʻe loa	±12°	Ka nui o ka pahu lepo	300 L
Ke kihi wili	±3°	Kahe ʻana o ka mea hoʻoluʻu	200 L/min
Alapine (frequency) o ka hoʻololi ʻana	~30 manawa/min	Pololei o ka mahana	±2 °C
Ka helu hānai	0.01–9.99 mm/min	Lako ikehu	335+210 (mm²)
Ka helu hānai uea	0.01–300 mm/min	Ea i hoʻopaʻa ʻia	0.4–0.6 MPa
Ka nui o ka mīkini	3550 × 2200 × 3000 mm	Kaumaha	13,500 kg

ʻAno Hana o ka Mīkini ʻoki Diamond Multi-Wire

Neʻe ʻoki ʻana i nā uea he nui
Neʻe nā uea daimana he nui i nā wikiwiki i hoʻonohonoho ʻia a hiki i 1500 m/min. Mālama nā pulleys i alakaʻi ʻia me ka pololei a me ka kaohi hoʻoluhi loop pani (15-130 N) i nā uea paʻa, e hōʻemi ana i ka manawa kūpono o ka haʻalele ʻana a i ʻole ka haki ʻana.
Ka Hānai Pololei a me ke Kūlana
Hoʻokō ke kūlana servo-driven i ka pololei ±0.005 mm. Hoʻonui ke koho laser a i ʻole ke kōkua ʻana o ka ʻike i nā hopena no nā ʻano paʻakikī.
Hoʻomaʻalili a me ka wehe ʻana i nā ʻōpala
Hoʻopau mau ka mea hoʻoluʻu kaomi kiʻekiʻe i nā ʻāpana a hoʻomaʻalili i ka wahi hana, e pale ana i ka pōʻino wela. Hoʻolōʻihi ka kānana multi-stage i ke ola o ka coolant a hoʻemi i ka downtime.
Kahua Mana Akamai
Hoʻoponopono ikaika nā mea hoʻokele servo pane kiʻekiʻe (<1 ms) i ka hānai, ke kaomi, a me ka wikiwiki o ke kaula. Hoʻomaʻamaʻa ka hoʻokele meaʻai i hoʻohui ʻia a me ka hoʻololi ʻana o nā palena hoʻokahi-kaomi i ka hana nui.

Nā Pōmaikaʻi Koʻikoʻi o ka Mīkini ʻoki Diamond Multi-Wire

Hana Kiʻekiʻe
Hiki ke ʻoki i 50-200 wafers i kēlā me kēia holo, me ka pohō kerf <100 μm, e hoʻomaikaʻi ana i ka hoʻohana ʻana i nā mea a hiki i ka 40%. ʻO ka throughput he 5-10 × o nā ʻōnaehana uea hoʻokahi kuʻuna.
Mana Hoʻokele Kūpono
ʻO ke kūpaʻa o ke kaulahao i loko o ±0.5 N e hōʻoiaʻiʻo ana i nā hopena kūlike ma nā mea palupalu like ʻole. Kākoʻo ka nānā ʻana i ka manawa maoli ma kahi interface HMI 10" i ka mālama ʻana i nā meaʻai a me ka hana mamao.
Kūkulu Maʻalahi, Modular
Kūlike me nā anawaena uea mai 0.12–0.45 mm no nā kaʻina hana ʻoki like ʻole. ʻO ka lawelawe robotic koho e ʻae i nā laina hana hana piha piha.
Hilinaʻi Papa ʻOihana
Hoʻemi nā kiʻikuhi i hoʻolei ʻia/i hoʻoheheʻe ʻia i ka hana kaumaha i ka hoʻololi ʻana (<0.01 mm). Hāʻawi nā pulley alakaʻi me nā uhi seramika a i ʻole carbide i ʻoi aku ma mua o 8000 mau hola o ke ola lawelawe.

ʻŌnaehana ʻoki daimana multi-wire no nā mea SiC Sapphire Ultra-Hard Brittle 2

Nā kahua noi o ka mīkini ʻoki daimana multi-wire

Nā SemiconductorsʻOki ʻana i ka SiC no nā modula mana EV, nā substrates GaN no nā polokalamu 5G.
Nā PhotovoltaicsʻO ka ʻoki ʻana i ka wafer silicon wikiwiki me ka like ʻana o ±10 μm.
LED a me nā OpticsNā substrates sapphire no ka epitaxy a me nā mea optical precision me ka <20 μm edge chipping.
Nā Keramika KiʻekiʻeKa hana ʻana o ka alumina, AlN, a me nā mea like no nā ʻāpana aerospace a me ka hoʻokele wela.

ʻŌnaehana ʻoki daimana multi-wire no nā mea SiC Sapphire Ultra-Hard Brittle 3

ʻŌnaehana ʻoki daimana multi-wire no nā mea SiC Sapphire Ultra-Hard Brittle 5

ʻŌnaehana ʻoki daimana multi-wire no nā mea SiC Sapphire Ultra-Hard Brittle 6

Nā nīnau i nīnau pinepine ʻia - Mīkini ʻoki daimana uea he nui

Q1: He aha nā pono o ka ʻoki ʻana i nā uea he nui i hoʻohālikelike ʻia me nā mīkini uea hoʻokahi?
A: Hiki i nā ʻōnaehana multi-wire ke ʻoki i nā ʻumi a i nā haneli o nā wafers i ka manawa like, e hoʻonui ana i ka pono ma 5-10 ×. ʻOi aku ke kiʻekiʻe o ka hoʻohana ʻana i nā mea me ka pohō kerf ma lalo o 100 μm, e kūpono ana no ka hana nui ʻana.

Q2: He aha nā ʻano mea e hiki ke hana ʻia?
A: Ua hoʻolālā ʻia ka mīkini no nā mea paʻakikī a palupalu, me ka silicon carbide (SiC), sapphire, gallium nitride (GaN), quartz, alumina (Al₂O₃), a me ka alumini nitride (AlN).

Q3: He aha ka pololei a me ka maikaʻi o ka ʻili i hiki ke hoʻokō ʻia?
A: Hiki i ka ʻoʻoleʻa o ka ʻili ke hiki i Ra <0.5 μm, me ka pololei o ke ana o ±0.02 mm. Hiki ke hoʻomalu ʻia ka ʻoki lihi i <20 μm, e hoʻokō ana i nā kūlana semiconductor a me nā kūlana optoelectronic.

Q4: Ke hana nei ke kaʻina hana ʻoki i nā māwae a i ʻole ka hōʻino?
A: Me ka coolant kiʻekiʻe-kaomi a me ka kaohi hoʻoluhi loop pani, ua hoʻemi ʻia ka pilikia o nā micro-cracks a me ka hōʻino ʻana i ke koʻikoʻi, e hōʻoiaʻiʻo ana i ka pono o ka wafer maikaʻi loa.

Ma mua: ʻO SICOI (Silicon Carbide ma ka Insulator) Wafers SiC Film ON Silicon

Aʻe: Mīkini Wili Kūpono ʻElua ʻaoʻao no ka wafer SiC Sapphire Si