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Laina Hana Pololei ʻEhā Pae i Hoʻopili ʻia no ka Wafer Silicon / Silicon Carbide (SiC) (Laina Hana Pololei Hoʻohui ʻia)

ʻO ka Silicon / Silicon Carbide (SiC) Wafer Four-Stage Linked Polishing Automation Line (Integrated Post-Polish Handling Line) Kiʻi i hōʻike ʻia
  • Laina Hana Pololei ʻEhā Pae i Hoʻopili ʻia no ka Wafer Silicon / Silicon Carbide (SiC) (Laina Hana Pololei Hoʻohui ʻia)
  • Laina Hana Pololei ʻEhā Pae i Hoʻopili ʻia no ka Wafer Silicon / Silicon Carbide (SiC) (Laina Hana Pololei Hoʻohui ʻia)
  • Laina Hana Pololei ʻEhā Pae i Hoʻopili ʻia no ka Wafer Silicon / Silicon Carbide (SiC) (Laina Hana Pololei Hoʻohui ʻia)
  • Laina Hana Pololei ʻEhā Pae i Hoʻopili ʻia no ka Wafer Silicon / Silicon Carbide (SiC) (Laina Hana Pololei Hoʻohui ʻia)
  • Laina Hana Pololei ʻEhā Pae i Hoʻopili ʻia no ka Wafer Silicon / Silicon Carbide (SiC) (Laina Hana Pololei Hoʻohui ʻia)
  • Laina Hana Pololei ʻEhā Pae i Hoʻopili ʻia no ka Wafer Silicon / Silicon Carbide (SiC) (Laina Hana Pololei Hoʻohui ʻia)

Wehewehe Pōkole:

ʻO kēia Four-Stage Linked Polishing Automation Line he hopena i hoʻohui ʻia, in-line i hoʻolālā ʻia noma hope o ka hoʻomaʻemaʻe ʻana / ma hope o ka CMPnā hana osilikaa mesilicon carbide (SiC)nā wafers. Kūkulu ʻia a puninā mea lawe keramika (nā papa keramika), hoʻohui ka ʻōnaehana i nā hana he nui ma hope i hoʻokahi laina i hoʻonohonoho ʻia—e kōkua ana i nā fabs e hōʻemi i ka lawelawe lima ʻana, hoʻopaʻa i ka manawa lawe, a hoʻoikaika i ka kaohi haumia.

 


Nā hiʻohiʻona

Kiʻikuhi kikoʻī

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Laina Hana Pololei ʻEhā Pae i Hoʻopili ʻia no ka Wafer Silicon / Silicon Carbide (SiC) (Laina Hana Pololei Hoʻohui ʻia)4

ʻIke laulā

ʻO kēia Four-Stage Linked Polishing Automation Line he hopena i hoʻohui ʻia, in-line i hoʻolālā ʻia noma hope o ka hoʻomaʻemaʻe ʻana / ma hope o ka CMPnā hana osilikaa mesilicon carbide (SiC)nā wafers. Kūkulu ʻia a puninā mea lawe keramika (nā papa keramika), hoʻohui ka ʻōnaehana i nā hana he nui ma hope i hoʻokahi laina i hoʻonohonoho ʻia—e kōkua ana i nā fabs e hōʻemi i ka lawelawe lima ʻana, hoʻopaʻa i ka manawa lawe, a hoʻoikaika i ka kaohi haumia.

 

I ka hana ʻana o ka semiconductor,ka hoʻomaʻemaʻe maikaʻi ma hope o CMPua ʻike nui ʻia he hana koʻikoʻi e hōʻemi i nā hemahema ma mua o ke kaʻina hana aʻe, a me nā ʻano holomua (mehoʻomaʻemaʻe megasonic) ua kūkākūkā pinepine ʻia no ka hoʻomaikaʻi ʻana i ka hana wehe ʻāpana.

 

No SiC ma ke ʻano kūikawā, ʻo iapaʻakikī kiʻekiʻe a me ka inertness kemikahoʻolilo i ka paʻakikī o ka hoʻopili ʻana (e pili pinepine ana me ka haʻahaʻa o ka wehe ʻana i nā mea a me ka nui o ka pilikia o ka hōʻino ʻana o ka ʻili/lalo o ka ʻili), ka mea e lilo ai ka automation paʻa ma hope o ka polish a me ka hoʻomaʻemaʻe/lawelawe ʻana i kāohi ʻia he mea waiwai nui.

Nā Pōmaikaʻi Koʻikoʻi

He laina hoʻohui hoʻokahi e kākoʻo ana i:

  • Ka hoʻokaʻawale ʻana a me ka hōʻiliʻili ʻana o ka wafer(ma hope o ka wili ʻana)

  • Ka pale ʻana / ka mālama ʻana i ka mea lawe seramika

  • Ka hoʻomaʻemaʻe ʻana i ka mea lawe keramika

  • Ke kau ʻana o ka wafer (hoʻopili ʻana) ma luna o nā mea lawe keramika

  • Hana hoʻohui ʻia, hoʻokahi laina nonā wafers 6–8 ʻīniha

Nā Kikoʻī ʻenehana (Mai ka Pepa ʻIkepili i Hāʻawi ʻia)

  • Nā Ana o nā Lako (L × W × H):13643 × 5030 × 2300 mm

  • Lako ikehu:AC 380 V, 50 Hz

  • Mana Holoʻokoʻa:119 kW

  • Ka Hoʻomaʻemaʻe ʻana o ke Kau ʻana:0.5 μm < 50 kēlā me kēia; 5 μm < 1 kēlā me kēia

  • Ka Palahalaha o ke Kau ʻana:≤ 2 μm

Kuhikuhi Throughput (Mai ka Pepa ʻIkepili i Hāʻawi ʻia)

  • Nā Ana o nā Lako (L × W × H):13643 × 5030 × 2300 mm

  • Lako ikehu:AC 380 V, 50 Hz

  • Mana Holoʻokoʻa:119 kW

  • Ka Hoʻomaʻemaʻe ʻana o ke Kau ʻana:0.5 μm < 50 kēlā me kēia; 5 μm < 1 kēlā me kēia

  • Ka Palahalaha o ke Kau ʻana:≤ 2 μm

Kahe Laina Maʻamau

  1. Hoʻokomo / pilina mai ka ʻāpana poli ʻana i uka

  2. Ka hoʻokaʻawale ʻana a me ka hōʻiliʻili ʻana o ka wafer

  3. Ka pale ʻana/mālama ʻana i ka mea lawe seramika (ka hoʻokaʻawale ʻana i ka manawa takt)

  4. Ka hoʻomaʻemaʻe ʻana i ka mea lawe keramika

  5. Ke kau ʻana o ka wafer ma luna o nā mea lawe (me ka hoʻomaʻemaʻe a me ka hoʻomalu ʻana i ka palahalaha)

  6. Hoʻopuka i ke kaʻina hana a i ʻole ka logistics ma hope

Nā nīnau i nīnau pinepine ʻia

Q1: He aha nā pilikia e hoʻoponopono nui ʻia e kēia laina?
A: Hoʻomaʻamaʻa ia i nā hana ma hope o ka polish ma o ka hoʻohui ʻana i ka hoʻokaʻawale/hōʻiliʻili wafer, ka buffering carrier ceramic, ka hoʻomaʻemaʻe ʻana i ka carrier, a me ke kau ʻana o ka wafer i hoʻokahi laina automation i hoʻonohonoho ʻia—e hōʻemi ana i nā kiko pā lima a me ka hoʻopaʻa ʻana i ke ʻano hana.

 

Q2: He aha nā mea wafer a me nā nui i kākoʻo ʻia?
A:ʻO Silika a me SiC,6–8 ʻīnihanā wafers (e like me ke kikoʻī i hāʻawi ʻia).

 

Q3: No ke aha i hoʻokūpaʻa ʻia ai ka hoʻomaʻemaʻe ma hope o ka CMP ma ka ʻoihana?
A: Hōʻike nā palapala ʻoihana ua ulu ka noi no ka hoʻomaʻemaʻe maikaʻi ma hope o ka CMP e hōʻemi i ka nui o nā kīnā ma mua o ka hana aʻe; ua aʻo pinepine ʻia nā ʻano hana megasonic no ka hoʻomaikaʻi ʻana i ka wehe ʻana i nā ʻāpana.

E pili ana iā mākou

He loea ʻo XKH i ka hoʻomohala ʻenehana kiʻekiʻe, ka hana ʻana, a me ke kūʻai aku ʻana i ke aniani optical kūikawā a me nā mea kristal hou. Lawelawe kā mākou huahana i nā mea uila optical, nā mea uila mea kūʻai aku, a me ka pūʻali koa. Hāʻawi mākou i nā ʻāpana optical Sapphire, nā uhi lens kelepona paʻalima, Ceramics, LT, Silicon Carbide SIC, Quartz, a me nā wafers kristal semiconductor. Me ka ʻike loea a me nā lako hana kiʻekiʻe, ʻoi aku mākou i ka hana ʻana i nā huahana maʻamau ʻole, me ka manaʻo e lilo i alakaʻi i nā mea optoelectronic ʻoihana ʻenehana kiʻekiʻe.

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