4inihi 6inihi 8 ʻīniha SiC Crystal Growth Furnace for CVD Process
Kumu Hana
ʻO ke kumu kumu o kā mākou ʻōnaehana CVD e pili ana i ka hoʻoheheʻe wela o ka silicon-containing (eg, SiH4) a me ka carbon-containing (eg, C3H8) precursor gases ma nā wela kiʻekiʻe (maʻamau 1500-2000 ° C), e waiho ana i nā kristal hoʻokahi SiC ma nā substrates ma o nā hopena kemika. He kūpono loa kēia ʻenehana no ka hana ʻana i ka maʻemaʻe kiʻekiʻe (> 99.9995%) 4H/6H-SiC hoʻokahi kristal me ka haʻahaʻa haʻahaʻa haʻahaʻa (<1000/cm²), e hoʻokō ana i nā koi koi pono no ka uila uila a me nā polokalamu RF. Ma o ka mana pololei o ka haku kinoea, kahe kahe a me ka mahana gradient, hiki i ka ʻōnaehana ke hoʻoponopono pololei i ke ʻano conductivity crystal (N/P type) a me ka resistivity.
Nā ʻano ʻōnaehana a me nā ʻāpana ʻenehana
ʻAno Pūnaehana | Kaulana Mahana | Nā mea nui | Nā noi |
CVD Kūlana Kiʻekiʻe | 1500-2300°C | ʻO ka hoʻomehana ʻana o ka graphite, ± 5 ° C ka like ʻana o ka mahana | ʻO ka ulu ʻana o ka kristal SiC nui |
CVD-Filament wela | 800-1400°C | ʻO ka hoʻomehana filament Tungsten, 10-50μm / h deposition rate | Epitaxy mānoanoa SiC |
VPE CVD | 1200-1800°C | ʻO ka mana wela o nā ʻāpana he nui,> 80% hoʻohana kinoea | Hana nui ʻia epi-wafer |
PECVD | 400-800°C | Hoʻonui ʻia ka plasma, 1-10μm/h deposition rate | Nā kiʻiʻoniʻoni lahilahi SiC haʻahaʻa |
Nā ʻano ʻenehana nui
1. Pūnaehana Kūlana Kūlana Kiʻekiʻe
Hōʻike ka umu ahi i kahi ʻōnaehana hoʻomehana resistive multi-zone e hiki ke mālama i nā mahana a hiki i 2300 ° C me ± 1 ° C like ʻole ma waena o ke keʻena ulu holoʻokoʻa. Hoʻokō ʻia kēia hoʻokele thermal precision ma o:
12 mau wahi hoʻomehana kūʻokoʻa.
ʻO ka nānā ʻana i ka thermocouple ʻē aʻe (Type C W-Re).
ʻO nā algorithms hoʻoponopono hoʻoponopono wela i ka manawa maoli.
ʻO nā paia keʻena hoʻoluʻu wai no ka hoʻomalu gradient thermal.
2. Hoʻouna kinoea a hui ʻenehana
ʻO kā mākou ʻōnaehana hoʻoili kinoea waiwai e hōʻoia i ka hui ʻana o ka precursor maikaʻi loa a me ka hāʻawi like ʻana:
Nā mea hoʻoponopono kahe nui me ± 0.05sccm pololei.
ʻĀpana hoʻoheheʻe kinoea nui.
Ka nānā 'ana i ke kinoea kinoea (FTIR spectroscopy).
Ka uku hoʻokahe ʻakomi i ka wā ulu.
3. Hoʻonui maikaʻi Crystal
Hoʻokomo ka ʻōnaehana i nā mea hou e hoʻomaikaʻi ai i ka maikaʻi kristal:
ʻO ka mea paʻa pani pani (0-100rpm programmable).
ʻenehana hoʻomalu pae palena kiʻekiʻe.
Pūnaehana kiaʻi defect in-situ (UV laser scattering).
ʻOkoʻa koʻikoʻi uku i ka wā ulu.
4. Ka 'Omomi a me ka Mana
Ka hoʻokō ʻana i ka meaʻai.
ʻO AI ka hoʻonui ʻana i ka hoʻonui ʻana i ka manawa maoli.
Ka nānā mamao a me ka diagnostics.
ʻO 1000+ ka hoʻopaʻa inoa ʻana i ka ʻikepili (mālama ʻia no 5 mau makahiki).
5. Nā hiʻohiʻona palekana a me ka hilinaʻi
ʻO ka pale ʻana i ka wela ma luna o ka wela ʻekolu.
Pūnaehana hoʻomaʻemaʻe ulia pōpilikia.
Hoʻolālā hale i helu ʻia e ka Seismic.
98.5% ka hōʻoia ʻana i ka wā hoʻomaha.
6. Hoʻolālā hiki ke hoʻonui ʻia
Hiki i ka hoʻolālā modular ke hoʻonui i ka hiki.
Kūpono me ka nui wafer 100mm a 200mm.
Kākoʻo i nā hoʻonohonoho kūpaʻa a me ke ākea.
Hoʻololi wikiwiki i nā ʻāpana no ka mālama ʻana.
7. Hoʻoikaika ikaika
30% haʻahaʻa haʻahaʻa ma mua o nā ʻōnaehana like.
Hoʻopaʻa ka ʻōnaehana hoʻōla wela i ka 60% o ka wela wela.
ʻO nā algorithms hoʻohana kinoea maikaʻi loa.
Nā koi o ka hale e hoʻokō i ka LEED.
8. Maikaʻi Versatility
Hoʻoulu i nā polytype SiC nui (4H, 6H, 3C).
Kākoʻo i nā ʻano conductive a me semi-insulating.
Hoʻokomo i nā ʻano hana doping like ʻole (N-type, P-type).
Kūpono me nā mea mua ʻē aʻe (e laʻa, TMS, TES).
9. Hoʻokō ʻana o ka ʻōnaehana vacuum
Pumi kumu: <1×10⁻⁶ Torr
Laki leak: <1×10⁻⁹ Torr·L/sec
ʻO ka māmā holo ʻana: 5000L/s (no SiH₄)
Ka hoʻomalu ʻana i ke kaomi ʻakomi i ka wā ulu
Hōʻike kēia kikoʻī ʻenehana piha i ka hiki o kā mākou ʻōnaehana hana i ka noiʻi a me ka hana ʻana i nā kristal SiC maikaʻi loa me ka ʻoihana alakaʻi kūlike a me ka hua. ʻO ka hui pū ʻana o ka mana pololei, ka nānā ʻana i mua, a me ka ʻenekinia ikaika e hana i kēia ʻōnaehana CVD i koho maikaʻi loa no ka R&D a me nā noi hana volume i nā uila uila, nā mea RF, a me nā noi semiconductor holomua.
Nā Pōmaikaʻi Nui
1. Hoʻonui Kiʻekiʻe Crystal
• ʻAʻohe haʻahaʻa haʻahaʻa ma lalo o <1000/cm² (4H-SiC)
• Kaulike doping <5% (6-inihi wafers)
• Ka maʻemaʻe kristal >99.9995%
2. Large-Size Production hiki
• Kākoʻo i ka ulu ʻana o ka wafer 8 iniha
• Kaulike anawaena >99%
• ʻokoʻa mānoanoa <±2%
3. Ka Mana Mana Pono
• Ka hoʻomalu ʻana o ka wela ± 1°C
• Ka pololei o ke kahe o ke kinoea ± 0.1sccm
• Ka pololei o ka mana kaomi ±0.1Torr
4. Hoʻoikaika ikaika
• 30% ʻoi aku ka maikaʻi o ka ikehu ma mua o nā ʻano hana maʻamau
• Ka ulu ulu a hiki i 50-200μm / h
• ka manawa hana o ka lako >95%
Nā noi nui
1. Nā Mana uila uila
6-inch 4H-SiC substrates no 1200V+ MOSFETs/diodes, e hōʻemi ana i nā poho hoʻololi e 50%.
2. 5G Kūkākūkā
Semi-insulating SiC substrates (resistivity >10⁸Ω·cm) no ke kahua kahua PA, me ka hookomo poho <0.3dB ma >10GHz.
3. Nā Kaʻa Hulihu Hou
Hoʻonui ka mana o ka mana ʻo Automotive-grade SiC i ka laulā EV e 5-8% a hoʻemi i ka manawa hoʻopiʻi e 30%.
4. PV Inverters
Hoʻonui nā substrates haʻahaʻa haʻahaʻa i ka hoʻololi ʻana ma mua o 99% ʻoiai e hōʻemi ana i ka nui o ka ʻōnaehana e 40%.
Nā lawelawe a XKH
1. Nā lawelawe hoʻoponopono
Hana ʻia nā ʻōnaehana CVD 4-8 iniha.
Kākoʻo i ka ulu ʻana o ke ʻano 4H / 6H-N, 4H / 6H-SEMI insulating type, etc.
2. Kākoʻo ʻenehana
ʻO ka hoʻomaʻamaʻa piha ʻana i ka hana a me ke kaʻina hana.
24/7 pane ʻenehana.
3. Hoʻoponopono Turnkey
Nā lawelawe hope-a-hope mai ka hoʻokomo ʻana i ka hōʻoia ʻana.
4. Mea lako
2-12 iniha SiC substrates/epi-wafers loaʻa.
Kākoʻo 4H/6H/3C polytypes.
Loaʻa nā mea hoʻokaʻawale nui:
A hiki i ka 8-iniha ka hiki ke ulu kristal.
20% ʻoi aku ka wikiwiki o ka ulu ʻana ma mua o ka awelika ʻoihana.
98% hilinaʻi pūnaewele.
Pūnaehana hoʻomalu naʻauao piha.

