Papa hoʻāʻo ʻo 4'īniha Silicon wafer FZ CZ N-Type DSP a i ʻole SSP

4'īniha Silicon wafer FZ CZ N-Type DSP a i ʻole SSP Test grade Kiʻi i hōʻike ʻia

Wehewehe Pōkole:

He pepa lahilahi ka wafer silicon i ʻoki ʻia mai ka silicon kristal hoʻokahi. Loaʻa nā wafers silicon i nā anawaena 2-ʻīniha, 3-ʻīniha, 4-ʻīniha, 6-ʻīniha, a me 8-ʻīniha, a hoʻohana nui ʻia e hana i nā kaapuni i hoʻohui ʻia. ʻO nā wafers silicon wale nō ka mea maka a ʻo nā ʻāpana ka huahana i hoʻopau ʻia. He mea nui nā wafers silicon no ka hana ʻana i nā kaapuni i hoʻohui ʻia, a hiki ke hana ʻia nā mea semiconductor like ʻole ma o ke ʻano o ka photolithography a me ka ion implantation ma nā wafers silicon.

E leka uila mai iā mākou

Nā hiʻohiʻona

Hoʻolauna i ka pahu wafer

He ʻāpana koʻikoʻi nā wafers Silicon o ka ʻoihana ʻenehana e ulu nei i kēia lā. Pono ka mākeke mea semiconductor i nā wafers silicon me nā kikoʻī kikoʻī e hana i kahi nui o nā mea hana kaapuni hoʻohui hou. Hoʻomaopopo mākou i ka piʻi ʻana o ke kumukūʻai o ka hana ʻana o ka semiconductor, pēlā nō hoʻi ke kumukūʻai o kēlā mau mea hana, e like me nā wafers silicon. Hoʻomaopopo mākou i ke koʻikoʻi o ka maikaʻi a me ka pono o ke kumukūʻai i nā huahana a mākou e hāʻawi ai i kā mākou mea kūʻai aku. Hāʻawi mākou i nā wafers i kūpono ke kumukūʻai a me ke ʻano kūlike. Hana nui mākou i nā wafers silicon a me nā ingots (CZ), nā wafers epitaxial, a me nā wafers SOI.

Anawaena	Anawaena	Hoʻopololei ʻia	Hoʻohui ʻia	Hoʻonohonoho	Ke kū'ē'ē / Ω.cm	Mānoanoa/um
2'īniha	50.8±0.5mm	SSP DSP	P/N	100	1-20	200-500
3'īniha	76.2±0.5mm	SSP DSP	P/B	100	NA	525±20
4 ʻīniha	101.6±0.2 101.6±0.3 101.6±0.4	SSP DSP	P/N	100	0.001-10	200-2000
6 ʻīniha	152.5±0.3	SSPDSP	P/N	100	1-10	500-650
8 ʻīniha	200±0.3	DSPSSP	P/N	100	0.1-20	625

Ka hoʻohana ʻana o nā wafers silicon

Pākuʻi: Uhi PECVD/LPCVD, magnetron sputtering

Substrate: XRD, SEM, spectroscopy infrared atomic force, microscopy electron transmission, spectroscopy fluorescence a me nā hoʻokolohua analytical ʻē aʻe, ka ulu ʻana o ka epitaxial beam molecular, ka nānā ʻana o X-ray o ka hana microstructure crystal: etching, bonding, nā mea MEMS, nā mea mana, nā mea MOS a me nā hana ʻē aʻe.

Mai ka makahiki 2010, ua kūpaʻa ʻo Shanghai XKH Material Tech. Co., Ltd i ka hāʻawi ʻana i nā mea kūʻai aku me nā hoʻonā piha o ka wafer Silicon Wafer 4-'īniha, mai nā wafers pae debugging Dummy Wafer, nā wafers pae hoʻāʻo Test Wafer, a i nā wafers pae huahana Prime Wafer, a me nā wafers kūikawā, nā wafers Oxide Oxide, nā wafers Nitride Si3N4, nā wafers Aluminium plated, nā wafers silicon plated keleawe, SOI Wafer, MEMS Glass, nā wafers ultra-thick a me ultra-flat i hana ʻia, a pēlā aku, me nā nui mai 50mm-300mm, a hiki iā mākou ke hāʻawi i nā wafers semiconductor me ka polishing ʻaoʻao hoʻokahi/ʻaoʻao pālua, thinning, dicing, MEMS a me nā lawelawe hana a me ka hoʻopilikino ʻē aʻe.