4 iniha Silicon wafer FZ CZ N-Type DSP a i ʻole SSP hōʻike papa

4 iniha Silicon wafer FZ CZ N-Type DSP a i ʻole SSP Hōʻike kiʻi kiʻi i hōʻike ʻia

ʻO ka wehewehe pōkole:

ʻO ka wafer silika he ʻāpana lahilahi i ʻoki ʻia mai ka silika aniani hoʻokahi. Loaʻa nā wafers silikon ma 2-ʻīniha, 3-ʻīniha, 4-ʻīniha, 6-ʻīniha, a me 8-ʻīniha anawaena, a hoʻohana nui ʻia no ka hana ʻana i nā kaapuni hoʻohui. ʻO nā wafers silikon wale nō ka mea maka a ʻo nā chips ka huahana i hoʻopau ʻia. He mau mea ko'iko'i nā wafer silikoni no ka hana 'ana i nā kaapuni i ho'ohui 'ia, a hiki ke hana 'ia nā mea semiconductor like 'ole ma o ka photolithography a me ka ho'okomo 'ana i ka ion ma nā wafer silika.

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

Hoʻolauna i ka pahu wafer

ʻO nā wafers silikon he ʻāpana koʻikoʻi o ka ʻenehana e ulu nei i kēia lā. Pono ka mākeke waiwai semiconductor i nā wafers silicon me nā kikoʻī kikoʻī e hana i kahi helu nui o nā mea hoʻohui hou. Hoʻomaopopo mākou i ka piʻi ʻana o ke kumukūʻai o ka hana semiconductor, pēlā pū ke kumukūʻai o kēlā mau mea hana, e like me nā wafer silika. Hoʻomaopopo mākou i ke koʻikoʻi o ka maikaʻi a me ke kumukūʻai i nā huahana a mākou e hāʻawi ai i kā mākou mea kūʻai. Hāʻawi mākou i nā wafers i kūpono ke kumu kūʻai a me ka maikaʻi kūlike. Hana nui mākou i nā wafers silicon a me nā ingots (CZ), nā wafers epitaxial, a me nā wafers SOI.

Anawaena	Anawaena	Hoʻomaʻamaʻa ʻia	Doped	Kūlana	Kū'ē/Ω.cm	Mānoanoa/um
2 iniha	50.8±0.5mm	SSP DSP	P/N	100	1-20	200-500
3 iniha	76.2±0.5mm	SSP DSP	P/B	100	NA	525±20
4 iniha	101.6±0.2 101.6±0.3 101.6±0.4	SSP DSP	P/N	100	0.001-10	200-2000
6 iniha	152.5±0.3	SSPDSP	P/N	100	1-10	500-650
8 iniha	200±0.3	DSPSSP	P/N	100	0.1-20	625

ʻO ka hoʻohana ʻana i nā wafer silika

Lapaʻa: PECVD/LPCVD uhi, magnetron sputtering

Substrate: XRD, SEM, atomic force infrared spectroscopy, transmission electron microscopy, fluorescence spectroscopy a me nā hoʻokolohua ʻē aʻe, molecular beam epitaxial growth, X-ray analysis of crystal microstructure processing: etching, bonding, MEMS device, power devices, MOS devices and other hana ʻana

Mai ka makahiki 2010, Shanghai XKH Material Tech. Ua kūpaʻa ʻo Co., Ltd i ka hāʻawi ʻana i nā mea kūʻai aku i nā ʻāpana wafer 4-inch wafer Silicon Wafer, mai ka debugging level wafers Dummy Wafer, test level wafers Test Wafer, i ka pae huahana wafers Prime Wafer, a me nā wafers kūikawā, Oxide wafers Oxide, Nitride wafers Si3N4, Aluminum plated wafers, Copper plated silicon wafers, SOI Wafer, MEMS Glass, customized ultra-thick and ultra-flat wafers, etc., me ka nui mai ka 50mm-300mm, a hiki iā mākou ke hāʻawi i nā wafers semiconductor me ka ʻaoʻao hoʻokahi. / ʻaoʻao ʻelua polishing, thinning, dicing, MEMS a me nā lawelawe hana a me nā lawelawe maʻamau.