6 iniha N-Type a i ʻole P-type Silicon wafer CZ Si wafer

6inihi N-Type a i ʻole P-type Silicon wafer CZ Si wafer Kiʻi Hōʻike ʻia

ʻO ka wehewehe pōkole:

ʻO 6-inch silicon wafers he mea maʻamau maʻamau substrate silika i hoʻohana nui ʻia i ka hana ʻana i nā kaʻa i hoʻohui ʻia. Hoʻomaʻemaʻe ʻia a hoʻomaʻemaʻe ʻia kēia mau wafers e hana i nā ʻano like ʻole o nā kaapuni i hoʻohui ʻia, me nā microprocessors, nā ʻāpana hoʻomanaʻo, nā mea ʻike, a me nā mea uila ʻē aʻe. ʻO nā mea maikaʻi o nā wafers silika 6-inch ko lākou ʻāpana ākea nui, ka conductivity thermal maikaʻi, a me ke kumu kūʻai haʻahaʻa. ʻO kēia mau hiʻohiʻona e hana i nā wafer silika 6-inch kekahi o nā koho kūpono no ka hana kaapuni hoʻohui.

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

Hoʻolauna i ka pahu wafer

ʻO nā kikoʻī o ka wafer Silicon:

6 iniha Silicon wafer Ulu: CZ, MCZ, FZ.

6 Silicon wafer Grade: Prime, Test, Dummy, etc

6 iniha Silicon wafer anawaena: 6 iniha/150mm.

6 iniha Silicon wafer mānoanoa: 200 ~ 3000um.

6 iniha Silicon wafer Hoʻopau: E like me ka ʻoki ʻia, lapped, etched, SSP, DSP, etc.

6 iniha Silicon wafer Orientation: (100) (111) (110) (531)(553) etc.

6 ʻīniha Silicon wafer ʻoki ʻia: a hiki i 4deg.

6 iniha Silicon wafer Type/Dopant: P/B, N/Phos, N/As, N/Sb, Intrinsic.

6inch Silicon wafer Resistivity: CZ/MCZ: Mai 0.001 a i 1000 ohm-cm. FZ: a hiki i 20k ohm-cm.

6inch Silicon wafer Nā kiʻiʻoniʻoni lahilahi: (a)PVD: Al, Cu, Au, Cr, Si, Ni;, Fe, Mo.

(b)LPCVD/PECVD: Oxide, Nitride, siC, etc. ʻO ka mānoanoa o ka uhi a hiki i 200.000A/3%.

6 iniha Silicon wafer Kaʻina hana: a.DSP, ultra thin, ultra flat, etc.

b. Hoʻohaʻahaʻa, wili hope, dicing，etc.c. MEMS.

Mai ka makahiki 2010, Shanghai XKH Material Tech. Ua kūpaʻa ʻo Co., Ltd i ka hāʻawi ʻana i nā mea kūʻai aku i nā ʻāpana wafer 4-inch wafer Silicon Wafer, mai ka debugging level wafers Dummy Wafer, test level wafers Test Wafer, i ka pae huahana wafers Prime Wafer, a me nā wafers kūikawā, Oxide wafers Oxide, Nitride wafers Si3N4, Aluminum plated wafers, Copper plated silicon wafers, SOI Wafer, MEMS Glass, customized ultra-thick and ultra-flat wafers, etc., me ka nui mai ka 50mm-300mm, a hiki iā mākou ke hāʻawi i nā wafers semiconductor me ka ʻaoʻao hoʻokahi. / ʻaoʻao ʻelua polishing, thinning, dicing, MEMS a me nā lawelawe hana a me nā lawelawe maʻamau.