Aluminum metala hoʻokahi kristal substrate i poni ʻia a hana ʻia i nā ana no ka hana kaapuni hoʻohui
Hōʻike
ʻO kēia nā hiʻohiʻona o ka substrate kristal hoʻokahi alumini:
Hana maikaʻi loa: hiki ke ʻoki ʻia ka substrate kristal hoʻokahi alumini, hoʻoliʻi ʻia, etched a me nā hana ʻē aʻe e hana i ka nui a me ke ʻano o ka wafer.
Maikaʻi thermal conductivity: Aluminum loaʻa maikaʻi thermal conductivity, i conducive i ka wela dissipation o ka mea ma luna o ka substrate.
Ka pale ʻana i ka corrosion: Loaʻa i ka substrate alumini ke kū i ka corrosion kemika a hiki ke hoʻokō i nā koi o ke kaʻina hana semiconductor.
ʻO ke kumu kūʻai haʻahaʻa: ʻO ka alumini ma ke ʻano he mea metala maʻamau, ʻoi aku ka haʻahaʻa o nā mea maka a me nā kumukūʻai hana, kahi kūpono e hōʻemi i nā kumukūʻai hana wafer.
Nā noi o ka alumini metala hoʻokahi pahu aniani.
1.Optoelectronic mea hana: Aluminum substrate he mau noi koʻikoʻi i ka hana ʻana i nā mea optoelectronic e like me LED, laser diode a me photodetector.
2.Compound semiconductor: Ma waho aʻe o ka hoʻohana ʻana i nā substrates silicon, hoʻohana pū ʻia nā substrate alumini i ka hana ʻana i nā mea hana semiconductor compound e like me GaAs a me InP.
3.Electromagnetic shielding: Aluminum ma ke ʻano he mea pale electromagnetic maikaʻi, hiki ke hoʻohana ʻia ka substrate alumini no ka hana ʻana i nā uhi pale electromagnetic, nā pahu pale a me nā huahana ʻē aʻe.
4.Electronic packaging: Hoʻohana nui ʻia ka substrate Aluminum i ka mīkini semiconductor mea hoʻopili, ma ke ʻano he substrate a alakaʻi paha.
Loaʻa i kā mākou hale hana nā lako hana kiʻekiʻe a me ka hui ʻenehana, hiki iā mākou ke hāʻawi i ka Aluminum Single crystal substrate hiki ke hoʻopili ʻia e like me nā koi kikoʻī o ka mea kūʻai aku o nā kikoʻī like ʻole, ka mānoanoa, ke ʻano o ka substrate Aluminum. Welina nīnau!