ʻO ka wafer i uhi ʻia, ka wafer saphire, ka wafer silikon, ka wafer SiC, 2inch 4inch 6inch, ka mānoanoa i uhi ʻia gula 10nm 50nm 100nm
Nā mea nui
| Hiʻona | wehewehe |
| Nā mea lepo | Silika (Si), Sapphire (Al₂O₃), Silicon Carbide (SiC) |
| Ka manoanoa o ka uhi gula | 10nm, 50nm, 100nm, 500nm |
| Maemae Gula | 99.999%maʻemaʻe no ka hana maikaʻi loa |
| Kiʻiʻoniʻoni Adhesion | Chromium (Cr), 99.98% maʻemaʻe, e hōʻoia ana i ka pili ikaika |
| ʻAole ʻili | He mau nm (ka maikaʻi o ka ʻili maʻemaʻe no nā noi pololei) |
| Kū'ē (Si Wafer) | 1-30 Ohm/cm(ma muli o ke ʻano) |
| Nui Wafer | 2-iniha, 4-iniha, 6-iniha, a me nā nui maʻamau |
| Mānoanoa (Si Wafer) | 275µm, 381µm, 525µm |
| TTV (Hoʻololi Mānoanoa Hui Pū ʻIa) | ≤20µm |
| Pāpā mua (Si Wafer) | 15.9 ± 1.65mmi32.5 ± 2.5mm |
No ke aha he mea nui ka uhi gula ma ka ʻoihana Semiconductor
Hoʻolima Uila
ʻO ke gula kekahi o nā mea maikaʻi loa nohoʻoheheʻe uila. Hāʻawi nā wafers i uhi ʻia i ke gula i nā ala haʻahaʻa haʻahaʻa, he mea nui ia no nā mea semiconductor e koi ana i nā pilina uila wikiwiki a paʻa. ʻO kamaʻemaʻe kiʻekiʻeʻO ke gula e hōʻoia i ka conductivity maikaʻi, e hōʻemi ana i ka nalowale o ka hōʻailona.
Pale ʻino
ʻO ke gulamea ʻino ʻolea kūpaʻa loa i ka oxidation. He mea maikaʻi kēia no nā noi semiconductor e hana ana i nā wahi paʻakikī a i ʻole e pili ana i nā mahana kiʻekiʻe, ka makū, a i ʻole nā ʻano corrosive ʻē aʻe. E mālama ka wafer i uhi ʻia i ke gula i kona mau waiwai uila a me ka hilinaʻi i ka manawa, e hāʻawi ana i kahiola lōʻihino na mea hana e hoohana ia ai.
Hooponopono wela
Na gulamaikaʻi loa thermal conductivityhōʻoia i ka wela i hana ʻia i ka wā o ka hana ʻana o nā mea semiconductor e hoʻopau maikaʻi ʻia. He mea koʻikoʻi kēia no nā noi mana kiʻekiʻe e like meNā LED, uila uila, anā mea hana optoelectronic, kahi e hiki ai i ka wela ke alakaʻi i ka hemahema o ka mīkini inā ʻaʻole mālama pono ʻia.
Paʻa Mechanical
Hāʻawi nā uhi gulapale mechanicali ka wafer, e pale ana i ka poino o ka ili ma ka lawelawe ana a me ka hana ana. ʻO kēia ʻāpana o ka pale i hoʻohui ʻia e hōʻoia i ka mālama ʻana o nā wafers i ko lākou kūpaʻa a me ka hilinaʻi, ʻoiai i nā kūlana koi.
Nā hiʻohiʻona ma hope o ka uhi ʻana
Hoʻonui ʻia ka maikaʻi o ka ʻili
Hoʻomaikaʻi ka uhi gula i kapahee ilio ka wafer, he mea nui nokiʻekiʻe-pololeinā noi. ʻO kaʻeleʻele ʻiliua hoʻemi ʻia i nā nanometer, e hōʻoia ana i kahi ʻili kīnā ʻole kūpono no nā kaʻina hana e like mehoʻopaʻa uea, kūʻai ʻana, aphotolithography.
Hoʻomaikaʻi i ka hoʻopaʻa ʻana a me nā waiwai kūʻai
Hoʻonui ka papa gula i kawaiwai pilio ka wafer, i kupono nohoʻopaʻa ueaaka hoʻopaʻa ʻana i ka flip-chip. Loaʻa kēia i nā pilina uila paʻa a lōʻihi i lokoIC pūʻoloanā hui semiconductor.
ʻAʻohe ʻino a lōʻihi
ʻO ka uhi gula e hōʻoiaʻiʻo e noho kaʻawale ka wafer mai ka oxidation a me ka hoʻohaʻahaʻa ʻana, ʻoiai ma hope o ka loaʻa ʻana o nā kūlana kūlohelohe koʻikoʻi. Hāʻawi kēia i kakūpaʻa lōʻihio ka mea hana semiconductor hope loa.
Paʻa wela a me ka uila
Hāʻawi like nā wafers i uhi ʻia i ke gulahoʻoheheʻe welaauila uila, e alakaʻi ana i ka hana maikaʻi a me kahilinaʻio nā mea hana i ka manawa, ʻoiai i nā mahana wela loa.
Nā ʻāpana
| Waiwai | Waiwai |
| Nā mea lepo | Silika (Si), Sapphire (Al₂O₃), Silicon Carbide (SiC) |
| Mānoanoa Papa Gula | 10nm, 50nm, 100nm, 500nm |
| Maemae Gula | 99.999%(ka maʻemaʻe kiʻekiʻe no ka hana maikaʻi loa) |
| Kiʻiʻoniʻoni Adhesion | Chromium (Cr),99.98%ka maemae |
| ʻAole ʻili | Nui nā nanometer |
| Kū'ē (Si Wafer) | 1-30 Ohm/cm |
| Nui Wafer | 2-iniha, 4-iniha, 6-iniha, nā nui maʻamau |
| ʻO ka Mānoanoa Wafer | 275µm, 381µm, 525µm |
| TTV | ≤20µm |
| Pāpā mua (Si Wafer) | 15.9 ± 1.65mmi32.5 ± 2.5mm |
Noi o na Wafera i uhiia i ke gula
Hoʻopili Semiconductor
Hoʻohana nui ʻia nā wafers i uhi ʻia i ke gula maIC pūʻolo, kahi i ko lakouuila uila, ka lōʻihi mechanical, ahoʻoheheʻe welanā waiwai e hōʻoia i ka hilinaʻipiliahoʻopaʻa ʻanai nā mea semiconductor.
LED Hanahana
He kuleana koʻikoʻi nā wafers i uhi ʻia i ke gulaLED hana, kahi e hoʻonui aihooponopono welaahana uila. ʻO ka papa gula e hōʻoia i ka wela i hana ʻia e nā LED mana kiʻekiʻe e hoʻopau maikaʻi ʻia, e hāʻawi ana i ka lōʻihi o ke ola a ʻoi aku ka maikaʻi.
Nā Mea Optoelectronic
In optoelectronics, Hoʻohana ʻia nā wafers i uhi ʻia i ke gula i nā mea likenā mea nānā kiʻi, nā diodes laser, anā mea ʻike māmā. Hāʻawi maikaʻi ka uhi gulaka hoʻoheheʻe welaapaʻa uila, e hōʻoia ana i ka hana maʻamau i nā mea e pono ai ka mana pololei o nā kukui a me nā hōʻailona uila.
Mea uila uila
Pono nā wafers i uhi ʻia i ke gula nomana uila, kahi mea koʻikoʻi ka hana kiʻekiʻe a me ka hilinaʻi. Hoʻopaʻa paʻa kēia mau wafershoohuli manaahoopau welai nā mea hana e like menā transistors manaanā mea hoʻoponopono uila.
Microelectronics a me MEMS
In microelectronicsaMEMS (Nūnaehana Micro-Electromechanical), hoʻohana ʻia nā wafers i uhi ʻia i ke gula e hanaʻāpana microelectromechanicale koi ana i ka pololei kiʻekiʻe a me ka lōʻihi. Hāʻawi ka papa gula i ka hana uila paʻa apale mechanicali nā mea microelectronic koʻikoʻi.
Nīnau pinepine (Q&A)
Q1: No ke aha e hoʻohana ai i ke gula no ka uhi ʻana i nā wafers?
A1:Hoʻohana ʻia ke gula no kānaʻoi aku ka maikaʻi o ka uila, pale ʻino, ahooponopono welawaiwai. Hōʻoiaʻiʻo iapili pono, lōʻihi ke ola o ka mea hana, ahana maui nā noi semiconductor.
Q2: He aha nā pōmaikaʻi o ka hoʻohana ʻana i nā wafers i uhi ʻia i ke gula i nā noi semiconductor?
A2:Hāʻawi nā wafers uhi gulahilinaʻi kiʻekiʻe, kūpaʻa lōʻihi, aʻoi aku ka maikaʻi o ka uila a me ka hana wela. Hoʻonui lākouwaiwai pilia pale akuoxidationaʻinoʻino.
Q3: He aha ka mānoanoa o ka uhi gula e koho au no kaʻu noi?
A3:ʻO ka mānoanoa kūpono e pili ana i kāu noi kikoʻī.10nmkūpono no nā noi kikoʻī, maʻalahi, ʻoiai50nmi100nmhoʻohana ʻia nā uhi no nā mea mana kiʻekiʻe.500nmhiki ke hoʻohana ʻia no nā noi kaumaha e koi ana i nā papa mānoanoa noka lōʻihiahoopau wela.
Q4: Hiki iā ʻoe ke hana i nā nui wafer?
A4:ʻAe, loaʻa nā wafers ma2-iniha, 4-iniha, a6-inihanā nui maʻamau, a hiki iā mākou ke hāʻawi i nā nui maʻamau e hoʻokō i kāu mau koi kikoʻī.
Q5: Pehea e hoʻonui ai ka uhi gula i ka hana?
A5:Hoʻomaikaʻi ke gulahoʻoheheʻe wela, uila uila, apale ʻino, nā mea a pau e kōkua i ka ʻoi aku ka maikaʻi a me kanā mea hana semiconductor hilinaʻime ka lōʻihi o ke ola hana.
Q6: Pehea e hoʻomaikaʻi ai ke kiʻi adhesion i ka uhi gula?
A6:ʻO kachromium (Cr)adhesion kiʻiʻoniʻoni hōʻoia i ka paa paʻa ma waena o kapapa gulaa me kapani, ka pale ʻana i ka delamination a me ka hōʻoia ʻana i ka pono o ka wafer i ka wā e hana ai a hoʻohana.
Ka hopena
Hāʻawi kā mākou Gold Coated Silicon, Sapphire, a me SiC Wafers i nā hoʻonā holomua no nā noi semiconductor, e hāʻawi ana i ka conductivity uila kiʻekiʻe, dissipation thermal, a me ka pale ʻana i ka corrosion. He kūpono kēia mau wafers no ka hoʻopili semiconductor, hana LED, optoelectronics, a me nā mea hou aku. Me ke gula maʻemaʻe kiʻekiʻe, ka mānoanoa o ka uhi maʻamau, a me ka lōʻihi mechanical maikaʻi, hōʻoia lākou i ka hilinaʻi lōʻihi a me ka hana mau i nā kaiapuni koi.
Kiʻi kikoʻī
