ʻO ka wafer pad non-slip Bionic e lawe ana i ka vacuum sucker friction pad sucker

ʻO ka papa wafer pale paheʻe Bionic e lawe ana i ka vacuum sucker friction pad sucker Kiʻi i hōʻike ʻia

Wehewehe Pōkole:

ʻO ka moena anti-slip Bionic kahi huahana anti-slip hana kiʻekiʻe i hoʻomohala ʻia ma muli o ke kumumanaʻo o ka bionics. Hoʻomākaukau ʻia ia ma ka hoʻohana ʻana i ka ʻenehana hana micro a me nano holomua ma ka hoʻohālike ʻana i nā ʻano microscopic o nā ʻano olaola e like me nā wāwae gecko a me nā mea omo heʻe. Ua uhaʻi kēia huahana i nā palena loea o nā mea kuʻuna non-slip, a hoʻomaopopo i nā hana holomua e like me ka hoʻopili ʻole ʻana i ka glue, hiki ke hoʻohana hou ʻia, a me ka hoʻololi ʻana i ke kaiapuni. Ma ke ʻano he hanauna hou o nā hoʻonā anti-slip akamai, hoʻohui maikaʻi ia i nā hopena hou o ka ʻepekema mea, ka ʻenekinia ʻili a me ka hoʻolālā mechanical, a hōʻike i ka waiwai hoʻohana maikaʻi loa i ka hana ʻoihana, nā lako lapaʻau, nā mea uila mea kūʻai aku a me nā ʻoihana ʻē aʻe.

E leka uila mai iā mākou

Nā hiʻohiʻona

Nā hiʻohiʻona o ka papa pale paʻa Bionic:

• Ka hoʻohana ʻana i nā mea hui ʻenekinia elastomer kūikawā, e hoʻokō i ka ʻole o ke koena, ka hopena anti-skid maʻemaʻe ʻole haumia, kūpono no nā koi kaiapuni hana semiconductor.

• Ma o ka hoʻolālā ʻana o ka hoʻonohonoho ʻano micro-nano pololei, ka mana akamai o nā ʻano friction ʻili, me ka mālama ʻana i ke koina friction kiʻekiʻe me ka hoʻokō ʻana i ka hoʻopili haʻahaʻa loa.

• ʻO ka hoʻolālā ʻano hana hoʻokaʻawale kūikawā e hiki ai ke hana maikaʻi loa o ka friction tangential kiʻekiʻe (μ>2.5) a me ka hoʻopili maʻamau haʻahaʻa (<0.1N/cm²).

• Nā mea polymer i hoʻomohala kūikawā ʻia no ka ʻoihana semiconductor, kahi e hoʻokō ai i ka hana paʻa me ka ʻole o ka attenuation no 100,000 mau hoʻohana hou ʻana ma o ka ʻenehana hana micro a me nano.

Ka hoʻohana ʻana o ka papa pale paʻakikī Bionic:

(1) ʻOihana semiconductor
1. Hana ʻana i ka wafer:
· Ke kūlana paheʻe ʻole i ka wā o ka hoʻoili ʻana o nā wafers lahilahi a hiki i 12 ʻīniha (50-300μm)
· Hoʻopaʻa pololei ʻana o ka mea lawe wafer o ka mīkini lithography
· ʻO ka liner wafer non-slip no nā lako hoʻāʻo

2. Hoʻāʻo pūʻolo:
· Hoʻopaʻa ʻana i nā mea hana mana silicon carbide/gallium nitride me ka ʻole o ka luku ʻia
· Pale pale pahee i ka wā e kau ana i ka chip
· E hoʻāʻo i ke kū'ē ʻana o ka haʻalulu a me ka paheʻe o ka papa probe

(2) ʻOihana photovoltaic
1. Ka hana ʻana i ka wafer silicon:
· Hoʻopaʻa paheʻe ʻole i ka wā e ʻoki ai i ke koʻokoʻo silicon monocrystalline
· ʻO ka wafer silicon lahilahi loa (<150μm) ka hoʻoili ʻana ʻaʻole paheʻe
· Ke kūlana o ka wafer Silicon o ka mīkini paʻi pale

2. ʻAhahui ʻāpana:
· ʻAʻole paheʻe ka laminated backplane aniani
· Ke kau ʻana o ke kahua hoʻonohonoho
· Paʻa ka pahu hoʻopaʻa

(3) ʻoihana photoelectric
1. Papa hōʻike:
· Ke kaʻina hana substrate aniani OLED/LCD ʻaʻole paheʻe
· Ke kūlana pololei o ke kūpono o ka polarizer
· Nā lako hoʻāʻo pale haʻalulu a me ka pale skid

2. Nā ʻāpana ʻōniʻoniʻo:
· ʻAʻohe paheʻe o ka ʻākoakoa modula lens
· Hoʻopaʻa ʻana i ka prism/aniani
· ʻŌnaehana ʻōpae laser pale haʻalulu

(4) Nā mea hana pololei
1. ʻO ke kahua kikoʻī o ka mīkini lithography he anti-slip
2. ʻO ka papa ana o nā lako ʻike he pale haʻalulu
3. ʻO ka lima mīkini hana ʻakomi ʻaʻole e paheʻe

ʻIkepili loea

ʻAno mea:	C, ʻO, Si
Paʻakikī kahakai (A):	50~55
Ka helu hoʻōla elastic:	1.28
Mahana hoʻomanawanui kiʻekiʻe:	260℃
Ka helu kuʻi:	1.8
Ke kū'ē ʻana o ka PLASMA:	Hoʻomanawanui

Nā lawelawe XKH:

Hāʻawi ʻo XKH i nā lawelawe hoʻopilikino piha o ka moena anti-slip bionic, me ka nānā ʻana i ke koi, ka hoʻolālā papahana, ka hōʻoia wikiwiki a me ke kākoʻo hana nui. Ma ka hilinaʻi ʻana i ka ʻenehana hana micro a me nano, hāʻawi ʻo XKH i nā hopena anti-slip ʻoihana no nā ʻoihana semiconductor, photovoltaic a me photoelectric, a ua kōkua maikaʻi i nā mea kūʻai aku e hoʻokō i nā hopena koʻikoʻi e like me ka hōʻemi ʻana o ka helu ʻōpala i 0.005% a me ka hoʻonui ʻana o ka hua ma 15%.