ʻO Bionic non-slip pad wafer e lawe ana i ka ʻūhā ʻūhā ʻūlū friction pad sucker

ʻO Bionic non-slip pad wafer e lawe ana i ka ʻūhā ʻūlū friction pad sucker Kiʻi Hōʻikeʻike

ʻO ka wehewehe pōkole:

ʻO ka moena anti-slip Bionic kahi huahana anti-slip kiʻekiʻe i hoʻomohala ʻia ma muli o ke kumu o ka bionics. Hoʻomākaukau ʻia ia ma ka hoʻohana ʻana i ka ʻenehana hana micro a me nano ma o ka hoʻohālikelike ʻana i nā hiʻohiʻona microscopic o nā hale olaola e like me nā wāwae gecko a me nā mea hānai heʻe. Hoʻopau kēia huahana i nā palena ʻenehana o nā mea kuʻuna non-slip, a ʻike i nā hana holomua e like me ka hoʻopili ʻole ʻana i ka glue, hiki ke hoʻohana hou ʻia, a me ka adaptive kaiapuni. Ma ke ʻano he hanauna hou o ka naʻauao anti-slip solutions, hoʻohui maikaʻi ʻo ia i nā hopena hou o ka ʻepekema waiwai, ʻenekinia honua a me ka hoʻolālā mechanical, a hōʻike i ka waiwai noi maikaʻi loa i ka hana ʻenehana, nā mea lapaʻau, nā mea kūʻai uila a me nā ʻano ʻē aʻe.

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

Nā hiʻohiʻona pad anti-slip pad:

• Ka hoʻohana 'ana i ka hana kūikawā elastomer composite mea, e loaa ole koena, pollution-free maʻemaʻe anti-skid hopena, kūpono no ka semiconductor manufacturing kaiapuni koi.

• Ma o ka pololei micro-nano structure array design, intelligent control of surface friction hiʻona, oiai e malama ana i ke kiʻekiʻe friction coefficient oiai e loaʻa ana ka ultra-low adhesion.

• Hiki i ka ho'olālā mechanics interface kūikawā ke hana maika'i loa o ka friction tangential ki'eki'e (μ>2.5) a me ka ho'opili ma'amau ha'aha'a (<0.1N/cm²).

• Hoʻolālā kūikawā ʻia nā mea polymer no ka ʻoihana semiconductor, e hoʻokō i ka hana paʻa me ka ʻole o ka attenuation no 100,000 mau hoʻohana hou ma o ka ʻenehana hana micro a nano.

ʻO ka hoʻohana ʻana i ka pad anti-slip pad Bionic:

(1) ʻOihana Semiconductor
1. Ka hana ʻana i ka wafer:
· Ke kūlana paheʻe ʻole i ka wā e hoʻoili ʻia ai nā wafers ultra-thin a hiki i 12 iniha (50-300μm)
· Hoʻoponopono pololei i ka mea lawe wafer o ka mīkini lithography
· Wafer non-slip liner no ka hoʻāʻo ʻana i nā mea hana

2. Hōʻike pūʻolo:
· Hoʻopaʻa hoʻopōʻino ʻole o nā mea mana silicon carbide/gallium nitride
· Anti-slip buffer i ka wā e kau ana i ka chip
· E ho'āʻo i ka haʻalulu a me ka paheʻe kūʻē o ka papaʻaina hoʻopololei

(2) ʻOihana Photovoltaic
1. ʻO ka hana ʻana i ka wafer silikon:
· Non-slip fixation i ka wā e ʻoki ana i ke koʻokoʻo silikona monocrystalline
· Ultra-thin silicon wafer (<150μm) hoʻouna ʻole i paheʻe
· Ke hoʻonohonoho ʻia ʻana o ka mīkini paʻi kiʻi kiʻi

2. Hui hui:
· Glass backplane laminated non-slip
· Ke hoʻonohonoho hoʻonohonoho ʻana
· Paʻa pahu paʻa

(3) ʻoihana photoelectric
1. Papa hōʻike:
· Non-slip OLED/LCD aniani substrate kaʻina
· Ke kūlana pololei o ka polarizer kūpono
· ʻO nā lako hoʻāʻo haʻalulu a me ka skid-proof

2. ʻO nā ʻāpana Optical:
· ʻAʻole paheʻe ka hui ʻana o ka module Lens
· Prism / aniani hoʻoponopono
· Pūnaehana ʻōpika laser hōʻeha haʻalulu

(4) Nā mea kani pololei
1. ʻO ka paepae pololei o ka mīkini lithography he anti-slip
2. ʻO ka pākaukau ana o nā mea ʻike maka he haʻalulu
3. ʻAʻole paheʻe ka lima mechanical lako

ʻIkepili ʻenehana:

Mea haku mele:	C, O, Si
'Oolea kahakai (A):	50~55
Koefficient hoʻihoʻi elastic:	1.28
ʻO ka mahana hoʻomanawanui kiʻekiʻe:	260 ℃
Koefficient friction:	1.8
Palekana PLASMA:	Hoʻomanawanui

Nā lawelawe XKH:

Hāʻawi ʻo XKH i nā lawelawe hana maʻamau kaʻina holoʻokoʻa bionic anti-slip moena, me ka nānā ʻana i ka noi, ka hoʻolālā hoʻolālā, ka hōʻoia wikiwiki a me ke kākoʻo hana nui. Ke hilinaʻi nei i ka ʻenehana hana micro a nano, hāʻawi ʻo XKH i nā ʻenehana anti-slip ʻoihana no nā semiconductor, photovoltaic a me nā ʻenehana photoelectric, a ua kōkua maikaʻi i nā mea kūʻai aku e hoʻokō i nā hopena koʻikoʻi e like me ka hoʻemi ʻana o ka debris rate i 0.005% a me ka hoʻonui ʻana i ka 15%.