Pāpaʻi keleawe keleawe cubic hoʻokahi kristal Cu wafer 100 110 111 Kūlana SSP DSP maʻemaʻe 99.99%

Pāpaʻi keleawe keleawe cubic hoʻokahi aniani Cu wafer 100 110 111 Kūlana SSP DSP maʻemaʻe 99.99% Kiʻi Hōʻike ʻia

ʻO ka wehewehe pōkole:

ʻO kā mākou mau pahu keleawe aniani hoʻokahi, me ka maʻemaʻe o 99.99%, ua hana ʻia e hāʻawi i ka hana uila a me ka wela no ka semiconductor kiʻekiʻe a me nā noi uila. Loaʻa kēia mau wafers ma nā ʻano ʻokoʻa, me <100>, <110>, a me <111>, i hana ʻia e hoʻonui i ka pono i nā hihia hoʻohana kikoʻī. Me nā nui mai ka 5 × 5 × 0.5 mm a hiki i ka 20 × 20 × 1 mm, a me ka lattice mau o 3.607 Å, ʻo kēia mau mea keleawe e hōʻoia i ka pololei kiʻekiʻe a me ka paʻa o ka hoʻolālā. Loaʻa nā koho ʻelua ʻaoʻao hoʻokahi (SSP) a me nā ʻaoʻao ʻelua polished (DSP), e hoʻolako ana i nā pono hana like ʻole. ʻO ka conductivity maikaʻi loa o ke keleawe e hana maikaʻi loa kēia mau wafers no ka hoʻohana ʻana i nā pilina uila, nā ʻōnaehana hoʻoheheʻe wela, a me nā ʻāpana microelectronic. Hoʻolālā ʻia no ka versatility, kūpono lākou no ka nui o nā noi, mai nā mea mana kiʻekiʻe a hiki i ka circuitry paʻakikī, e hāʻawi ana i ka hilinaʻi a me ka hana maikaʻi loa i nā kaiapuni koi.

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

Hōʻike

ʻO kekahi mau waiwai o ke keleawe keleawe hoʻokahi substrate.
1.Excellent uila conductivity, conductivity lua wale i ke kala.
2. He maikaʻi loa ka conductivity thermal, a ʻo ka conductivity thermal ka mea maikaʻi loa ma waena o nā metala maʻamau.
3.Good ka hana hana, hiki ke hoʻokō i nā ʻano ʻenehana hana metallurgical.
4.He maikaʻi ke kū'ēʻana i ka corrosion, akā pono kekahi mau mea pale.
5. He haʻahaʻa ke kumukūʻai pili, a ʻoi aku ka maikaʻi o ke kumukūʻai i nā mea metala substrate.
Ma muli o kāna conductivity uila maikaʻi loa, conductivity thermal a me ka ikaika mechanical, loaʻa i nā substrates keleawe he mau noi nui i nā ʻoihana like ʻole. Eia kekahi mau noi nui:

1. Telecommunications
① Nā mea hana RF/ Microwave: Hoʻohana ʻia nā substrate keleawe i ka hoʻopili ʻana i nā ʻāpana RF kiʻekiʻe a me nā microwave, kahi e koʻikoʻi ai ka hana uila a me ka hoʻokele wela.
② 5G a me ka pūnaewele uea: Me ka piʻi ʻana o ka ʻenehana 5G, hoʻohana ʻia nā substrates keleawe i nā antennas a me nā lako kamaʻilio ma muli o kā lākou hōʻailona hōʻailona a me ka hoʻopau ʻana i ka wela.
2. Kaʻa a me ka Aerospace
① Nā kaʻa uila (EV): He kuleana koʻikoʻi nā substrate keleawe i ka ʻōnaehana hoʻokele pākaukau o nā kaʻa uila. Kōkua lākou i ka mālama ʻana i ka pono o ka module mana a hoʻopau i ka wela i hana ʻia i ka wā hana kiʻekiʻe.
② Aerospace electronics: Ma nā noi aerospace, hoʻohana ʻia nā substrates keleawe i nā avionics a me nā sensor ma muli o ko lākou paʻa ʻana ma lalo o nā kūlana koʻikoʻi a me ka hana wela kiʻekiʻe.
3. Nā mea lapaʻau
① Lapaʻau kiʻi kiʻi: Hoʻohana ʻia nā substrate keleawe i nā mea lapaʻau, e like me ka MRI a me ka CT scanners, kahi e pono ai ka conductivity uila a me ka hoʻopau wela.
② Nā lāʻau lapaʻau hiki ke hoʻohana ʻia: Hāʻawi nā substrates keleawe i ka miniaturization o nā kaapuni uila ma nā mea lapaʻau hiki ke hoʻopaʻa ʻia me ka mālama ʻana i ko lākou pono.
4. Ke noi wela kiʻekiʻe
① Nā transistors mana a me nā diodes: Hoʻohana ʻia nā substrates keleawe i nā wahi wela kiʻekiʻe, ʻoi aku ka nui o nā uila uila e like me nā transistors a me nā diodes i nā mana mana a me nā ʻōnaehana hoʻokele ʻoihana.
ʻO ka hui pū ʻana o Copper o ka wela a me ka conductivity uila he mea kūpono ia no nā noi e koi ana i ka hoʻokele wela a me ka hoʻololi ʻana i ka ikehu. Hāʻawi kēia mau hiʻohiʻona i kāna hoʻohana ākea i ka ʻenehana hou.

Loaʻa i kā mākou hale hana nā lako hana kiʻekiʻe a me ka hui ʻenehana, hiki iā mākou ke hāʻawi i ka substrate Copper, hiki ke hoʻopili ʻia e like me nā koi kikoʻī o ka mea kūʻai aku o nā kikoʻī like ʻole, mānoanoa, ke ʻano o Single crystal Cu wafer. Welina nīnau!