Pāpaʻi keleawe hoʻokahi kristal Cu wafer 5x5x0.5/1mm 10x10x0.5/1mm 20x20x0.5/1mm

ʻO ka wehewehe pōkole:

Hana ʻia kā mākou mau ʻāpana keleawe a me nā wafers mai ke keleawe maʻemaʻe kiʻekiʻe (99.99%) me kahi ʻano aniani hoʻokahi, e hāʻawi ana i ka conductivity uila a me ka wela. Loaʻa kēia mau wafers ma nā ʻano cubic o <100>, <110>, a me <111>, e kūpono ana ia mau mea no nā noi i nā mea uila kiʻekiʻe a me ka hana semiconductor. Me nā ana o 5 × 5 × 0.5 mm, 10 × 10 × 1 mm, a me 20 × 20 × 1 mm, ua maʻalahi kā mākou substrate keleawe e hoʻokō i nā pono ʻenehana like ʻole. ʻO ka ʻāpana lattice no kēia mau wafer kristal hoʻokahi he 3.607 Å, e hōʻoiaʻiʻo ana i ka pololei o ke kūkulu ʻana no ka hana ʻana i nā mea hana kiʻekiʻe. Loaʻa nā koho ʻili i hoʻokahi ʻaoʻao polished (SSP) a me pālua ʻaoʻao polished (DSP) hoʻopau, e hāʻawi ana i ka maʻalahi no nā kaʻina hana like ʻole.


Huahana Huahana

Huahana Huahana

Hōʻike

Ma muli o kona kūpaʻa wela kiʻekiʻe a me ka lōʻihi mechanical, hoʻohana nui ʻia nā substrates keleawe i nā microelectronics, nā ʻōnaehana hoʻoheheʻe wela a me nā ʻenehana mālama ikehu, kahi e koʻikoʻi ai ka hoʻokele wela a me ka hilinaʻi. Hana kēia mau waiwai i nā substrate keleawe i mea koʻikoʻi i nā noi ʻenehana holomua.
ʻO kēia kekahi o nā hiʻohiʻona o ke keleawe keleawe hoʻokahi substrate: ʻO ka conductivity uila maikaʻi loa, ka conductivity lua wale nō i ke kālā. Maikaʻi loa ka conductivity thermal, a ʻo ka conductivity thermal ka mea maikaʻi loa ma waena o nā metala maʻamau. Maikaʻi ka hana hana, hiki ke hoʻokō i nā ʻano ʻenehana hana metallurgical. He maikaʻi ke kūpaʻa ʻana o ka corrosion, akā pono kekahi mau mea pale.
Hoʻohana nui ʻia ka substrate keleawe i nā ʻoihana like ʻole ma muli o kāna conductivity uila maikaʻi loa, conductivity thermal a me ka ikaika mechanical. ʻO kēia nā mea hoʻohana nui o ka substrate keleawe:
1. Papa uila kaapuni: keleawe foil substrate mea e like me ka pai kaapuni papa (PCB). Hoʻohana ʻia no ka papa kaapuni kiʻekiʻe kiʻekiʻe interconnect, ka papa kaapuni maʻalahi, a me nā mea ʻē aʻe. He maikaʻi kona conductivity a me ka wela wela a kūpono i nā mea uila mana kiʻekiʻe.

2. Nā noi hoʻomalu wela: hoʻohana ʻia ma ke ʻano he substrate hoʻoluʻu no nā kukui LED, nā uila uila, a me nā mea ʻē aʻe. Hoʻohana ʻia ka conductivity thermal maikaʻi o ke keleawe e hana a hoʻopau pono i ka wela.

3. Electromagnetic shielding application: ma ke ʻano he mea uila uila a me ka pale pale, e hāʻawi i ka pale electromagnetic pono. Hoʻohana ʻia no nā kelepona paʻalima, kamepiula a me nā huahana uila ʻē aʻe o ka pūpū metala a me ka papa pale kūloko. Me ka hana pale electromagnetic maikaʻi, hiki ke pale i ka hoʻopili electromagnetic.

4. ʻO nā noi ʻē aʻe: ma ke ʻano he conductive circuit material no ke kūkulu ʻana i nā ʻōnaehana uila. Hoʻohana ʻia i ka hana ʻana i nā mea uila like ʻole, nā motika, nā transformers a me nā mea electromagnetic ʻē aʻe. Ma ke ʻano he mea hoʻonaninani, e hoʻohana i kāna mau mea hana maikaʻi.

Hiki iā mākou ke hana i nā kikoʻī like ʻole, nā mānoanoa a me nā ʻano o Copper Single crystal substrate e like me nā koi kikoʻī o nā mea kūʻai aku.

Kiʻi kikoʻī

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