ʻO ka substrate keleawe hoʻokahi kristal Cu wafer 5x5x0.5/1mm 10x10x0.5/1mm 20x20x0.5/1mm

Wehewehe Pōkole:

Hana ʻia kā mākou mau substrates keleawe a me nā wafers mai ke keleawe maʻemaʻe kiʻekiʻe (99.99%) me kahi ʻano kristal hoʻokahi, e hāʻawi ana i ka conductivity uila a me ka thermal maikaʻi loa. Loaʻa kēia mau wafers i nā kuhikuhi cubic o <100>, <110>, a me <111>, e kūpono ana iā lākou no nā noi ma nā mea uila hana kiʻekiʻe a me ka hana semiconductor. Me nā ana o 5 × 5 × 0.5 mm, 10 × 10 × 1 mm, a me 20 × 20 × 1 mm, hiki ke hoʻopilikino ʻia kā mākou mau substrates keleawe e hoʻokō i nā pono loea like ʻole. ʻO ka parameter lattice no kēia mau wafers kristal hoʻokahi he 3.607 Å, e hōʻoiaʻiʻo ana i ka pono o ke ʻano no ka hana ʻana i nā mea holomua. ʻO nā koho ʻili e pili ana i ka hoʻopau ʻia ʻana o ka ʻaoʻao hoʻokahi (SSP) a me nā ʻaoʻao pālua i hoʻopau ʻia (DSP), e hāʻawi ana i ka maʻalahi no nā kaʻina hana like ʻole.


Nā hiʻohiʻona

Nā kikoʻī

Ma muli o kona kūpaʻa wela kiʻekiʻe a me ke kūpaʻa mechanical, hoʻohana nui ʻia nā substrates keleawe i ka microelectronics, nā ʻōnaehana hoʻoheheʻe wela a me nā ʻenehana mālama ikehu, kahi e koʻikoʻi ai ka hoʻokele wela kūpono a me ka hilinaʻi. ʻO kēia mau waiwai e hoʻolilo i nā substrates keleawe i mea nui i nā noi ʻenehana holomua he nui.
Eia kekahi o nā ʻano o ke keleawe kristal hoʻokahi substrate: ʻOi aku ka maikaʻi o ka conductivity uila, ʻo ka conductivity ka lua ma hope o ke kālā. He maikaʻi loa ka conductivity thermal, a ʻo ka conductivity thermal ka mea maikaʻi loa ma waena o nā metala maʻamau. Hana hana maikaʻi, hiki ke hoʻokō i nā ʻano ʻenehana hana metallurgical. Maikaʻi ke kūpaʻa ʻana i ka corrosion, akā pono nō kekahi mau hana pale. He haʻahaʻa ke kumukūʻai pili, a ʻoi aku ka hoʻokele waiwai o ke kumukūʻai i nā mea substrate metala.
Hoʻohana nui ʻia ke keleawe keleawe ma nā ʻoihana like ʻole ma muli o kona conductivity uila maikaʻi loa, conductivity thermal a me ka ikaika mechanical. Eia nā noi nui o ke keleawe keleawe:
1. Papa kaapuni uila: mea substrate foil keleawe e like me ka papa kaapuni i paʻi ʻia (PCB). Hoʻohana ʻia no ka papa kaapuni interconnect density kiʻekiʻe, papa kaapuni maʻalahi, a me nā mea ʻē aʻe. Loaʻa iā ia nā waiwai conductivity maikaʻi a me ka hoʻoheheʻe wela a kūpono no nā mea uila mana kiʻekiʻe.

2. Nā noi hoʻokele wela: hoʻohana ʻia ma ke ʻano he substrate hoʻoluʻu no nā kukui LED, nā mea uila mana, a me nā mea ʻē aʻe. Hana i nā mea hoʻololi wela like ʻole, nā radiators a me nā ʻāpana hoʻokele wela ʻē aʻe. Hoʻohana ʻia ka conductivity wela maikaʻi loa o ke keleawe e alakaʻi a hoʻokuʻu i ka wela me ka maikaʻi.

3. Hoʻohana pale electromagnetic: ma ke ʻano he pūpū mea uila a me ka papa pale, e hāʻawi i ka pale electromagnetic maikaʻi. Hoʻohana ʻia no nā kelepona paʻalima, nā kamepiula a me nā huahana uila ʻē aʻe o ka pūpū metala a me ka papa pale kūloko. Me ka hana pale electromagnetic maikaʻi, hiki ke ālai i ka hoʻopilikia electromagnetic.

4. Nā noi ʻē aʻe: ma ke ʻano he mea hoʻokele kaapuni no ke kūkulu ʻana i nā ʻōnaehana uila. Hoʻohana ʻia i ka hana ʻana i nā mea hana uila like ʻole, nā motika, nā mea hoʻololi a me nā ʻāpana electromagnetic ʻē aʻe. Ma ke ʻano he mea hoʻonaninani, e hoʻohana i kona mau waiwai hana maikaʻi.

Hiki iā mākou ke hoʻopilikino i nā kikoʻī like ʻole, nā mānoanoa a me nā ʻano o ka substrate keleawe hoʻokahi e like me nā koi kikoʻī o nā mea kūʻai aku.

Kiʻikuhi kikoʻī

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