ʻO ka Dia300x1.0mmt ka mānoanoa o ka Sapphire Wafer C-Plane SSP/DSP

Wehewehe Pōkole:

Hiki iā Shanghai Xinkehui New Material Co., Ltd. ke hana i nā wafers sapphire me nā ʻano ʻili like ʻole (c, r, a, a me m-plane), a kāohi i ke kihi ʻoki ʻole i loko o 0.1 degere. Ma ka hoʻohana ʻana i kā mākou ʻenehana ponoʻī, hiki iā mākou ke hoʻokō i ke kūlana kiʻekiʻe e pono ai no nā noi e like me ka ulu ʻana o ka epitaxial a me ka hoʻopaʻa ʻana o ka wafer.


Nā hiʻohiʻona

hoʻāʻo1

Hoʻolauna i ka pahu wafer

Nā Mea Crystal 99,999% o Al2O3, Maʻemaʻe Kiʻekiʻe, Monocrystalline, Al2O3
ʻAno kristal ʻAʻole i loaʻa nā hoʻokomo, nā māka poloka, nā māhoe, ke kala, nā micro-bubbles a me nā kikowaena hoʻopuehu
Anawaena 2'īniha 3'īniha 4 ʻīniha 6 ʻīniha ~ 12 ʻīniha
50.8± 0.1mm 76.2±0.2mm 100 ± 0.3mm E like me nā ʻōlelo o ka hana maʻamau
Mānoanoa 430±15µm 550±15µm 650±20µm Hiki ke hoʻopilikino ʻia e ka mea kūʻai aku
Hoʻonohonoho ʻO ka mokulele C- (0001) i ka mokulele M- (1-100) a i ʻole ka mokulele A-(1 1-2 0) 0.2±0.1° /0.3±0.1°, ka mokulele R- (1-1 0 2), ka mokulele A- (1 1-2 0), ka mokulele M-(1-1 0 0), Kekahi kuhikuhi, Kekahi kihi
Ka lōʻihi pālahalaha mua 16.0±1mm 22.0±1.0mm 32.5±1.5 mm E like me nā ʻōlelo o ka hana maʻamau
Kūlana pālahalaha mua Papahele-A (1 1-2 0) ± 0.2°      
TTV ≤10µm ≤15µm ≤20µm ≤30µm
LTV ≤10µm ≤15µm ≤20µm ≤30µm
TIR ≤10µm ≤15µm ≤20µm ≤30µm
KAKAUOHA ≤10µm ≤15µm ≤20µm ≤30µm
ʻŌwiliwili ≤10µm ≤15µm ≤20µm ≤30µm
ʻIli mua ʻEpi-Polished (Ra< 0.2nm)

*Piʻo: ʻO ke kaʻe ʻana o ke kiko waena o ka ʻili waena o kahi wafer manuahi, ʻaʻole i hoʻopaʻa ʻia mai ka mokulele kuhikuhi, kahi i wehewehe ʻia ai ka mokulele kuhikuhi e nā kihi ʻekolu o kahi huinakolu like.

*Warp: ʻO ka ʻokoʻa ma waena o ka mamao kiʻekiʻe loa a me ka mamao liʻiliʻi loa o ka ʻili waena o kahi wafer manuahi, ʻaʻole i hoʻopaʻa ʻia mai ka mokulele kuhikuhi i wehewehe ʻia ma luna.

Nā huahana a me nā lawelawe kiʻekiʻe no nā polokalamu semiconductor hanauna hou a me ka ulu ʻana o ka epitaxial:

Ke kiʻekiʻe o ka pālahalaha (TTV i kāohi ʻia, kakaka, warp etc.)

Hoʻomaʻemaʻe kiʻekiʻe (haʻahaʻa ka haumia o nā ʻāpana, haʻahaʻa ka haumia metala)

ʻEli ʻana i ka substrate, grooving, ʻoki ʻana, a me ka polishing ʻaoʻao hope

Hoʻopili ʻana i ka ʻikepili e like me ka maʻemaʻe a me ke ʻano o ka substrate (koho)

Inā he pono kāu no nā substrates sapphire, e ʻoluʻolu e hoʻokaʻaʻike mai iā:

leka uilaeric@xkh-semitech.com+86 158 0194 2596 /doris@xkh-semitech.com+86 187 0175 6522

E hoʻi mākou iā ʻoe i ka hikiwawe loa!

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