ʻO Diamond-Copper Composite Thermal Management Materials

Diamond-Copper Composite Thermal Management Materials Featured Image

ʻO ka wehewehe pōkole:

ʻO ka Diamond-Copper Composite (Cu-Diamond) kahi mea hoʻokele wela kiʻekiʻe loa e hoʻohui i ka mea hoʻokele wela maikaʻi loa o ka honua - daimana - me nā ʻoihana uila a me nā ʻano mechanical o ke keleawe.
Hoʻolālā ʻia no nā mea uila a me nā mana mana, loaʻa kēia composite i kahi kaulike kūʻokoʻa o ka conductivity thermal loa, ka hoʻonui ʻana i ka wela, a me ka paʻa mechanical, hiki i ka hana hilinaʻi ma lalo o nā kaiapuni wela.

E hoʻouna i ka leka uila iā mākou

Nā hiʻohiʻona

Kiʻi kikoʻī

Hoʻolauna Huahana

ʻO kaDaimana-Copper Composite (Cu-Daimana)hemea hoʻomalu wela kiʻekiʻe-kiʻekiʻeka mea e hoʻohui i ka mea hoʻokele wela maikaʻi loa o ka honua -daimana— me ka maikai o ka uila a me ka mechanical waiwai okeleawe.
Hoʻolālā ʻia no nā mea uila ʻokiʻoki a me nā mana mana, loaʻa kēia composite i kahi kaulike kūʻokoʻa oka hoʻonui wela wela, ka hoʻonui ʻana i ka wela, akūpaʻa mechanical, hiki i ka hana hilinaʻi ma lalo o nā kaiapuni wela koʻikoʻi.

ʻAʻole e like me ke keleawe maʻamau, tungsten, a i ʻole nā substrate e pili ana i ka molybdenum, hāʻawi nā mea hui ʻo Diamond-Copper.a hiki i ka palua o ka welaʻoiai e hoʻemi nui ana i ke kaumaha, e hoʻolilo iā lākou i ke koho i makemake ʻia nosemiconductor packaging, laser system, aerospace electronics, and high-power LED modules.

Kumuhana Mea

Aia ma ka puʻuwai o ka hui ʻananā ʻāpana daimanahoʻokomo like ʻia i loko o amatrix keleawe.
Ke hana nei kēlā me kēia ʻāpana daimana ma ke ʻano he micro heat sink, e hoʻolaha wikiwiki ana i ka wela, ʻoiai ʻo ka matrix keleawe e hōʻoia i ka hoʻokele uila a me ka pololei o ke ʻano.
Ma o nā ʻano hana hana holomua — mehoʻoheheʻe ʻia, uhi kemika, aka hoʻopaʻa ʻana i ka plasma spark (SPS)- ua hoʻokumu ʻia kahi paʻa paʻa paʻa paʻa, e hōʻoiaʻiʻo ana i ka hilinaʻi lōʻihi ma lalo o ke kaʻa uila wela mau.

Nā Manaʻo Kūikawā

Waiwai	Waiwai / wehewehe
ʻO ka Thermal Conductivity	400 – 700 W/m·K
Coefficient of Thermal Expansion (CTE)	5 – 8 × 10⁻⁶/K
ʻO ka mānoanoa	6.0 – 7.0 g/cm³
Hoʻopau i luna	Hiki ke hoʻopaʻa ʻia ʻo Ni/Au no ke kūʻai ʻana a i ʻole brazing
Hoʻopilikino	Hiki ke hoʻopili ʻia ka ʻikepili Diamond a me CTE i nā koi o ka mea kūʻai aku

Nā noi

Nā Module Semiconductor Mana Kiʻekiʻe(IGBT, MOSFET, RF a me nā pūʻolo microwave)
Laser Diodes a me Optoelectronic
Aerospace a me nā Pūnaehana Hoʻoluʻu Palekana
ʻO nā mea hoʻolaha wela LED kiʻekiʻe
ʻO ka IC a me ka CPU Heat Sinks no ka Computing Advanced
Nā mea hoʻonui mana a me nā lako kamaʻilio Optical

No ke aha e koho ai i ka Diamond-Copper Composite?

No ka meamea wela.
I ke au o ka miniaturization a me ke kiʻekiʻe o ka ikehu kiʻekiʻe, ʻo ka mālama ʻana i ka wela e wehewehe pono i ke ola a me ka hana o kēlā me kēia hāmeʻa.
Hoʻomaopopo ka Cu-Diamond composite:

ʻOi aku ka lōʻihi o ke ola o ka mīkini
Hoʻonui i ka paʻa hana
Hoʻomaikaʻi i ka hana mana
Hoʻemi i ka luhi wela

FAQ o na Makaaniani Quartz

Q1: Hiki ke hoʻopilikino ʻia nā composites Cu-Diamond no nā mea chip kikoʻī?
ʻAe. Hiki ke hoʻopaʻa pololei ʻia ka hakina leo daimana a me CTE e hoʻohālikelike iā Si, GaN, a i ʻole nā mea pili i ka SiC.

Q2: Pono ka metallization ma mua o ke kūʻai ʻana?
ʻAe. Paipai ʻia ka metallization ʻili (Ni / Au, Ti / Ni / Au) e hōʻoia i ka hoʻopaʻa maikaʻi ʻana a me ka pale ʻana i ka wela.

Q3: Pehea e hana ai ma lalo o ka wela wela a i ʻole pulsed?
ʻO ka laha wela o Diamond e hōʻoiaʻiʻo i ka hoʻohālikelike ʻana i ka wela, e kūpono ana ia no nā ʻāpana kiʻekiʻe a me ka pulse-loaded.

Q4: He aha ka mahana hana kiʻekiʻe?
Paʻa ka hui a hiki i600°Ci loko o ka inert a i ʻole ka ʻenekini, e pili ana i ka uhi a me ka pilina pili.

E pili ana iā mākou

Hoʻokumu ʻo XKH i ka hoʻomohala ʻenehana kiʻekiʻe, ka hana ʻana, a me ke kūʻai ʻana i nā aniani optical kūikawā a me nā mea aniani hou. Hāʻawi kā mākou huahana i nā uila uila, nā mea hoʻohana uila, a me ka pūʻali koa. Hāʻawi mākou i nā ʻāpana optical Sapphire, nā uhi kelepona kelepona paʻa, Ceramics, LT, Silicon Carbide SIC, Quartz, a me nā wafer kristal semiconductor. Me ka ʻike akamai a me nā mea hana ʻoki ʻoki, ʻoi aku mākou i ka hoʻoili huahana maʻamau ʻole, me ka manaʻo e lilo i alakaʻi optoelectronic material high-tech ʻoihana.