Mekini Oki Uea Daimana no SiC | Sapphire | Quartz | aniani

Mekini Oki Uea Daimana no SiC | Sapphire | Quartz | Kiʻi Hōʻikeʻike aniani

ʻO ka wehewehe pōkole:

ʻO ka Diamond Wire Single-Line Cutting System kahi ʻōnaehana hoʻoponopono holomua i hoʻolālā ʻia no ka ʻoki ʻana i nā substrates ultra-paʻakikī a me ka brittle. Ke hoʻohana nei i kahi uea i uhi ʻia i daimana ma ke ʻano he mea ʻoki ʻoki, hāʻawi ka mea hana i ka wikiwiki kiʻekiʻe, ka pōʻino liʻiliʻi, a me ka hana ʻoi aku ka maikaʻi. He kūpono ia no nā noi e like me nā sapphire wafers, SiC boules, quartz plates, ceramics, optical glass, silicon rods, and gemstones.

E hoʻouna i ka leka uila iā mākou

Nā hiʻohiʻona

Kiʻi kikoʻī o ka mīkini ʻoki uwea daimana

Nānā o ka mīkini ʻoki uwea daimana

Ke hoʻohālikelike ʻia me nā ʻili kuʻuna a i ʻole nā uea abrasive, hāʻawi kēia ʻenehana i ka pololei o ka nui o ke ana, haʻahaʻa kerf poho, a hoʻomaikaʻi i ka pono o ka ʻili. Hoʻohana nui ʻia ia ma waena o nā semiconductor, photovoltaics, nā mea LED, optics, a me ka hoʻoponopono pōhaku pololei, a kākoʻo ʻaʻole wale i ka ʻoki laina pololei akā ʻo ka ʻokiʻoki kūikawā hoʻi o nā mea nui a i ʻole ke ʻano like ʻole.

diamond_wire_single_line_cutting_machine_for_sic_sapphire_quartz_ceramic_material

Kuʻuna Hana

Hana ka mīkini ma ka hoʻokele auwea daimana ma ka wikiwiki laina kiʻekiʻe loa (a hiki i 1500 m/min). ʻO nā ʻāpana abrasive i hoʻokomo ʻia i ka uea e wehe i nā mea ma o ka micro-grinding, ʻoiai nā ʻōnaehana kōkua e hōʻoia i ka hilinaʻi a me ka pololei:

Hanai pololei:ʻO ka holo ʻana o Servo me nā ala alakaʻi laina e hoʻokō i ka ʻoki paʻa a me ke kūlana micron-level.
Hoʻoluʻu a hoʻomaʻemaʻe:ʻO ka hoʻomau ʻana i ka wai e hoʻemi i ka mana wela, pale i nā micro-cracks, a wehe pono i nā ʻōpala.
Hoʻomalu Uea Uea:Mālama ka hoʻoponopono ʻakomi i ka ikaika mau ma ka uea (± 0.5 N), e hōʻemi ana i ka haʻalele a me ka haki.
Nā Module koho:ʻO nā ʻanuʻu Rotary no nā mea hana ʻokiʻoki a cylindrical paha, nā ʻōnaehana kiʻekiʻe no nā mea ʻoi aku ka paʻakikī, a me ka alignment ʻike no nā geometries paʻakikī.

Nā Kūlana ʻenehana

'ikamu	ʻĀpana	'ikamu	ʻĀpana
Nui Hana Nui	600×500 mm	Holo Holo	1500 m/min
Angle Swing	0~±12.5°	ʻO ka wikiwiki	5 m/s²
ʻO ke alapine e koli	6-30	ʻOki wikiwiki	<3 hola (6-ʻīniha SiC)
Kaʻi Haʻi	650 mm	Ka pololei	<3 μm (6-īniha SiC)
Kaʻi Heʻe	≤500 mm	Anawaena Uea	φ0.12~φ0.45 mm
Hapai ka Mama	0~9.99 mm/min	Hoʻohana mana	44.4 kW
Holo wikiwiki	200 mm/min	Nui Mīkini	2680×1500×2150 mm
Hoʻopaʻapaʻa mau	15.0N~130.0N	Kaumaha	3600 kg
ʻO ka pololei o ka hoʻopaʻapaʻa	±0.5 N	walaʻau	≤75 dB(A)
Ka mamao waena o nā huila alakaʻi	680~825 mm	Hoʻolako kinoea	>0.5 MPa
Pahu Hooluu	30 L	Laina Mana	4×16+1×10 mm²
Kaa Moka	0.2 kW	—	—

Nā Pōmaikaʻi Nui

Kiekie Efficiency & Reduced Kerf

ʻO ka wikiwiki o ka uea i ka 1500 m / min no ka wikiwiki wikiwiki.

ʻO ka laulā kerf haʻahaʻa e hoʻohaʻahaʻa i ka poho waiwai a hiki i ka 30%, e hoʻonui i ka hua.

Hiki i nā mea hoʻohana

Pākuʻi HMI me ka waiho ʻana i ka meaʻai.

Kākoʻo i nā hana like ʻole pololei, curve, a multi-slice.

Nā Hana Hoʻonui

ʻO ke kahua Rotary no ka ʻoki ʻana i ka bevel a me ka pōʻai.

Nā modula kiʻekiʻe no ka SiC kūpaʻa a me ka ʻoki sapphire.

ʻO nā mea hana hoʻopololei Optical no nā ʻāpana maʻamau ʻole.

Hoʻolālā Mechanical Paʻa

ʻO ka pahu hoʻolei koʻikoʻi e pale i ka haʻalulu a hōʻoia i ka pololei lōʻihi.

Hoʻohana ʻia nā ʻāpana ʻaʻahu koʻikoʻi i ka seramika a i ʻole tungsten carbide coatings no> 5000 mau hola lawelawe.

Mīkini ʻoki Uea Daimana no SiC Sapphire Quartz Glass 3

Nā ʻoihana noi

Nā Semiconductors:ʻO ka ʻoki ʻana o SiC maikaʻi me ka poho kerf <100 μm.

LED & Optik:ʻO ka hana ʻana i ka wafer sapphire kiʻekiʻe no nā photonics a me nā mea uila.

ʻOihana Lā:ʻO ka ʻoki ʻana i ke koʻokoʻo silikoni a me ka ʻoki ʻana i ka wafer no nā cell PV.

Optical & Jewelry:ʻOki maikaʻi ʻia o ka quartz a me nā pōhaku makamae me Ra <0.5 μm pau.

Aerospace & Ceramics:Ka hana ʻana i ka AlN, zirconia, a me nā seramika holomua no nā noi wela kiʻekiʻe.

ʻO ka mīkini ʻoki uea daimana no ka SiC Sapphire Quartz Glass 4

FAQ o na Makaaniani Quartz

Q1: He aha nā mea e hiki ai i ka mīkini keʻoki?
A1:Hoʻonui ʻia no ka SiC, sapphire, quartz, silicon, ceramics, aniani optical, a me nā pōhaku makamae.

Q2: Pehea ka pololei o ka ʻoki ʻana?
A2:No nā wafers SiC 6-inch, hiki i ka pololei o ka mānoanoa ke hiki i <3 μm, me ka maikaʻi o ka ʻili.

Q3: No ke aha i ʻoi aku ka maikaʻi o ka ʻoki uea daimana ma mua o nā ʻano kuʻuna?
A3:Hāʻawi ia i nā wikiwiki wikiwiki, hoʻemi ʻia ka nalowale o ke kerf, liʻiliʻi ka pōʻino wela, a me nā ʻaoʻao maʻalahi i hoʻohālikelike ʻia me nā uwea abrasive a i ʻole ka ʻoki laser.

Q4: Hiki iā ia ke hana i nā ʻano cylindrical a i ʻole nā mea like ʻole?
A4:ʻAe. Me ke kaʻina wili koho, hiki iā ia ke hana i ka pōʻai, bevel, a me ka ʻoki kihi ma luna o nā lāʻau a i ʻole nā pilina kūikawā.

Q5: Pehea ka hoʻomalu ʻia ʻana o ka uea tension?
A5:Hoʻohana ka ʻōnaehana i ka hoʻoponopono ʻana i ka hoʻoponopono hoʻopaʻa ʻana me ka pololei ± 0.5 N e pale i ka haki ʻana o ka uea a hōʻoia i ka ʻoki paʻa.

Q6: ʻO wai nā ʻoihana e hoʻohana nui i kēia ʻenehana?
A6:ʻO ka hana semiconductor, ka ikehu o ka lā, nā LED & photonics, ka hana ʻana i nā ʻāpana optical, nā mea nani, a me nā seramika aerospace.

E pili ana iā mākou

Hoʻokumu ʻo XKH i ka hoʻomohala ʻenehana kiʻekiʻe, ka hana ʻana, a me ke kūʻai ʻana i nā aniani optical kūikawā a me nā mea aniani hou. Hāʻawi kā mākou huahana i nā uila uila, nā mea hoʻohana uila, a me ka pūʻali koa. Hāʻawi mākou i nā ʻāpana optical Sapphire, nā uhi kelepona kelepona paʻa, Ceramics, LT, Silicon Carbide SIC, Quartz, a me nā wafer kristal semiconductor. Me ka ʻike akamai a me nā mea hana ʻoki ʻoki, ʻoi aku mākou i ka hoʻoili huahana maʻamau ʻole, me ka manaʻo e lilo i alakaʻi optoelectronic material high-tech ʻoihana.