6 'īniha / 8 'īniha POD / FOSB Fiber Optic Splice Box Delivery Box Storage Box RSP Remote Service Platform FOUP Wehe mua i Unified Pod
Kiʻi kikoʻī
Nānā nui o FOSB
ʻO kaFOSB (Pahu Hoʻouna Wehe I mua)ʻO ia kahi pahu i hoʻomākaukau pono ʻia no ka lawe ʻana a me ka mālama ʻana i nā wafers semiconductor 300mm. He hana koʻikoʻi ia i ka mālama ʻana i nā wafers i ka wā o ka hoʻoili ʻana i waena o ka hale a me ka hoʻouna ʻana i kahi lōʻihi me ka hōʻoia ʻana e mālama ʻia nā pae kiʻekiʻe o ka maʻemaʻe a me ka pono mechanical.
Hana ʻia mai nā mea ultra-maʻemaʻe, static-dissipative a hoʻomohala ʻia i nā kūlana SEMI, hāʻawi ka FOSB i ka pale kūʻokoʻa mai ka hoʻohaumia ʻana i nā ʻāpana, ka hoʻokuʻu static, a me ka haʻalulu kino. Hoʻohana nui ʻia ia ma ka honua holoʻokoʻa hana semiconductor, logistic, a me nā hui OEM/OSAT, ʻoi aku hoʻi i nā laina hana automated o 300mm wafer fabs.
Hoʻolālā a me nā lako o FOSB
Hoʻokumu ʻia kahi pahu FOSB maʻamau i kekahi mau ʻāpana kikoʻī, i hana ʻia e hana maʻalahi me ka ʻōnaehana ʻoihana a hōʻoia i ka palekana wafer:
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Kino Nui: Hoʻoheheʻe ʻia mai nā plastik ʻenekinia hoʻomaʻemaʻe kiʻekiʻe e like me PC (polycarbonate) a i ʻole PEEK, e hāʻawi ana i ka ikaika mechanical kiʻekiʻe, haʻahaʻa haʻahaʻa haʻahaʻa, a me ke kūpaʻa kemika.
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Puka Wehe Imua: Hoʻolālā ʻia no ka hoʻokō piha ʻana i ka automation; nā hiʻohiʻona paʻa paʻa paʻa e hōʻoia i ka liʻiliʻi o ka hoʻololi ea i ka wā o ka lawe ʻana.
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Paʻa Reticle Kuloko/Wafer: Hoʻopaʻa paʻa i ka 25 wafers. ʻO ka pā he anti-static a cushioned no ka pale ʻana i ka hoʻololi ʻana i ka wafer, ka ʻokiʻoki ʻana a i ʻole ka ʻoki ʻana.
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Mechanism Latch: Mālama ka ʻōnaehana laka palekana i ka paʻa ʻana o ka puka i ka wā o ka lawe ʻana a me ka lawelawe ʻana.
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Nā hiʻohiʻona hiki ke huli: Nui nā hiʻohiʻona i hoʻokomo ʻia i nā hōʻailona RFID, barcodes, a i ʻole QR code no ka hoʻohui piha ʻana o MES a me ka nānā ʻana ma ke kaulahao logistic.
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Mana ESD: He static-dissipative nā mea, maʻamau me ka resistivity o ka ʻili ma waena o 10⁶ a me 10⁹ ohms, e kōkua ana i ka pale ʻana i nā wafers mai ka hoʻokuʻu electrostatic.
Hana ʻia kēia mau ʻāpana i nā lumi lumi maʻemaʻe a hui a ʻoi aku paha ma mua o nā kūlana SEMI honua e like me E10, E47, E62, a me E83.
Nā Pōmaikaʻi Nui
● Palena Wafer Kūlana Kiʻekiʻe
Hoʻokumu ʻia nā FOSB no ka pale ʻana i nā wafers mai ka pōʻino kino a me nā mea haumia kaiapuni:
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Hoʻopaʻa piha ʻia, hoʻopaʻa ʻia me ka hermetically i hoʻopaʻa ʻia e pale aku i ka makū, nā hū kemika, a me nā ʻāpana ea.
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Hoʻemi ka Anti-vibration interior i ka pilikia o nā haʻalulu mechanical a i ʻole microcracks.
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ʻO ka ʻiʻo waho paʻa e kū i nā hopena hāʻule a me ka hoʻopaʻa ʻana i ke kaomi i ka wā logistic.
● Hoʻopili piha i ka ʻautome
Hoʻohana ʻia nā FOSB no ka hoʻohana ʻana ma AMHS (Automated Material Handling Systems):
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Kūpono me nā lima robotic semi-compliant, nā awa hoʻouka, nā mea kūʻai, a me nā mea wehe.
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Hoʻopili ka mīkini wehe mua me ka FOUP maʻamau a me nā ʻōnaehana awa hoʻouka no ka automation hale hana ʻole.
● Hoʻolālā Mākaukau-Maʻemaʻe
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Hana ʻia mai nā mea hoʻomaʻemaʻe ultra-maʻemaʻe.
Maʻalahi e hoʻomaʻemaʻe a hoʻohana hou; kūpono no ka papa 1 a i ʻole nā lumi hoʻomaʻemaʻe kiʻekiʻe.
Kūʻokoʻa mai nā ion metala koʻikoʻi, e hōʻoiaʻiʻo ʻaʻole e hoʻohaumia ʻia i ka wā e hoʻoili ai i ka wafer.
● Hoʻopili Naʻauao & Hoʻohui MES
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ʻAe ʻia nā ʻōnaehana RFID/NFC/barcode no ka ʻike piha ʻana mai ka fab a i ka fab.
Hiki ke ʻike ʻokoʻa ʻia kēlā me kēia FOSB i loko o ka ʻōnaehana MES a i ʻole WMS.
Kākoʻo i ke kaʻina hana, ʻike pūʻulu, a me ka mālama waiwai.
FOSB Box - Nā Papa Hoʻohālikelike Hui
| Māhele | 'ikamu | Waiwai |
|---|---|---|
| Nā mea waiwai | Pili Wafer | Polycarbonate |
| Nā mea waiwai | Puka, Puka, Puka Puka | Polycarbonate |
| Nā mea waiwai | Paʻa hope | ʻO Polybutylene Terephthalate |
| Nā mea waiwai | ʻO nā lima, Flange Auto, Nā Papa ʻIke | Polycarbonate |
| Nā mea waiwai | Hoʻopaʻa | Thermoplastic Elastomer |
| Nā mea waiwai | KC Papa | Polycarbonate |
| Nā kikoʻī | Ka hiki | 25 wafera |
| Nā kikoʻī | Hohonu | 332.77 mm ±0.1 mm (13.10" ±0.005") |
| Nā kikoʻī | Laulā | 389.52 mm ±0.1 mm (15.33" ±0.005") |
| Nā kikoʻī | Kiʻekiʻe | 336.93 mm ±0.1 mm (13.26" ±0.005") |
| Nā kikoʻī | 2-Paʻi lōʻihi | 680 mm (26.77") |
| Nā kikoʻī | 2-Paʻa Laulā | 415 mm (16.34") |
| Nā kikoʻī | 2-Pake Kiʻekiʻe | 365 mm (14.37") |
| Nā kikoʻī | Kaumaha (Hōʻokoʻa) | 4.6 kg (10.1 paona) |
| Nā kikoʻī | Kaumaha (Piha) | 7.8 kg (17.2 paona) |
| Wafer Compatibility | Nui Wafer | 300 mm |
| Wafer Compatibility | Pitch | 10.0 mm (0.39") |
| Wafer Compatibility | Nā mokulele | ±0.5 mm (0.02") mai ka inoa |
Nā hiʻohiʻona noiʻi
ʻO nā FOSB nā mea hana pono i ka 300mm wafer logistics a me ka waiho ʻana. Hoʻohana nui ʻia lākou i nā hiʻohiʻona aʻe:
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Nā Hoʻololi Fab-to-Fab: No ka hoʻoneʻe ʻana i nā wafers ma waena o nā hale hana semiconductor like ʻole.
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Hāʻawi ʻia ʻo Founder: Ka lawe ʻana i nā wafers i hoʻopau ʻia mai ka fab i ka mea kūʻai aku a i ʻole ka hale hōʻailona.
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OEM/OSAT Logistics: Ma waho o ka hoʻopili ʻana a me nā kaʻina hoʻāʻo.
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ʻO ka mālama ʻana a me ka waiho ʻana o nā ʻaoʻao ʻekolu: Mālama i ka mālama ʻana i nā wafers waiwai no ka wā lōʻihi.
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Na Hooili Wafer Kuloko: Ma nā pā kula nui kahi e hoʻopili ʻia ai nā modula hana mamao ma o AMHS a i ʻole ka lawe lima lima.
I nā hana kaulahao hoʻolako honua, ua lilo nā FOSB i mea maʻamau no ka lawe ʻana i ka wafer waiwai nui, e hōʻoiaʻiʻo ana i ka lawe ʻole ʻia o ka contamination ma nā ʻāina āpau.
FOSB vs. FOUP – He aha ka ʻokoʻa?
| Hiʻona | FOSB (Pahu Hoʻouna Wehe I mua) | FOUP (Pod Unified Opening Front) |
|---|---|---|
| Hoʻohana mua | Inter-fab wafer hoʻouna a me ka logistics | Hoʻoili wafer in-fab a me ka hoʻoili ʻakomi |
| Kapili | ʻO ka pahu paʻa paʻa me ka pale hou aku | Hiki ke hoʻohana hou ʻia ka pod no ka automation kūloko |
| Paʻa ʻea | ʻOi aku ka maikaʻi o ka hoʻopaʻa ʻana | Hoʻolālā ʻia no ke komo maʻalahi, liʻiliʻi i ka ea |
| Hoʻohana pinepine | Medium (ka nānā 'ana i ka halihali lōʻihi palekana) | ʻO ke alapine kiʻekiʻe i nā laina hana automated |
| Kaha Wafer | ʻO ka maʻamau he 25 wafers no ka pahu | ʻO ka maʻamau he 25 wafers no kēlā me kēia pod |
| Kākoʻo Automation | Kūpono me nā mea wehe FOSB | Hoʻohui ʻia me nā awa hoʻouka FOUP |
| Hoʻokō | SEMI E47, E62 | SEMI E47, E62, E84, a oi |
ʻOiai e lawelawe ana nā mea ʻelua i nā kuleana koʻikoʻi i ka wafer logistics, ua kūkulu ʻia nā FOSB no ka hoʻouna ikaika ʻana ma waena o nā mea kūʻai aku a i ʻole nā mea kūʻai aku o waho, akā ʻoi aku ka manaʻo o ka FOUP i ka hana pono laina hana.
Nā nīnau i nīnau pinepine ʻia (FAQ)
Q1: Hiki ke hoʻohana hou ʻia nā FOSB?
ʻAe. Hoʻolālā ʻia nā FOSB kiʻekiʻe no ka hoʻohana pinepine ʻana a hiki ke pale aku i ka nui o ka hoʻomaʻemaʻe a me ka mālama ʻana i nā pōʻai inā mālama pono ʻia. Hoʻomaʻemaʻe mau ʻia me nā mea hana i hōʻoia ʻia.
Q2: Hiki ke hoʻopilikino ʻia nā FOSB no ka hōʻailona ʻana a i ʻole ka nānā ʻana?
ʻOiaʻiʻo. Hiki ke hoʻopilikino ʻia nā FOSB me nā hōʻailona o ka mea kūʻai aku, nā hōʻailona RFID kikoʻī, ke sila anti-moisture, a me nā kala kala like ʻole no ka hoʻokele logistics maʻalahi.
Q3: He kūpono anei nā FOSB no nā lumi lumi maʻemaʻe?
ʻAe. Hana ʻia nā FOSB mai nā plastic maʻemaʻe a hoʻopaʻa ʻia i mea e pale ai i ka hana ʻana. Ua kūpono lākou no ka papa 1 a i ka papa 1000 lumi hoʻomaʻemaʻe a me nā wahi semiconductor koʻikoʻi.
Q4: Pehea e wehe ʻia ai nā FOSB i ka wā automation?
Hoʻopili nā FOSB me nā mea wehe FOSB kūikawā e wehe i ka puka mua me ka ʻole o ka hoʻopili lima lima, e mālama ana i ka pono o nā kūlana lumi maʻemaʻe.
E pili ana iā mākou
Hoʻokumu ʻo XKH i ka hoʻomohala ʻenehana kiʻekiʻe, ka hana ʻana, a me ke kūʻai ʻana i nā aniani optical kūikawā a me nā mea aniani hou. Hāʻawi kā mākou huahana i nā uila uila, nā mea hoʻohana uila, a me ka pūʻali koa. Hāʻawi mākou i nā ʻāpana optical Sapphire, nā uhi kelepona kelepona paʻa, Ceramics, LT, Silicon Carbide SIC, Quartz, a me nā wafer kristal semiconductor. Me ka ʻike akamai a me nā mea hana ʻoki ʻoki, ʻoi aku mākou i ka hoʻoili huahana maʻamau ʻole, me ka manaʻo e lilo i alakaʻi optoelectronic material high-tech ʻoihana.
