ʻOki ʻoki ʻoki ʻana i nā mea hana Wafer 8inch/12 iniha ʻoki ʻoki apo Wafer.

ʻOki ʻokiʻoki ʻana i nā mea hana Wafer 8inch/12inch Wafer Ring-Oki ʻoki kiʻi i hōʻike ʻia.

ʻO ka wehewehe pōkole:

Ua hoʻomohala kūʻokoʻa ʻo XKH i kahi ʻōnaehana ʻokiʻoki wafer edge piha piha, e hōʻike ana i kahi hopena holomua i hoʻolālā ʻia no nā kaʻina hana semiconductor mua. Hoʻokomo ʻia kēia mea hana i ka ʻenehana mana synchronous multi-axis hou a loaʻa i kahi ʻōnaehana spindle kiʻekiʻe-rigidity (ka wikiwiki o ka rotation kiʻekiʻe: 60,000 RPM), e hāʻawi ana i ka ʻoki ʻoki pololei me ka ʻoki pololei a hiki i ± 5μm. Hōʻike ka ʻōnaehana i ka hoʻohālikelike maikaʻi loa me nā substrates semiconductor like ʻole, me ka ʻaʻole i kaupalena ʻia i:
1.Silicon wafers (Si): He kūpono no ka hana lihi o 8-12 iniha wafers;
2.Compound semiconductor: ʻEkolu-hanauna semiconductor mea e like me GaAs a me SiC;
3.Special substrates: Piezoelectric mea wafers me LT/LN;

Kākoʻo ka hoʻolālā modular i ka hoʻololi wikiwiki ʻana i nā mea hoʻohana he nui e pili ana i nā lau daimana a me nā poʻo ʻoki laser, me ka hoʻohālikelike ʻana ma mua o nā kūlana ʻoihana. No nā koi kaʻina hana kūikawā, hāʻawi mākou i nā hāʻina piha e pili ana:
· Hoʻolako ʻia nā mea hoʻohana ʻoki ʻoki
· Nā lawelawe hana maʻamau
· Kaʻina hana hoʻoponopono hoʻoponopono

E hoʻouna i ka leka uila iā mākou

Nā hiʻohiʻona

Nā palena ʻenehana

ʻĀpana	Unite	Hōʻike
Nui Mea Hana Nui	mm	ø12"
Spindle	Hoʻonohonoho	Hoʻokahi Spindle
	Ka māmā holo	3,000–60,000 rpm
	Mana Hoopuka	1.8 kW (2.4 koho) ma 30,000 min⁻¹
	Max Blade Dia.	Ø58 mm
X-Axis	ʻOki ʻana	310 mm
Y-Axis	ʻOki ʻana	310 mm
	Hoʻonui ʻanuʻu	0.0001 mm
	Kaulana pololei	≤0.003 mm/310 mm, ≤0.002 mm/5 mm (hewa hoʻokahi)
Z-Axis	Olelo Hooholo	0.00005 mm
Z-Axis	Hiki hou	0.001 mm
θ-Axis	Ka Hoʻololi ʻana	380 deg
ʻAno Spindle		Hoʻokahi spindle, hoʻolako ʻia me ka pahi paʻa no ka ʻoki apo
Pono e oki apo	μm	±50
Wafer Positioning Pololei	μm	±50
Hoʻokahi-Wafer Efficiency	min/wafer	8
Nui-Wafer Efficiency		A hiki i ka 4 wafers i hana ʻia i ka manawa like
Kaumaha Lako	kg	≈3,200
Nā Ana Lako (W×D×H)	mm	2,730 × 1,550 × 2,070

Kuʻuna Hana

Loaʻa ka ʻōnaehana i ka hana ʻokiʻoki ʻokoʻa ma o kēia mau ʻenehana kumu:

1.Intelligent Motion Control System:
· Kiʻekiʻe-pololei kaʻa kaʻa laina laina (e hana hou i ka pololei o ka hoʻonohonoho ʻana: ± 0.5μm)
· ʻEono-axis synchronous mana kākoʻo paʻakikī trajectory hoʻolālā
· Real-time vibration suppression algorithms e hōʻoia ana i ka ʻoki paʻa

2. Pūnaehana ʻike kiʻekiʻe:
· Hoʻohui ʻia ʻo 3D laser kiʻekiʻe sensor (pololei: 0.1μm)
· Ke kūlana kiʻekiʻe o ka nānā ʻana i ka CCD (5 megapixels)
· Module nānā maikaʻi ma ka pūnaewele

3.Fully Automated Kaʻina Hana:
· Hoʻouka ʻakomi / hoʻoiho ʻana (FOUP maʻamau interface kūpono)
· Pūnaehana koho naʻauao
· ʻĀpana hoʻomaʻemaʻe i pani ʻia (maʻemaʻe: Papa 10)

Nā noi maʻamau

Hāʻawi kēia mea hana i ka waiwai nui ma waena o nā noi hana semiconductor:

Kahua noi	Mea Hana Hana	Nā Pono ʻenehana
Hana IC	8/12" Silicon Wafers	Hoʻonui i ka alignment lithography
Mea Mana Mana	SiC/GaN Wafers	Kāohi i nā hemahema lihi
Nā mea ʻike MEMS	SOI Wafers	E hōʻoia i ka pono o ka mea hana
Nā mea hana RF	GaAs Wafers	Hoʻomaikaʻi i ka hana kiʻekiʻe-frequency
Hoʻopili kiʻekiʻe	Nā Wafers i kūkulu hou ʻia	Hoʻonui i ka hoʻohua ʻana

Nā hiʻohiʻona

1.Four-station hoʻonohonoho no ka hana kiʻekiʻe kiʻekiʻe;
2. Stable TAIKO apo debonding a wehe;
3. Hoʻohālikelike kiʻekiʻe me nā mea hoʻohana kī;
4.Multi-axis synchronous trimming ʻenehana e hōʻoia i ka pololei o ka ʻoki ʻana;
5.Fully automated kaʻina kahe nui hoemi i ka hana koina;
6.Customized worktable hoʻolālā hiki ke hana paʻa o nā hana kūikawā;

Nā hana

1. Pūnaehana ʻike ring-drop;
2. Hoʻomaʻemaʻe papa hana ʻakomi;
3.Intelligent UV debonding system；
4.Operation log record;
5.Factory automation module integration;

Hoʻokō lawelawe

Hāʻawi ʻo XKH i nā lawelawe kākoʻo holoʻokoʻa holoʻokoʻa i hoʻolālā ʻia e hoʻonui i ka hana ʻana o nā mea hana a me ka hana pono i kāu huakaʻi hana.
1. Nā lawelawe hoʻoponopono
· Hoʻonohonoho ʻia nā lako hana: Ke hui pū nei kā mākou hui ʻenekinia me nā mea kūʻai aku e hoʻopaʻa pono i nā ʻōnaehana ʻōnaehana (ʻoki wikiwiki, koho ʻia, a me nā mea ʻē aʻe) e pili ana i nā waiwai waiwai kikoʻī (Si/SiC/GaAs) a me nā koi kaʻina.
· Kākoʻo Hoʻomohala Kaʻina Hana: Hāʻawi mākou i ka hana laʻana me nā hōʻike kikoʻī kikoʻī e pili ana i ke ana ʻana o ka lihi a me ka palapala ʻāina kīnā.
· Hoʻomohala ʻia nā mea hoʻohana: No nā mea hou (e laʻa, Ga₂O₃), hui pū mākou me nā mea hana hoʻohana alakaʻi no ka hoʻomohala ʻana i nā lau / laser optics.

2. Kākoʻo ʻenehana loea
· Kākoʻo ma ka paena i hoʻolaʻa ʻia: E hoʻokaʻawale i nā ʻenekini i hōʻoia ʻia no nā kaʻina ramp-up koʻikoʻi (maʻamau 2-4 mau pule), e uhi ana:
ʻO ka calibration o nā lako a me ke kaʻina hana hoʻoponopono
Hoʻomaʻamaʻa mākaukau o ka mea hana
ISO Papa 5 ke alakaʻi hoʻohui lumi maʻemaʻe
· Manaʻo Manaʻo: Ka nānā ʻana i ke olakino olakino me ka nānā ʻana i ka vibration a me nā diagnostics servo motor e pale ai i ka manawa hoʻomaha ʻole.
· Mākaʻikaʻi mamao: ʻO ka nānā ʻana i ka hana o nā mea hana manawa maoli ma o kā mākou IoT platform (JCFront Connect®) me nā mākaʻikaʻi anomaly automated.

3. Nā lawelawe waiwai
· Ka Papahana ʻIke: Loaʻa i ka 300+ hōʻoia ʻoki ʻoki no nā mea like ʻole (hōʻano hou ʻia i kēlā me kēia hapaha).
· Hoʻoponopono ʻenehana Alanui: Hōʻoiaʻiʻo i ka wā e hiki mai ana kāu hoʻopukapuka me nā ala hoʻomaikaʻi ʻana i nā lako / lako polokalamu (e laʻa, AI-based defect detection module).
· Pane ulia pōpilikia: Hōʻoiaʻiʻo ʻia he 4 mau hola mamao a me 48 mau hola ma ka pūnaewele (ka uhi honua).

4. Hana Hana Hana
· Hōʻoiaʻiʻo Hana: Hoʻopaʻa aelike i ka ≥98% manawa hana me nā manawa pane kākoʻo SLA.

Hoʻomaikaʻi mau

Hana mākou i nā noiʻi ʻoluʻolu o nā mea kūʻai aku ʻelua a hoʻokō i nā hana Kaizen e hoʻomaikaʻi i ka hāʻawi ʻana i ka lawelawe. Unuhi kā mākou hui R&D i nā ʻike kahua i ka hoʻomaikaʻi ʻana i nā mea hana - 30% o ka hoʻomaikaʻi ʻana i ka firmware mai ka manaʻo o nā mea kūʻai aku.