Infrared Nanosecond Laser Drilling lako no Glass Drilling thickness≤20mm

ʻO ka wehewehe pōkole:

Hōʻuluʻulu manaʻo ʻenehana:
ʻO ka Infrared Nanosecond Laser Glass Drilling System he ʻenehana hana ʻenehana i hoʻomohala ʻia no ka wili pololei ʻana o nā mea aniani. Ke hoʻohana nei i kahi kumu laser nanosecond infrared 1064nm (ka laulā puʻupuʻu: 10-300ns), loaʻa kēia ʻōnaehana i ka wili kiʻekiʻe kiʻekiʻe i nā substrate aniani like ʻole me ka mānoanoa ≤20mm ma o ka mana pololei o ka ikehu a me nā ʻenehana hana beam.
Ma nā noi laina hana pono, hōʻike ka Infrared Nanosecond Laser Glass Drilling System i nā pono kaʻina hana kūʻokoʻa. Hoʻohālikelike ʻia me ka hoʻoheheʻe mechanical maʻamau a i ʻole ka hoʻoili laser CO₂, hiki i ka ʻōnaehana hoʻomalu hopena wela i hoʻopaʻa ʻia e hiki ai ke hoʻopololei pololei me nā anawaena puka mai ka Φ0.1-5mm i loko o ke aniani soda-lime maʻamau, ʻoiai e mālama ana i ka taper pā puka i loko o ± 0.5°. ʻOi aku i ka hana ʻana o ka lens lens sapphire camera sapphire, hiki i ka ʻōnaehana ke hana mau i ka Φ0.3mm micro-hole arrays me ka pololei o ke kūlana o ± 10μm, e hālāwai me nā koi miniaturization stringent i nā mea uila uila. Hele mai ka ʻōnaehana maʻamau me ka hoʻouka ʻana a me ka wehe ʻana i nā kikowaena no ka hoʻohui pono ʻana me nā laina hana e kū nei.

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

Pākuʻi nui

ʻAno laser	Nanokekona infrared
Ka nui o ka paepae	*800600(mm)**
	*20001200(mm)**
Mānoanoa wili	≤20(mm)
Ka wikiwiki o ka wili ʻana	0-5000(mm/s)
Nahaha lihi wili	<0.5(mm)
'Ōlelo Aʻo: Hiki ke hoʻololi i ka nui o ka paepae.

Kuʻuna wili laser

Hoʻopaʻa ʻia ka kukuna laser ma kahi kūlana maikaʻi loa e pili ana i ka mānoanoa mea hana, a laila nānā i nā ala i koho mua ʻia i ka wikiwiki kiʻekiʻe. Ma o ka launa pū ʻana me ke kukuna laser ikaika nui, hoʻoneʻe ʻia ka mea i hoʻopaʻa ʻia i kēlā me kēia ʻāpana e hana i nā ala ʻoki, e loaʻa ai ka perforation pololei (circular, square, a i ʻole geometries paʻakikī) me ka hoʻokaʻawale ʻana i nā mea.

Nā Pōmaikaʻi ʻo Laser Drilling

· ʻO ka hoʻohui ʻana i ka automation kiʻekiʻe me ka liʻiliʻi o ka mana a me ka hana maʻalahi;

· Hiki i ka hana hoʻopili ʻole ke hiki ke hoʻokaʻawale i nā ʻano geometries ma mua o nā hana maʻamau;

· Hoʻemi ʻia ka hana hoʻopau ʻole i nā kumukūʻai hana a hoʻonui i ka hoʻomau kaiapuni;

· ʻOi aku ka pololei me ka liʻiliʻi liʻiliʻi o ka ʻoki ʻana a me ka hoʻopau ʻana i ka pōʻino o ka mea hana lua;

Hōʻike laʻana

Nā noi hana

Hoʻolālā ʻia ka ʻōnaehana no ka hoʻoponopono pololei ʻana i nā mea brittle/paʻakikī e pili ana i ka wili, grooving, wehe kiʻiʻoniʻoni, a me ka kikokikona ʻili. Loaʻa nā noi maʻamau:

1. ʻO ka wili ʻana a me ka hoʻopaʻa ʻana no nā ʻāpana puka ʻauʻau

2. Precision perforation o ka appliance aniani panels

3. Panel lā ma o ka wili ʻana

4. Hoʻololi / kumu uhi pā perforation

5. ʻO ka wehe ʻana i ka uhi aniani me ka wili

6. ʻO ka kikokikona o ka ʻili maʻamau a me ka grooving no nā huahana kūikawā

Nā Pono Hana Hana

1. Hoʻokomo ka paepae ʻano nui i nā ana huahana like ʻole ma nā ʻoihana

2. Loaʻa ka ʻeli ʻana o ka contour paʻakikī ma ka hana hoʻokahi

3. ʻO ka ʻoki liʻiliʻi liʻiliʻi me ka ʻili o ka ʻili (Ra <0.8μm)

4. Hoʻololi maʻalahi ma waena o nā kikoʻī huahana me ka hana intuitive

5. Hoʻohana maikaʻi ke kumu kūʻai me:

· Nā hua kiʻekiʻe (>99.2%)

· Hoʻohana ʻole ʻia

· Hoʻokuʻu ʻia nā mea haumia ʻole

6.Non-contact kaʻina hana e hōʻoiaʻiʻo ili pono mālama

Nā mea nui

1. ʻenehana hoʻokele wela wela:

· Hoʻohana i ke kaʻina hana wili holomua nui me ka ikehu puʻupuʻu hoʻokahi hiki ke hoʻololi ʻia (0.1–50 mJ)

· ʻO ka ʻōnaehana pale ea ʻaoʻao ʻē aʻe e hoʻopaʻa i ka ʻāpana wela i loko o 10% o ke anawaena puka.

· Hoʻopaʻi ʻokoʻa ʻia ka module nānā wela infrared manawa maoli i nā ʻāpana ikehu (± 2% kūpaʻa)

2. Papahana hoʻoponopono naʻauao:

· Hoʻolako ʻia me kahi pae kaʻa laina laina kiʻekiʻe (e hana hou i ka pololei o ka hoʻonohonoho ʻana: ±2 μm)

· Pūnaehana hoʻonohonoho ʻike maka (5-megapixel CCD, ʻike pololei: ± 5 μm)

· Preloaded kaʻina waihona me ka optimized parameter no 50+ ʻano o nā mea aniani

3. Kiekie-Efficiency Production Design:

· Ke ʻano hana ʻokoʻa pālua me ka manawa hoʻololi waiwai ≤3 kekona

· Ka pōʻai hana maʻamau o 1 puka/0.5 kekona (Φ0.5 mm i loko o ka lua)

· Hiki i ka hoʻolālā modular ke hoʻololi wikiwiki i nā hui lens e kālele ana (ke kaʻina hana: Φ0.1–10 mm)

ʻO nā palapala noi hoʻoheheʻe ʻana i nā mea paʻakikī

ʻAno Mea	Ka Papa Hana	Ke Kaʻina Hana
Aniani Soda-lime	ʻO nā puka ua	Nā lua kau a me nā kahawai wai
Aniani Soda-lime	Nā panela hoʻomalu mea hana	ʻO nā pūʻulu lua wai
Makaaniani Makani	Nā puka makani nānā umu	Lahui puka makani
Makaaniani Makani	ʻO nā papa kuke hoʻokomo	ʻO nā kahawai hoʻoluʻu angled
Aniani Borosilicate	Nā panela lā	Nā lua kau
Aniani Borosilicate	Mea aniani hale hana	ʻO nā kahawai wai maʻamau
aniani-seramika	Nā ʻili kuki	Nā puka hoʻonohonoho kuni
aniani-seramika	Nā mea kuke hoʻokomo	Nā papa hoʻonohonoho puka hoʻopaʻa sensor
Sapphire	Uhi mea akamai	Nā puka makani
Sapphire	ʻO nā puka nānā ʻoihana	Nā puka i hoʻoikaika ʻia
Aniani i uhiia	Nā aniani lumi lumi	ʻO nā lua kau (ka wehe ʻana i ka uhi + wili)
Aniani i uhiia	Nā pā pale	ʻO ke aniani haʻahaʻa-E huna i nā lua wai
Aniani Ceramicized	Nā poʻi hoʻololi/puka	Nā puka palekana + puka uea
Aniani Ceramicized	Pale ahi	Nā puka hoʻoluhi pilikia pilikia

Hāʻawi ʻo XKH i ke kākoʻo ʻenehana holoʻokoʻa a me nā lawelawe i hoʻohui ʻia no ka infrared nanosecond laser glass drilling lako e hōʻoia i ka hana maikaʻi loa i ke ola holoʻokoʻa. Hāʻawi mākou i nā lawelawe hoʻomohala kaʻina hana maʻamau kahi e hui pū ai kā mākou hui ʻenekinia me nā mea kūʻai aku e hoʻokumu i nā hale waihona puke pili waiwai, me nā papahana wili kūikawā no nā mea paʻakikī e like me ka sapphire a me ke aniani aniani me nā ʻano mānoanoa mai 0.1mm a 20mm. No ka hoʻonui ʻana i ka hana, hana mākou i ka calibration mea hana ma ka pūnaewele a me nā hoʻāʻo hōʻoia hana, e hōʻoia ana i nā metric koʻikoʻi e like me ka hoʻomanawanui ʻana o ka puka (± 5μm) a me ka maikaʻi o ka lihi (Ra<0.5μm) e hoʻokō i nā kūlana ʻoihana.

Mua: ʻO ka ʻenehana ʻenehana microjet ʻenehana wafer e ʻoki ana i ka hoʻoili waiwai SiC

Aʻe: 6 Iniha Conductive SiC Composite Substrate 4H Anawaena 150mm Ra≤0.2nm Warp≤35μm

E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou