LNOI Wafer (Lithium Niobate on Insulator) Telecommunications Sensing High Electro-Optic
Kiʻi kikoʻī


Nānā nui
Aia i loko o ka pahu wafer nā ʻāpana symmetrical, ʻo ka nui o ia mau ʻano like ʻole e kākoʻo i nā ʻaoʻao ʻelua o ka wafer. Hana ʻia ka pahu aniani me ka mea translucent plastic PP i kū i ka wela, ka lole a me ka uila static. Hoʻohana ʻia nā kala like ʻole o nā additives e hoʻokaʻawale i nā ʻāpana kaʻina hana metala i ka hana semiconductor. Ma muli o ka liʻiliʻi o nā kī liʻiliʻi o nā semiconductor, nā hiʻohiʻona paʻa, a me nā koi koʻikoʻi o ka nui o ka ʻāpana i ka hana ʻana, pono e hōʻoia ʻia ka pahu wafer i kahi kaiapuni maʻemaʻe e hoʻopili ai i ka microenvironment box reaction cavity o nā mīkini hana like ʻole.
Hana Hana
ʻO ka hana ʻana i nā wafers LNOI he mau ʻanuʻu kūpono:
KaʻAnuʻu Hana 1: Helium Ion ImplantationHoʻokomo ʻia nā ion helium i loko o kahi aniani LN nui me ka hoʻohana ʻana i kahi implanter ion. Hoʻokomo kēia mau ion i kahi hohonu kikoʻī, e hana ana i kahi mokulele nāwaliwali e hoʻomaʻamaʻa i ka wehe ʻana i ke kiʻiʻoniʻoni.
KaʻAnuʻu 2: Hoʻokumu i ka substrate kumuHoʻokaʻawale ʻia a hoʻopaʻa ʻia me ka SiO2 me ka hoʻohana ʻana i ka PECVD a i ʻole ka wela wela. Hoʻolālā ʻia kona ʻili luna no ka hoʻopili maikaʻi ʻana.
KaʻAnuʻu Hana 3: Hoʻopaʻa ʻia o LN i ka substrateHoʻopili ʻia ka kristal LN i hoʻokomo ʻia i ka ion a hoʻopili ʻia i ka wafer kumu me ka hoʻohana ʻana i ka paʻa wafer pololei. Ma nā hoʻonohonoho noiʻi, hiki ke hoʻohana ʻia ka benzocyclobutene (BCB) i mea hoʻopili e hoʻomaʻamaʻa i ka hoʻopaʻa ʻana ma lalo o nā kūlana paʻakikī.
KaʻAnuʻu Hana 4: Hoʻomaʻamaʻa Thermal a me ka wehe ʻana i ke kiʻiʻoniʻoniHoʻoulu ka Annealing i ka hoʻokumu ʻana i ka ʻōpū ma ka hohonu i hoʻokomo ʻia, e hiki ai ke hoʻokaʻawale i ke kiʻi ʻoniʻoni lahilahi (luna LN layer) mai ka nui. Hoʻohana ʻia ka ikaika mechanical e hoʻopau i ka exfoliation.
KaʻAnuʻu Hana 5: Kaʻili ʻiliHoʻohana ʻia ka Chemical Mechanical Polishing (CMP) e hoʻomaʻemaʻe i ka ʻili o LN luna, e hoʻomaikaʻi i ka maikaʻi o ka optical a me ka hua o nā mea hana.
Nā ʻāpana ʻenehana
Mea waiwai | Optical Papa LiNbO3 wafes(Keʻokeʻo or ʻeleʻele) | |
Curie Temp | 1142±0.7 ℃ | |
ʻoki ʻoki Angle | X/Y/Z etc | |
Anawaena/nui | 2”/3”/4” ±0.03mm | |
Tol(±) | <0.20 mm ±0.005mm | |
mānoanoa | 0.18~0.5mm a ʻoi aku paha | |
Papahana Palahalaha | 16mm/22mm/32mm | |
TTV | <3μm | |
Kakaka | -30 | |
Warp | <40μm | |
Kūlana Palahalaha | Loaʻa nā mea a pau | |
Ili ʻAno | Hoʻomaʻamaʻa ʻia ka ʻaoʻao hoʻokahi (SSP)/ʻaoʻao ʻelua ʻaoʻao i poni ʻia (DSP) | |
Hoʻomaʻamaʻa ʻia aoao Ra | <0.5nm | |
S/D | 20/10 | |
Kaulana Kūkākūkā | R=0.2mm ʻAno-C or Bullnose | |
ʻAno maikaʻi | Kuokoa of māwae(puehu a hoʻokomo) | |
Optical doped | Mg/Fe/Zn/MgO etc no ka mea optical papa LN wafers per noi ʻia | |
Wafer Ili Kūkākūkā | Hōʻike hōʻike | ʻAʻole=2.2878/Ne=2.2033 @632nm ka lōʻihi hawewe/prism coupler method. |
hoʻohaumia, | ʻAʻohe | |
Nā ʻāpana c>0.3μ m | <=30 | |
ʻAkaʻi, ʻokiʻoki | ʻAʻohe | |
ʻO ke kīnā | ʻAʻohe māwae kaʻe, nā ʻōpala, nā māka ʻike, nā ʻili | |
Hoʻopili ʻia | Ka nui/Wafer pahu | 25pcs no ka pahu |
Hoʻohana i nā hihia
Ma muli o kona maʻalahi a me kāna hana, hoʻohana ʻia ʻo LNOI ma nā ʻoihana he nui:
Photonics:ʻO nā modulators compact, multiplexers, a me nā kaapuni photonic.
RF/Acoustics:Acousto-optic modulators, RF kānana.
Kuantum Computing:ʻO nā mea hoʻohui alapine ʻole a me nā mea hana paʻa photon.
Palekana & Aerospace:ʻO nā gyros optical haʻahaʻa, nā mea hoʻololi pinepine.
Lapaʻau Lapaʻau:ʻO nā biosensors Optical a me nā hōʻailona hōʻailona kiʻekiʻe.
FAQ
Nīnau: No ke aha i makemake ai ʻo LNOI ma mua o SOI i nā ʻōnaehana optical?
A:Hōʻike ʻo LNOI i nā coefficient electro-optic kiʻekiʻe a me ka laulā ākea ākea, e hiki ai i ka hana kiʻekiʻe ma nā kaapuni photonic.
Nīnau: Pono anei ʻo CMP ma hope o ka hoʻokaʻawale ʻana?
A:ʻAe. ʻOkaʻiʻo ka ʻili LN i hōʻike ʻia ma hope o ka ʻoki ʻana i ka ion-slicing a pono e hoʻomaʻamaʻa ʻia no ka hoʻokō ʻana i nā kikoʻī kikoʻī.
Q: He aha ka nui o ka wafer nui loa?
A:ʻO ka nui o nā wafers LNOI kalepa ʻo 3 "a me 4", ʻoiai ke hoʻomohala nei kekahi mau mea hoʻolako i nā ʻano like ʻole 6".
Nīnau: Hiki ke hoʻohana hou ʻia ka papa LN ma hope o ka hoʻokaʻawale ʻana?
A:Hiki ke hoʻomaʻamaʻa hou ʻia ke aniani kumu a hoʻohana hou ʻia i nā manawa he nui, ʻoiai e hoʻohaʻahaʻa ka maikaʻi ma hope o nā pōʻai he nui.
Nīnau: Ua kūpono anei nā wafers LNOI me ka hana CMOS?
A:ʻAe, ua hoʻolālā ʻia lākou e kūlike me nā kaʻina hana semiconductor maʻamau, ʻoi aku ka nui o ka hoʻohana ʻana i nā substrates silicon.