ʻO ka ʻenehana ʻenehana microjet ʻenehana wafer e ʻoki ana i ka hoʻoili waiwai SiC

ʻO ka ʻenehana ʻenehana microjet ʻenehana wafer e ʻoki ana i ka hoʻoili ʻana i nā mea SiC kiʻi i hōʻike ʻia

ʻO ka wehewehe pōkole:

ʻO nā lako ʻenehana laser Microjet kahi ʻano ʻōnaehana mīkini pololei e hoʻohui i ka laser ikehu kiʻekiʻe a me ka micron-level liquid jet. Ma ka hoʻopili ʻana i ka kukuna laser i ka wai kahe wai kiʻekiʻe (ka wai deionized a i ʻole ka wai kūikawā), hiki ke ʻike ʻia ka hana ʻana o nā mea me ka pololei kiʻekiʻe a me ka pōʻino wela haʻahaʻa. He kūpono loa kēia ʻenehana no ka ʻoki ʻana, ka ʻeli ʻana a me ka hana microstructure o nā mea paʻakikī a palupalu (e like me SiC, sapphire, aniani), a hoʻohana nui ʻia i ka semiconductor, photoelectric display, nā mea lapaʻau a me nā māla ʻē aʻe.

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

Ke kumu hana:

1. Hoʻopili ʻia ka laser: ʻo ka laser pulsed (UV/'ōmaʻomaʻo/infrared) i kālele ʻia i loko o ka pahu wai e hana ai i kahi kaila hoʻoili ikehu paʻa.

2. ʻO ke alakaʻi wai: ka jet kiʻekiʻe (ka kahe kahe 50-200m / s) hoʻoluʻu i ka wahi hana a me ka lawe ʻana i nā ʻōpala e pale i ka hōʻiliʻili wela a me ka pollution.

3. Ka wehe 'ana i nā mea: 'O ka ikehu laser ke kumu o ka hopena cavitation i loko o ka wai e ho'okō ai i ka hana anu o ka mea ('āpana wela <1μm).

4. Dynamic control: hoʻoponopono manawa maoli i nā ʻāpana laser (ka mana, ka pinepine) a me ke kaomi jet e hoʻokō i nā pono o nā mea like ʻole a me nā hale.

Nā ʻāpana kī:

1. Mana laser: 10-500W (hoʻololi ʻia)

2. Jet anawaena: 50-300μm

3.Machining pololei: ± 0.5μm (ʻokiʻoki), hohonu i ka laulā ākea 10: 1 (wili)

Nā pōmaikaʻi ʻenehana:

(1) Aneane ʻaʻohe wela wela
- ʻO ka hoʻoheheʻe wai wai e hoʻomalu i ka wahi i hoʻopilikia ʻia i ka wela (HAZ) i **<1μm**, e pale ana i nā micro-cracks i hana ʻia e ka hana laser maʻamau (ʻo ka HAZ ka mea maʻamau >10μm).

(2) Ultra-high precision machining
- ʻOki ʻoki/wili pololei ʻana a hiki i ka **±0.5μm**, ʻoʻoleʻa ʻaoʻao Ra<0.2μm, hoʻemi i ka pono no ka polishing ma hope.

- Kākoʻo i ka hoʻoili ʻia ʻana o ka hoʻolālā 3D paʻakikī (e like me nā lua conical, nā ʻāpana ʻano).

(3) Hoʻohālikelike mea ākea
- ʻO nā mea paʻakikī a palupalu: SiC, sapphire, aniani, ceramics (maʻalahi nā hana kuʻuna e wāwahi).

- Nā mea pili i ka wela: nā polymers, nā mea ola kino (ʻaʻohe pilikia o ka denaturation thermal).

(4) Ka palekana a me ka pono
- ʻAʻohe lepo lepo, hiki ke hoʻohana hou ʻia ka wai a kānana.

- 30%-50% hoʻonui i ka wikiwiki o ka hana (vs. machining).

(5) Mana akamai
- Ke hoʻonohonoho ʻike ʻike a me ka hoʻonui ʻana i nā ʻāpana AI, ka mānoanoa a me nā hemahema.

Nā kikoʻī kikoʻī:

Ka nui o ka countertop	300300150	400400200
axis laina XY	Motor laina laina. Motor laina laina	Motor laina laina. Motor laina laina
axis laina Z	150	200
Ka pololei o ka hoonoho ana μm	+/-5	+/-5
Hoʻonohonoho hou ʻia ka pololei μm	+/-2	+/-2
ʻO ka wikiwiki G	1	0.29
Mana helu	3 axis /3+1 axis /3+2 axis	3 axis /3+1 axis /3+2 axis
ʻAno mana helu	DPSS Nd:YAG	DPSS Nd:YAG
Loʻihi nalu nm	532/1064	532/1064
Ka mana helu ʻia ʻo W	50/100/200	50/100/200
Pahu wai	40-100	40-100
Paʻi kaomi nozzle	50-100	50-600
Nā ana (mea hana mīkini) (ākea * lōʻihi * kiʻekiʻe) mm	144519442260	170015002120
Nui (ke keʻena hoʻomalu) (W * L * H)	70025001600	70025001600
Kaumaha (mea hana) T	2.5	3
Kaumaha (keʻena hoʻomalu) KG	800	800
Hiki ke hana	ʻO ka ʻeleʻele Ra≤1.6um ʻO ka wikiwiki wehe ≥1.25mm/s ʻOki ʻokiʻoki ≥6mm/s ʻO ka wikiwiki ʻoki laina ≥50mm/s	ʻO ka ʻeleʻele Ra≤1.2um ʻO ka wikiwiki wehe ≥1.25mm/s ʻOki ʻokiʻoki ≥6mm/s ʻO ka wikiwiki ʻoki laina ≥50mm/s
	No ka gallium nitride crystal, ultra-wide band gap semiconductor material (diamond/Gallium oxide), aerospace special materials, LTCC carbon ceramic substrate, photovoltaic, scintillator crystal a me nā mea hana ʻē aʻe. 'Ōlelo Aʻo: He ʻokoʻa ka mana o ka hana ʻana ma muli o nā ʻano mea

Hoʻoponopono hihia:

Nā lawelawe a XKH:

Hāʻawi ʻo XKH i ke kākoʻo holoʻokoʻa holoʻokoʻa holoʻokoʻa no nā lako ʻenehana microjet laser, mai ke kaʻina hana mua a me ke kūkākūkā koho ʻana i nā lako, a hiki i ka hoʻohui ʻana o ka ʻōnaehana ma waena o ka manawa (me ka hoʻohālikelike kūikawā o ka punawai laser, ʻōnaehana jet a me ka module automation), i ka hana hope a me ka hoʻomaʻamaʻa hoʻomaʻamaʻa ʻana a me ka hoʻomau mau kaʻina hana, ua lako ke kaʻina holoʻokoʻa me ke kākoʻo ʻenehana loea; Ma muli o 20 mau makahiki o ka ʻike machining precision, hiki iā mākou ke hāʻawi i nā hoʻonā hoʻokahi e like me ka hōʻoia ʻana i nā lako, ka hoʻolauna nui ʻana a me ka pane wikiwiki ʻana ma hope o ke kūʻai ʻana (24 mau hola o ke kākoʻo ʻenehana + kī ʻāpana ʻāpana kī) no nā ʻoihana like ʻole e like me semiconductor a me ka lāʻau lapaʻau, a hoʻohiki i 12 mau mahina ka lōʻihi o ka palapala hōʻoia a me ka mālama ola a me ka lawelawe hoʻomaikaʻi. E hōʻoia i ka mālama mau ʻana o nā mea kūʻai aku i ka hana hoʻoili alakaʻi alakaʻi a me ke kūpaʻa.