ʻO ka SiC Semi-Insulating ma nā Si Composite Substrates
| Nā Mea | Nā kikoʻī | Nā Mea | Nā kikoʻī |
| Anawaena | 150±0.2mm | Hoʻonohonoho | <111>/<100>/<110> a pēlā aku |
| Polytype | 4H | ʻAno | P/N |
| Ke kū'ē ʻana | ≥1E8ohm·cm | Palahalaha | Pālahalaha/ʻoki |
| Mānoanoa o ka papa hoʻoili | ≥0.1μm | ʻĀpana lihi, ʻōpala, māwae (nānā maka) | ʻAʻohe |
| ʻAʻohe mea | ≤5ea/wafer (2mm>D>0.5mm) | TTV | ≤5μm |
| ʻO ka ʻoʻoleʻa mua | Ra≤0.2nm (5μm*5μm) | Mānoanoa | 500/625/675±25μm |
Hāʻawi kēia hui pū ʻana i kekahi mau pono i ka hana ʻana i nā mea uila:
Hoʻohālikelike: ʻO ka hoʻohana ʻana i kahi substrate silicon e hoʻohālikelike ai me nā ʻano hana hana silicon maʻamau a ʻae i ka hoʻohui ʻana me nā kaʻina hana semiconductor e kū nei.
Hana wela kiʻekiʻe: Loaʻa iā SiC ka conductivity thermal maikaʻi loa a hiki ke hana i nā mahana kiʻekiʻe, e kūpono ana no nā noi uila kiʻekiʻe a me ke alapine kiʻekiʻe.
Ka Uila Hoʻopau Kiʻekiʻe: Loaʻa i nā mea SiC kahi uila hoʻopau kiʻekiʻe a hiki ke kū i nā kahua uila kiʻekiʻe me ka ʻole o ka uhaki uila.
Hoʻemi ʻia ka Pohō Mana: ʻAe nā substrates SiC no ka hoʻololi mana ʻoi aku ka maikaʻi a me ka pohō mana haʻahaʻa i nā mea uila i hoʻohālikelike ʻia me nā mea silicon kuʻuna.
Ka bandwidth ākea: He bandwidth ākea ko SiC, e ʻae ana i ka hoʻomohala ʻana o nā mea uila e hiki ke hana i nā mahana kiʻekiʻe a me nā densities mana kiʻekiʻe.
No laila, hoʻohui ka semi-insulating SiC ma nā substrates Si composite i ka hoʻohālikelike o ka silicon me nā waiwai uila a me ka thermal kiʻekiʻe o SiC, e kūpono ana no nā noi uila hana kiʻekiʻe.
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