Mea hana semiconductor
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12 'īniha piha 'akomi pololei dicing saw lako wafer hoʻolaʻa 'okiʻoki pūnaewele no Si/SiC & HBM (Al)
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ʻOki ʻoki ʻoki ʻana i nā mea hana Wafer 8inch/12 iniha ʻoki ʻoki apo Wafer.
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Laser Anti-Hoʻopunipuni Lako Hoailona Sapphire Wafer Marking
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Laser Anti-Counterfeiting Marking System no ka Sapphire Substrates, Watch Dials, Luxury Jewelry
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ʻO ka umu hoʻonui ʻo SiC crystal SiC Ingot e ulu ana i ka 4inch 6inch 8inch PTV Lely TSSG LPE ke ʻano ulu ulu.
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Hiki ke hoʻohana ʻia ka mīkini paʻi laser papa liʻiliʻi 1000W-6000W ka liʻiliʻi liʻiliʻi 0.1MM no nā mea aniani metala.
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ʻO ka mīkini wili laser kiʻekiʻe no ka sapphire ceramic material gem bearing nozzle drilling
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Sapphire hoʻokahi kristal Al2O3 ulu ulu KY ala Kyropoulos hana ʻana o ke aniani sapphire kiʻekiʻe.
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Monocrystalline silicon ulu umu ahi monocrystalline silicon ingot ulu ʻōnaehana ʻōnaehana wela a hiki i 2100 ℃
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ʻO ke kapuahi ulu kristal Sapphire Czochralski kapuahi aniani hoʻokahi CZ ala e ulu ai i ka wafer sapphire kiʻekiʻe.