Nā Lako Hoʻokiʻekiʻe Laser Semiconductor
Kiʻikuhi kikoʻī
ʻIke Huahana o nā Lako Hana Hoʻokiʻekiʻe Laser
Hōʻike ka Semiconductor Laser Lift-Off Equipment i kahi hopena hanauna hou no ka lahilahi ingot holomua i ka hana ʻana i nā mea semiconductor. ʻAʻole e like me nā ʻano wafering kuʻuna e hilinaʻi nei i ka wili mechanical, ka ʻoki ʻana i ka uea daimana, a i ʻole ka planarization kemika-mechanical, hāʻawi kēia kahua laser i kahi koho ʻē aʻe ʻaʻohe pili, ʻaʻole luku no ka hoʻokaʻawale ʻana i nā papa lahilahi loa mai nā ingots semiconductor nui.
Hoʻonohonoho pono ʻia no nā mea palupalu a me nā mea waiwai nui e like me ka gallium nitride (GaN), silicon carbide (SiC), sapphire, a me ka gallium arsenide (GaAs), hiki i ka Semiconductor Laser Lift-Off Equipment ke ʻoki pololei i nā kiʻiʻoniʻoni wafer-scale pololei mai ka ingot kristal. Hoʻemi nui kēia ʻenehana holomua i ka ʻōpala mea, hoʻomaikaʻi i ka throughput, a hoʻonui i ka pono o ka substrate - he mea koʻikoʻi kēia mau mea āpau no nā polokalamu hanauna e hiki mai ana i nā uila mana, nā ʻōnaehana RF, photonics, a me nā micro-displays.
Me ka hoʻokūpaʻa ʻana i ka mana hana aunoa, ke ʻano o ke kukuna, a me ka loiloi pilina laser-material, ua hoʻolālā ʻia ka Semiconductor Laser Lift-Off Equipment e hoʻohui pono i nā kahe hana hana semiconductor me ke kākoʻo ʻana i ka maʻalahi o ka R&D a me ka scalability o ka hana nui ʻana.
ʻEnehana a me ke Kumumanaʻo Hana o nā Lako Hana Lift-Off Laser
Hoʻomaka ke kaʻina hana i hana ʻia e Semiconductor Laser Lift-Off Equipment ma ka hoʻomālamalama ʻana i ka ingot donor mai kekahi ʻaoʻao me ka hoʻohana ʻana i kahi kukuna laser ultraviolet ikehu kiʻekiʻe. Hoʻopili pono ʻia kēia kukuna ma kahi hohonu kūloko kikoʻī, ma ke ʻano maʻamau ma kahi interface ʻenekinia, kahi e hoʻonui ʻia ai ka omo ikehu ma muli o ke ʻano optical, thermal, a i ʻole kemika.
Ma kēia papa omo ikehu, alakaʻi ka hoʻomehana kūloko i kahi pahū wikiwiki, ka hoʻonui ʻana o ke kinoea, a i ʻole ka palaho ʻana o kahi papa interfacial (e laʻa, kahi kiʻi stressor a i ʻole ka oxide mōhai). ʻO kēia hoʻohaunaele i kāohi pono ʻia e hoʻokaʻawale maʻemaʻe i ka papa crystalline o luna - me ka mānoanoa o nā ʻumi micrometers - mai ka ingot kumu.
Hoʻohana ka Semiconductor Laser Lift-Off Equipment i nā poʻo scanning i hoʻonohonoho ʻia e ka neʻe ʻana, ka mana z-axis programmable, a me ka reflectometry manawa maoli e hōʻoia i ka hāʻawi ʻana o kēlā me kēia pulse i ka ikehu ma ka mokulele pahuhopu. Hiki ke hoʻonohonoho ʻia nā lako me nā mana burst-mode a i ʻole multi-pulse e hoʻonui i ka maʻalahi o ka wehe ʻana a hoʻemi i ke koʻikoʻi koena. ʻO ka mea nui, no ka mea, ʻaʻole pili kino ke kukuna laser i ka mea, ua emi nui ka pilikia o ka microcracking, kūlou, a i ʻole ka chipping o ka ʻili.
ʻO kēia ka mea e hoʻololi nui ai ke ʻano hana hoʻokiʻekiʻe laser, ʻoi aku hoʻi i nā noi kahi e pono ai nā wafers ultra-flat, ultra-thin me ka sub-micron TTV (Total Thickness Variation).
Ka palena o nā lako hana hāpai laser Semiconductor
| Ka lōʻihi o ka nalu | IR/SHG/THG/FHG |
|---|---|
| Ka laulā o ka Pulse | Nanosekona, Picosekona, Femtosekona |
| ʻŌnaehana Optical | ʻŌnaehana optical paʻa a i ʻole ʻōnaehana Galvano-optical |
| Kahua XY | 500 mm × 500 mm |
| Pae Hana | 160 mm |
| Ka wikiwiki o ka neʻe ʻana | Max 1,000 mm/kekona |
| Ka hana hou ʻana | ±1 μm a emi mai paha |
| Ka Pololei Kūlana Loa: | ±5 μm a emi mai paha |
| Ka nui o ka Wafer | 2–6 ʻīniha a i ʻole i hoʻopilikino ʻia |
| Mana | Windows 10,11 a me PLC |
| Voltage Lako Mana | AC 200 V ±20 V, Pae hoʻokahi, 50/60 kHz |
| Nā Ana o Waho | 2400 mm (W) × 1700 mm (H) × 2000 mm (H) |
| Kaumaha | 1,000 kg |
Nā Noi ʻOihana o nā Lako Hana Lift-Off Laser
Ke hoʻololi koke nei nā lako hana hoʻokiʻekiʻe laser semiconductor i ke ʻano o ka hoʻomākaukau ʻana o nā mea ma nā ʻāpana semiconductor he nui:
- Nā Mana Mana GaN Vertical o nā Lako Hana Lift-Off Laser
ʻO ka hoʻokaʻawale ʻana o nā kiʻiʻoniʻoni GaN-on-GaN lahilahi loa mai nā ingots nui e hiki ai i nā hoʻolālā hoʻoili kū pololei a me ka hoʻohana hou ʻana i nā substrates pipiʻi.
- ʻO ka SiC Wafer Thinning no nā polokalamu Schottky a me MOSFET
Hoʻemi i ka mānoanoa o ka papa o ka hāmeʻa me ka mālama ʻana i ka planarity o ka substrate - kūpono no nā mea uila mana hoʻololi wikiwiki.
- Nā Mea LED a me nā Mea Hōʻikeʻike Sapphire o nā Lako Hana Lift-Off Laser
Hoʻāla i ka hoʻokaʻawale pono ʻana o nā papa hāmeʻa mai nā boules sapphire e kākoʻo i ka hana micro-LED lahilahi a hoʻomaikaʻi ʻia i ka wela.
- ʻEnekinia Mea III-V o nā Lako Hana Hoʻokiʻekiʻe Laser
Hoʻomaʻalahi i ka hoʻokaʻawale ʻana o nā papa GaAs, InP, a me AlGaN no ka hoʻohui optoelectronic holomua.
- IC Wafer Lahilahi a me ka Hana ʻIke
Hoʻopuka i nā papa hana lahilahi no nā mea ʻike kaomi, nā accelerometers, a i ʻole nā photodiodes, kahi i pilikia ai ka nui i ka hana.
- Nā Uila Maʻalahi a Moakaka
Hoʻomākaukau i nā substrates lahilahi loa i kūpono no nā hōʻikeʻike maʻalahi, nā kaapuni hiki ke komo, a me nā puka makani akamai moakaka.
Ma kēlā me kēia mau wahi, he kuleana koʻikoʻi ko nā lako hana Semiconductor Laser Lift-Off i ka hiki ʻana i ka miniaturization, ka hoʻohana hou ʻana i nā mea, a me ka maʻalahi o ke kaʻina hana.
Nā Nīnau i Nīnau Pinepine ʻia (FAQ) o nā Lako Hana Lift-Off Laser
Q1: He aha ka mānoanoa liʻiliʻi loa e hiki iaʻu ke hoʻokō me ka hoʻohana ʻana i nā lako hana Semiconductor Laser Lift-Off?
A1:ʻO ka maʻamau ma waena o 10-30 microns ma muli o ka mea. Hiki i ke kaʻina hana ke hoʻomāmā i nā hopena me nā hoʻonohonoho i hoʻololi ʻia.
Q2: Hiki ke hoʻohana ʻia kēia e ʻoki i nā wafers he nui mai ka ingot like?
A2:ʻAe. Hoʻohana ka nui o nā mea kūʻai aku i ke ʻano hana laser lift-off e hana i nā unuhi serial o nā papa lahilahi he nui mai hoʻokahi ingot nui.
Q3: He aha nā hiʻohiʻona palekana i hoʻokomo ʻia no ka hana laser mana kiʻekiʻe?
A3:ʻO nā pā papa 1, nā ʻōnaehana laka, ka pale ʻana i ke kaola, a me nā pani ʻakomi he mea maʻamau ia.
Q4: Pehea e hoʻohālikelike ai kēia ʻōnaehana me nā ʻoki uea daimana ma ke ʻano o ke kumukūʻai?
A4:ʻOiai paha ke kiʻekiʻe aʻe o ke kāpena mua, hoʻemi nui ka laser lift-off i nā kumukūʻai hoʻopau, ka hōʻino ʻana o ka substrate, a me nā ʻanuʻu hana ma hope - e hoʻohaʻahaʻa ana i ka huina kumukūʻai o ka loaʻa ʻana (TCO) i ka wā lōʻihi.
Q5: Hiki ke hoʻonui ʻia ke kaʻina hana i nā ʻāpana 6-'īniha a i ʻole 8-'īniha?
A5:ʻAe nō. Kākoʻo ke kahua i nā substrates a hiki i 12-'īniha me ka hoʻolaha like ʻana o ke kukuna a me nā pae neʻe nui.
E pili ana iā mākou
He loea ʻo XKH i ka hoʻomohala ʻenehana kiʻekiʻe, ka hana ʻana, a me ke kūʻai aku ʻana i ke aniani optical kūikawā a me nā mea kristal hou. Lawelawe kā mākou huahana i nā mea uila optical, nā mea uila mea kūʻai aku, a me ka pūʻali koa. Hāʻawi mākou i nā ʻāpana optical Sapphire, nā uhi lens kelepona paʻalima, Ceramics, LT, Silicon Carbide SIC, Quartz, a me nā wafers kristal semiconductor. Me ka ʻike loea a me nā lako hana kiʻekiʻe, ʻoi aku mākou i ka hana ʻana i nā huahana maʻamau ʻole, me ka manaʻo e lilo i alakaʻi i nā mea optoelectronic ʻoihana ʻenehana kiʻekiʻe.
