Mea Hoʻokiʻekiʻe-Off Semiconductor Laser

Nā Lako Semiconductor Laser Lift-Off Kiʻi Hōʻikeʻike

ʻO ka wehewehe pōkole:

Hōʻike ka Semiconductor Laser Lift-Off Equipment i kahi hopena o ka hanauna e hiki mai ana no ka hoʻoheheʻe ʻana i ka ingot kiʻekiʻe i ka hana semiconductor material. ʻAʻole e like me nā ʻano wafering kuʻuna e hilinaʻi nei i ka wili mīkini, ka ʻili uwea daimana, a i ʻole ka hoʻolālā ʻana i ka mīkini-mechanical, hāʻawi kēia kahua hoʻokumu i ka laser i kahi ʻokoʻa pili ʻole, ʻaʻole luku no ka wehe ʻana i nā papa ultra-thin mai nā ingots semiconductor nui.

Hoʻolālā ʻia no nā mea palupalu a waiwai nui e like me gallium nitride (GaN), silicon carbide (SiC), sapphire, a me gallium arsenide (GaAs), hiki i ka Semiconductor Laser Lift-Off Equipment ke ʻoki pololei i nā kiʻiʻoniʻoni wafer-scale pololei mai ka ingot kristal. ʻO kēia ʻenehana holomua e hōʻemi nui i ka ʻōpala waiwai, hoʻomaikaʻi i ka throughput, a hoʻonui i ka pono o ka substrate - he mea koʻikoʻi ia mau mea āpau no nā mea hana e hiki mai ana i ka uila uila, ʻōnaehana RF, photonics, a me nā micro-displays.

E hoʻouna i ka leka uila iā mākou

Nā hiʻohiʻona

Kiʻi kikoʻī

Nānā Huahana o nā Lako Ho'oki'eki'e Laser

Me ka manaʻo nui i ka mana automated, beam shaping, a me ka laser-material interaction analytics, ua hoʻolālā ʻia ka Semiconductor Laser Lift-Off Equipment e hoʻohui pono i nā kahe hana semiconductor oiai e kākoʻo ana i ka loli R&D a me ka scalability hana nui.

ʻenehana a me ka loina hana o nā mea hoʻohana laser lift-off

Hoʻomaka ka hana i hana ʻia e Semiconductor Laser Lift-Off Equipment ma ka hoʻomālamalama ʻana i ka ingot hāʻawi mai kekahi ʻaoʻao me ka hoʻohana ʻana i kahi kukui uila ultraviolet kiʻekiʻe. Hoʻopaʻa paʻa ʻia kēia kukuna i kahi hohonu kūloko kikoʻī, maʻamau me kahi interface ʻenekinia, kahi i hoʻonui ʻia ai ka hoʻonui ʻana o ka ikehu ma muli o ka ʻokoʻa o ka optical, thermal, a i ʻole kemika.

Ma kēia ʻāpana hoʻoheheʻe ikehu, alakaʻi ka hoʻomehana kūloko i kahi micro-explosion, hoʻonui kinoea, a i ʻole decomposition o kahi papa interfacial (e laʻa, he kiʻiʻoniʻoni hoʻoluhi a i ʻole ʻokikene mōhai). ʻO kēia kaohi pono ʻia e hoʻokaʻawale maʻemaʻe ai ka papa crystalline luna - me ka mānoanoa o nā ʻumi micrometers.

Hoʻohana ka Semiconductor Laser Lift-Off Equipment i nā poʻo scanning motion-synchronized, programmable z-axis control, a me ka reflectometry manawa maoli e hōʻoia i kēlā me kēia pulse e hāʻawi i ka ikehu ma ka mokulele i kuhikuhi ʻia. Hiki ke hoʻonohonoho ʻia nā mea hana me ka burst-mode a i ʻole multi-pulse hiki ke hoʻonui i ka maʻalahi o ka detachment a hōʻemi i ke koena o ke kaumaha. ʻO ka mea nui, no ka mea, ʻaʻole pili ka kukuna laser i ke kino, ua hoʻemi nui ʻia ka pilikia o ka microcracking, kūlou, a i ʻole ka ʻili ʻana o ka ʻili.

Hoʻololi kēia i ke ʻano hoʻololi pāʻani i ke ʻano hoʻololi pāʻani, ʻoi aku ka nui o nā noi kahi e koi ʻia ai nā wafers ultra-flat, ultra-thin me ka sub-micron TTV (Total Thickness Variation).

Ka palena o ka Lako Lift-Off Semiconductor Laser

Loʻihi nalu	IR/SHG/THG/FHG
Pulse Laulā	Nanokekona, Picosecond, Femtosecond
Pūnaehana Optical	Pūnaehana optical paʻa a i ʻole ʻōnaehana Galvano-optical
XY Pae	500 mm × 500 mm
Kaʻina Hana	160 mm
Holo ka māmā	1,000 mm/sec
Hiki hou	±1 μm a emi mai paha
Pololei Kūlana Loa:	±5 μm a emi mai paha
Nui Wafer	2-6 iniha a i hoʻopilikino ʻia
Manao	Windows 10,11 a me PLC
Voltage Mana	AC 200 V ± 20 V, Māhele hoʻokahi, 50/60 kHz
Nā Ana Kūwaho	2400 mm (W) × 1700 mm (D) × 2000 mm (H)
Kaumaha	1,000 kg

Noi Hana Hana o Laser Lift-Off Lako

Ke hoʻololi wikiwiki nei ka Semiconductor Laser Lift-Off Equipment i ka hoʻomākaukau ʻana o nā mea waiwai ma nā kikowaena semiconductor he nui:

Nā Mana Mana Vertical GaN o nā Lako Hoʻokiʻekiʻe Laser

ʻO ka hoʻokuʻu ʻia ʻana o nā kiʻiʻoniʻoni GaN-on-GaN ultra-thin mai nā ingots nui e hiki ai i nā kiʻi hoʻokele kūʻokoʻa a hoʻohana hou i nā substrates pipiʻi.

ʻO SiC Wafer Thinning no nā polokalamu Schottky a me MOSFET

E ho'ēmi i ka mānoanoa o ka papa hana me ka mālama ʻana i ka planarity substrate - kūpono no ka hoʻololi wikiwiki ʻana i ka uila uila.

ʻO nā LED ma muli o ka Sapphire a me nā mea hōʻikeʻike o nā mea hana Laser Lift-Off

Hiki iā ia ke hoʻokaʻawale maikaʻi i nā papa hana mai nā boule sapphire e kākoʻo i ka hana micro-LED lahilahi, thermally optimized.

III-V Mea Hana 'enekinia o Laser Lift-Off Lako

Hoʻomaʻamaʻa i ka wehe ʻana o nā papa GaAs, InP, a me AlGaN no ka hoʻohui optoelectronic holomua.

Hana ʻia ʻo IC-Wafer a me ka sensor

Hoʻopuka i nā papa hana lahilahi no nā mea ʻike kaomi, accelerometers, a i ʻole photodiodes, kahi nui ka bottleneck hana.

ʻO nā mea uila hikiwawe a mālohi

Hoʻomākaukau i nā substrate ultra-thin kūpono no nā hōʻike maʻalahi, nā kaapuni hiki ke komo, a me nā puka aniani akamai.

Ma kēlā me kēia o kēia mau wahi, he hana koʻikoʻi ka Semiconductor Laser Lift-Off Equipment i ka hiki ʻana i ka miniaturization, ka hoʻohana hou ʻana i nā mea, a me ka maʻalahi o ka hana.

Nā nīnau i nīnau pinepine ʻia (FAQ) o nā mea hana Laser Lift-Off

Q1: He aha ka mānoanoa liʻiliʻi e hiki iaʻu ke hoʻohana me ka Semiconductor Laser Lift-Off Equipment?
A1:ʻO ka maʻamau ma waena o 10-30 microns e pili ana i ka mea. Hiki i ke kaʻina hana ke hoʻonui i nā hopena me nā hoʻonohonoho i hoʻololi ʻia.

Q2: Hiki ke hoʻohana ʻia kēia e ʻoki i nā wafers he nui mai ka ingot like?
A2:ʻAe. Hoʻohana ka nui o nā mea kūʻai aku i ka ʻenehana hoʻokiʻekiʻe laser e hana i nā unuhi serial o nā ʻāpana lahilahi he nui mai kahi ingot nui.

Q3: He aha nā hiʻohiʻona palekana i hoʻokomo ʻia no ka hana laser mana kiʻekiʻe?
A3:ʻO nā pā papa 1, nā ʻōnaehana interlock, ka pale kukui, a me nā pani ʻakomi nā mea maʻamau.

Q4: Pehea ka hoʻohālikelike ʻana o kēia ʻōnaehana me nā ʻili uea daimana ma ke ʻano o ke kumukūʻai?
A4:ʻOiai ʻoi aku ka kiʻekiʻe o ka capex mua, hoʻemi nui ka laser lift-off i nā kumukūʻai pau, ka pōʻino o ka substrate, a me nā ʻanuʻu ma hope o ka hoʻoponopono ʻana - e hoʻohaʻahaʻa i ka huina o ke kumu kūʻai (TCO) no ka wā lōʻihi.

Q5: Hiki ke hoʻonui ʻia ke kaʻina hana i 6-inch a i ʻole 8-inch ingots?
A5:ʻOiaʻiʻo. Kākoʻo ka paepae i nā substrates 12-ʻīniha me ka hāʻawi ʻana i nā kukui ʻaʻahu a me nā pae neʻe nui.

E pili ana iā mākou

Hoʻokumu ʻo XKH i ka hoʻomohala ʻenehana kiʻekiʻe, ka hana ʻana, a me ke kūʻai ʻana i nā aniani optical kūikawā a me nā mea aniani hou. Hāʻawi kā mākou huahana i nā uila uila, nā mea hoʻohana uila, a me ka pūʻali koa. Hāʻawi mākou i nā ʻāpana optical Sapphire, nā uhi kelepona kelepona paʻa, Ceramics, LT, Silicon Carbide SIC, Quartz, a me nā wafer kristal semiconductor. Me ka ʻike akamai a me nā mea hana ʻoki ʻoki, ʻoi aku mākou i ka hoʻoili huahana maʻamau ʻole, me ka manaʻo e lilo i alakaʻi optoelectronic material high-tech ʻoihana.