ʻO nā mea hana Semiconductor Laser Lift-Off e hoʻololi i ka hoʻoemi ʻana o Ingot

Nā Lako Semiconductor Laser Lift-Off Revolutionize Ingot Thinning Featured Image

ʻO ka wehewehe pōkole:

ʻO ka Semiconductor Laser Lift-Off Equipment kahi ʻenehana loea kūikawā i hana ʻia no ka hoʻoheheʻe pololei ʻana a me ka pili ʻole o nā ingots semiconductor ma o nā ʻenehana hoʻokiʻekiʻe laser-induced. He hana koʻikoʻi kēia ʻōnaehana holomua i nā kaʻina wafering semiconductor hou, ʻoi aku ka nui o ka hana ʻana i nā wafers ultra-thin no nā uila uila kiʻekiʻe, nā LED, a me nā mea RF. Ma ka ʻae ʻana i ka hoʻokaʻawale ʻana o nā ʻāpana lahilahi mai nā ingots nui a i ʻole nā mea hāʻawi mea hāʻawi, Semiconductor Laser Lift-Off Equipment e hoʻololi i ka hoʻoheheʻe ʻana i ka ingot ma o ka hoʻopau ʻana i nā ʻenekini mīkini, wili, a me nā ʻanuʻu etching kemika.

E hoʻouna i ka leka uila iā mākou

Nā hiʻohiʻona

Kiʻi kikoʻī

Hoʻolauna Huahana o nā Lako Lift-Off Semiconductor Laser

ʻO ka hoʻomaʻemaʻe kuʻuna o nā semiconductor ingots, e like me ka gallium nitride (GaN), silicon carbide (SiC), a me ka sapphire, he mea hoʻoikaika pinepine, hoʻopau ʻole, a pili i nā microcracks a i ʻole ka pōʻino o ka ʻili. ʻO ka ʻokoʻa, hāʻawi ʻo Semiconductor Laser Lift-Off Equipment i kahi ʻokoʻa hoʻopau ʻole a pololei e hōʻemi ana i ka poho waiwai a me ke koʻikoʻi o ka ʻili i ka wā e hoʻonui ai i ka huahana. Kākoʻo ia i nā ʻano like ʻole o ka crystalline a me nā mea hoʻohuihui a hiki ke hoʻohui pono ʻia i nā laina hana semiconductor mua a i ʻole midstream.

Me nā lōʻihi hawewe laser hiki ke hoʻonohonoho ʻia, nā ʻōnaehana kikoʻī adaptive, a me nā pahu wafer kūpono ʻole, ua kūpono loa kēia mea hana no ka ʻoki ʻana i ka ingot, ka hana lamella, a me ka hoʻokaʻawale kiʻiʻoniʻoni ultra-thin no nā kūkulu ʻana o nā mea kū a i ʻole ka hoʻoili ʻana o ka heteroepitaxial layer.

Ka palena o ka Lako Lift-Off Semiconductor Laser

Loʻihi nalu	IR/SHG/THG/FHG
Pulse Laulā	Nanokekona, Picosecond, Femtosecond
Pūnaehana Optical	Pūnaehana optical paʻa a i ʻole ʻōnaehana Galvano-optical
XY Pae	500 mm × 500 mm
Kaʻina Hana	160 mm
Holo ka māmā	1,000 mm/sec
Hiki hou	±1 μm a emi mai paha
Pololei Kūlana Loa:	±5 μm a emi mai paha
Nui Wafer	2-6 iniha a i hoʻopilikino ʻia
Manao	Windows 10,11 a me PLC
Voltage Mana	AC 200 V ± 20 V, Māhele hoʻokahi, 50/60 kHz
Nā Ana Kūwaho	2400 mm (W) × 1700 mm (D) × 2000 mm (H)
Kaumaha	1,000 kg

Ke Kumu Hana o ka Lako Lift-Off Semiconductor Laser

ʻO ke kumu kumu o ka Semiconductor Laser Lift-Off Equipment e hilinaʻi ana i ka decomposition photothermal koho a i ʻole ablation ma ke kikowaena ma waena o ka mea hāʻawi ingot a me ka epitaxial a i ʻole ka papa kuhikuhi. Hoʻopili ʻia kahi laser UV ikaika nui (ʻo ia hoʻi ʻo KrF ma 248 nm a i ʻole nā lasers UV solid-state ma kahi o 355 nm) e kālele ʻia ma o kahi mea hāʻawi hāʻawi a semi-transparent, kahi e hoʻopili ʻia ai ka ikehu ma kahi hohonu i koho mua ʻia.

Hoʻokumu kēia hoʻoheheʻe ʻana i ka ikehu kūloko i kahi ʻāpana kinoea kiʻekiʻe a i ʻole ka papa hoʻonui wela ma ke kikowaena, kahi e hoʻomaka ai ka hoʻomaʻemaʻe ʻana o ka wafer luna a i ʻole ka papa hana mai ke kumu ingot. Hoʻoponopono maikaʻi ʻia ke kaʻina hana ma ka hoʻoponopono ʻana i nā ʻāpana e like me ka laula pulse, fluence laser, scanning speed, a me ka hohonu o ka z-axis. ʻO ka hopena he ʻāpana lahilahi loa—pinepine ma ka laulā 10 a 50 µm—i hoʻokaʻawale maʻemaʻe ʻia mai ka ingot makua me ka ʻole o ka abrasion mechanical.

ʻO kēia ʻano o ka hoʻokiʻekiʻe ʻana i ka laser no ka hoʻoheheʻe ʻana i ka ingot e pale aku i ka poho kerf a me ka pōʻino o ka ʻili e pili ana i ka ʻili uea daimana a i ʻole ka lapping mechanical. Mālama pū ʻo ia i ka pono aniani a hōʻemi i nā koi polishing downstream, e hana ana i ka Semiconductor Laser Lift-Off Equipment i mea hana hoʻololi pāʻani no ka hana wafer hanauna hou.

ʻO nā mea hana Semiconductor Laser Lift-Off e hoʻololi i ka hoʻoemi ʻana o Ingot 2

Noi o ka Semiconductor Laser Lift-Off Lako

Loaʻa ka Semiconductor Laser Lift-Off Equipment i ka hoʻohana nui ʻana i ka hoʻoheheʻe ʻana i ka ingot ma waena o nā ʻano mea holomua a me nā ʻano mea hana, me:

ʻO GaN a me GaAs Ingot Thinning no nā mea mana
Hiki i ka hana ʻana i ka wafer lahilahi no nā transistors mana haʻahaʻa haʻahaʻa a me nā diodes.

ʻO SiC Substrate Reclamation a me Lamella Separation
E ʻae i ka hoʻokiʻekiʻe ʻana i ka nui o ka wafer mai nā substrate SiC nui no ka hoʻolālā ʻana o nā mea hana a me ka hoʻohana hou ʻana i ka wafer.

LED Wafer Slicing
Hoʻomaʻamaʻa i ka hoʻokuʻu ʻana i nā papa GaN mai nā ingots sapphire mānoanoa e hana i nā substrate LED ultra-thin.

RF a me ka Microwave Mea Hana Hana
Kākoʻo i nā hale transistor (HEMT) ultra-thin high-electron-mobility transistor e pono ai ma 5G a me nā ʻōnaehana radar.

Epitaxial Layer Transfer
Hoʻokaʻawale pololei i nā papa epitaxial mai nā ingots crystalline no ka hoʻohana hou ʻana a i ʻole ka hoʻohui ʻana i nā heterostructure.

Nā Kiʻiʻoniʻoni ʻoniʻoni ʻoniʻoni a me nā Photovoltaics
Hoʻohana ʻia no ka hoʻokaʻawale ʻana i nā ʻāpana hoʻoheheʻe lahilahi no nā cell solar maʻalahi a kiʻekiʻe.

Ma kēlā me kēia o kēia mau kikowaena, hāʻawi ka Semiconductor Laser Lift-Off Equipment i ka mana like ʻole ma luna o ka like ʻole o ka mānoanoa, ka maikaʻi o ka ʻili, a me ka pono o ka papa.

ʻO nā mea maikaʻi o ka hoʻoheheʻe ʻana i ka Ingot

Nalo waiwai Zero-Kerf
Ke hoʻohālikelike ʻia i nā ʻano hana ʻoki wafer kuʻuna, ʻo ke kaʻina laser ka hopena ma kahi o 100% ka hoʻohana ʻana i nā mea.

ʻO ke koʻikoʻi liʻiliʻi a me ka warping
Hoʻopau ka hoʻokiʻekiʻe pili ʻole i ka haʻalulu mechanical, hōʻemi i ke kakaka wafer a me ka hoʻokumu ʻana o ka microcrack.

Mālama maikaʻi o ka ʻili
ʻAʻole koi ʻia ka lapping post-thinning a polishing i nā hihia he nui, no ka mea, mālama ka laser lift-off i ka pono o luna.

Mākaukau ʻo High Throughput a me Automation
Hiki iā ia ke hoʻoponopono i nā haneli o nā substrate i kēlā me kēia neʻe me ka hoʻouka / hoʻoiho ʻana.

Hiki ke hoʻololi i nā mea he nui
He kūpono me GaN, SiC, sapphire, GaA, a me nā mea III-V e puka mai ana.

Palekana Kaiapuni
Hoʻemi i ka hoʻohana ʻana i nā mea abrasives a me nā kemika koʻikoʻi maʻamau i nā kaʻina hana slurry-based thinning.

Hoʻohana hou i ka substrate
Hiki ke hana hou ʻia nā mea hāʻawi kālā no nā pōʻai hoʻokiʻekiʻe he nui, e hōʻemi nui ana i nā kumu kūʻai.

Nā nīnau i nīnau pinepine ʻia (FAQ) o Semiconductor Laser Lift-Off Equipment

Q1: He aha ka mānoanoa e hiki ai i ka Semiconductor Laser Lift-Off Equipment ke hoʻokō no nā ʻāpana wafer?
A1:Aia ka mānoanoa o ka ʻāpana maʻamau mai 10 µm a i 100 µm ma muli o ka mea a me ka hoʻonohonoho.

Q2: Hiki ke hoʻohana ʻia kēia mea hana i nā ingots lahilahi i hana ʻia me nā mea opaque e like me SiC?
A2:ʻAe. Ma ka hoʻopaʻa ʻana i ka lōʻihi hawewe laser a me ka hoʻomaikaʻi ʻana i ka ʻenekinia interface (e laʻa, nā mea hoʻolaʻa mōhai), hiki ke hana ʻia nā mea opaque.

Q3: Pehea e hoʻopili ʻia ai ka substrate hāʻawi ma mua o ka hāpai ʻana i ka laser?
A3:Hoʻohana ka ʻōnaehana i nā modula hoʻohālikelike sub-micron vision-based me nā manaʻo mai nā hōʻailona fiducial a me ka nānā ʻana i ka nānā ʻana i ka ʻili.

Q4: He aha ka manawa pōkole i manaʻo ʻia no hoʻokahi hana hoʻokiʻekiʻe laser?
A4:Ma muli o ka nui o ka wafer a me ka mānoanoa, mau kaʻina maʻamau mai 2 a 10 mau minuke.

Q5: Pono ke kaʻina hana i kahi lumi maʻemaʻe?
A5:ʻOiai ʻaʻole koi ʻia, ʻōlelo ʻia ka hoʻohui ʻana o ka lumi maʻemaʻe e mālama i ka maʻemaʻe substrate a me ka hua o nā mea hana i ka wā o nā hana kiʻekiʻe.

E pili ana iā mākou

Hoʻokumu ʻo XKH i ka hoʻomohala ʻenehana kiʻekiʻe, ka hana ʻana, a me ke kūʻai ʻana i nā aniani optical kūikawā a me nā mea aniani hou. Hāʻawi kā mākou huahana i nā uila uila, nā mea hoʻohana uila, a me ka pūʻali koa. Hāʻawi mākou i nā ʻāpana optical Sapphire, nā uhi kelepona kelepona paʻa, Ceramics, LT, Silicon Carbide SIC, Quartz, a me nā wafer kristal semiconductor. Me ka ʻike akamai a me nā mea hana ʻoki ʻoki, ʻoi aku mākou i ka hoʻoili huahana maʻamau ʻole, me ka manaʻo e lilo i alakaʻi optoelectronic material high-tech ʻoihana.