ʻO nā lako hana hāpai laser Semiconductor e hoʻololi i ka lahilahi o ka ingot
Kiʻikuhi kikoʻī
Hoʻolauna Huahana o nā Lako Hana Lift-Off Laser Semiconductor
ʻO ka Semiconductor Laser Lift-Off Equipment kahi hopena ʻoihana kūikawā loa i hana ʻia no ka lahilahi pololei a me ka ʻole o ka hoʻopili ʻana o nā ingots semiconductor ma o nā ʻano hana hāpai laser-induced. He kuleana koʻikoʻi kēia ʻōnaehana holomua i nā kaʻina hana wafering semiconductor hou, ʻoi aku hoʻi i ka hana ʻana o nā wafers ultra-thin no nā mea uila mana kiʻekiʻe, nā LED, a me nā mea RF. Ma ka hiki ʻana ke hoʻokaʻawale i nā papa lahilahi mai nā ingots nui a i ʻole nā substrates donor, hoʻololi ka Semiconductor Laser Lift-Off Equipment i ka lahilahi ingots ma ka hoʻopau ʻana i ka mechanical sawing, grinding, a me nā ʻanuʻu etching kemika.
ʻO ka hoʻomāmā kuʻuna ʻana i nā ʻots semiconductor, e like me ka gallium nitride (GaN), silicon carbide (SiC), a me ka sapphire, he hana nui ia, hoʻonele, a hiki ke loaʻa i nā microcracks a i ʻole ka hōʻino ʻana o ka ʻili. I ka hoʻohālikelike ʻana, hāʻawi nā Semiconductor Laser Lift-Off Equipment i kahi koho ʻē aʻe ʻaʻole luku, pololei e hōʻemi ana i ka nalowale o nā mea a me ke kaumaha o ka ʻili me ka hoʻonui ʻana i ka huahana. Kākoʻo ia i nā ʻano mea crystalline a me nā mea hui like ʻole a hiki ke hoʻohui pono ʻia i loko o nā laina hana semiconductor mua a waena paha.
Me nā nalu laser hiki ke hoʻonohonoho ʻia, nā ʻōnaehana hoʻoikaika adaptive, a me nā wafer chucks kūpono i ka vacuum, kūpono loa kēia lako no ka ʻoki ʻana i ka ingot, ka hana ʻana i nā lamella, a me ka hoʻokaʻawale ʻana i ka ʻili lahilahi loa no nā ʻano hana kū pololei a i ʻole ka hoʻoili ʻana o ka papa heteroepitaxial.
Ka palena o nā lako hana hāpai laser Semiconductor
| Ka lōʻihi o ka nalu | IR/SHG/THG/FHG |
|---|---|
| Ka laulā o ka Pulse | Nanosekona, Picosekona, Femtosekona |
| ʻŌnaehana Optical | ʻŌnaehana optical paʻa a i ʻole ʻōnaehana Galvano-optical |
| Kahua XY | 500 mm × 500 mm |
| Pae Hana | 160 mm |
| Ka wikiwiki o ka neʻe ʻana | Max 1,000 mm/kekona |
| Ka hana hou ʻana | ±1 μm a emi mai paha |
| Ka Pololei Kūlana Loa: | ±5 μm a emi mai paha |
| Ka nui o ka Wafer | 2–6 ʻīniha a i ʻole i hoʻopilikino ʻia |
| Mana | Windows 10,11 a me PLC |
| Voltage Lako Mana | AC 200 V ±20 V, Pae hoʻokahi, 50/60 kHz |
| Nā Ana o Waho | 2400 mm (W) × 1700 mm (H) × 2000 mm (H) |
| Kaumaha | 1,000 kg |
Kumumanaʻo Hana o nā Lako Hana Lift-Off Laser Semiconductor
ʻO ke ʻano hana koʻikoʻi o ka Semiconductor Laser Lift-Off Equipment e hilinaʻi nei i ka photothermal decomposition koho a i ʻole ka ablation ma ka interface ma waena o ka donor ingot a me ka epitaxial a i ʻole ka papa target. Hoʻopili ʻia kahi laser UV ikehu kiʻekiʻe (ʻo KrF ma 248 nm a i ʻole nā laser UV solid-state a puni 355 nm) ma o kahi mea donor moakaka a semi-moakaka paha, kahi e omo koho ʻia ai ka ikehu ma kahi hohonu i hoʻoholo mua ʻia.
Hoʻokumu kēia omo ikehu kūloko i kahi pae kinoea kiʻekiʻe-kaomi a i ʻole ka papa hoʻonui wela ma ka interface, kahi e hoʻomaka ai i ka delamination maʻemaʻe o ka wafer luna a i ʻole ka papa hāmeʻa mai ke kumu ingot. Hoʻoponopono maikaʻi ʻia ke kaʻina hana ma ka hoʻoponopono ʻana i nā palena e like me ka laulā pulse, ka fluence laser, ka wikiwiki scanning, a me ka hohonu focal z-axis. ʻO ka hopena he ʻāpana lahilahi loa—pinepine i ka pae 10 a 50 µm—i hoʻokaʻawale maʻemaʻe ʻia mai ka ingot makua me ka ʻole o ka abrasion mechanical.
ʻO kēia ʻano hana o ka hāpai ʻana i ka laser no ka lahilahi ʻana o ka ingot e pale aku i ka nalowale o kerf a me ka hōʻino ʻana o ka ʻili e pili ana me ka ʻoki ʻana i ka uea daimana a i ʻole ka mīkini lapping. Mālama pū ia i ka pono o ke kristal a hōʻemi i nā koi polishing ma lalo, e hoʻolilo ana i ka Semiconductor Laser Lift-Off Equipment i mea hana hoʻololi pāʻani no ka hana wafer hanauna hou.
Nā noi o nā lako hana hāpai laser Semiconductor
Loaʻa i nā lako hana Semiconductor Laser Lift-Off ka hoʻohana nui ʻana i ka lahilahi ingot ma waena o nā ʻano mea holomua a me nā ʻano hāmeʻa, me:
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Ka Hoʻomāmā ʻana i ka Ingot GaN a me GaAs no nā Mea Hana Mana
Hoʻāla i ka hana ʻana i ka wafer lahilahi no nā transistors mana kiʻekiʻe a haʻahaʻa ke kū'ē.
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Ka Hoʻihoʻi ʻana o ka Substrate SiC a me ka Hoʻokaʻawale ʻana o Lamella
ʻAe i ka hāpai ʻana i ka wafer-scale mai nā substrates SiC nui no nā ʻano hana kū pololei a me ka hoʻohana hou ʻana i ka wafer.
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ʻOki ʻana i ka Wafer LED
Hoʻomaʻalahi i ka hāpai ʻana o nā papa GaN mai nā ʻots sapphire mānoanoa e hana i nā substrates LED lahilahi loa.
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Hana ʻana i nā hāmeʻa RF a me Microwave
Kākoʻo i nā ʻano transistor high-electron-mobility (HEMT) ultra-thin e pono ai i nā ʻōnaehana 5G a me nā radar.
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Hoʻoili Papa Epitaxial
Hoʻokaʻawale pololei i nā papa epitaxial mai nā ingots crystalline no ka hoʻohana hou ʻana a i ʻole ka hoʻohui ʻana i loko o nā heterostructures.
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Nā Kelepona Lā ʻAlani Lahilahi a me nā Photovoltaics
Hoʻohana ʻia e hoʻokaʻawale i nā papa hoʻomoʻa lahilahi no nā pūnaewele solar maʻalahi a kūpono paha.
Ma kēlā me kēia mau ʻāpana, hāʻawi nā Semiconductor Laser Lift-Off Equipment i ka mana kūlike ʻole ma luna o ke ʻano o ka mānoanoa, ka maikaʻi o ka ʻili, a me ka kūpaʻa o ka papa.
Nā Pōmaikaʻi o ka Laser-Based Ingot Thinning
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Pohō Mea ʻOle-Kerf
Ke hoʻohālikelike ʻia me nā ʻano ʻoki wafer kuʻuna, ʻo ka hopena o ke kaʻina hana laser he aneane 100% ka hoʻohana ʻana i nā mea.
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Ka Hoʻoluhi Liʻiliʻi a me ke Kūlou ʻana
Hoʻopau ka hāpai ʻana me ka ʻole o ka hoʻopili ʻana i ka haʻalulu mechanical, e hōʻemi ana i ke kakaka wafer a me ka hoʻokumu ʻana o nā microcrack.
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Mālama ʻana i ka maikaʻi o ka ʻili
ʻAʻole pono ka lapping a i ʻole ka polishing ma hope o ka thinning i nā manawa he nui, no ka mea, mālama ka laser lift-off i ka pono o ka ʻili o luna.
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Mākaukau ka Throughput Kiʻekiʻe a me ka Automation
Hiki ke hana i nā haneli o nā substrates i kēlā me kēia neʻe me ka hoʻouka/wehe ʻana aunoa.
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Hiki ke hoʻololi i nā mea he nui
Kūlike me GaN, SiC, sapeiro, GaAs, a me nā mea III-V e kū mai ana.
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Palekana i ke Kaiapuni
Hoʻēmi i ka hoʻohana ʻana i nā abrasives a me nā kemika ʻino maʻamau i nā kaʻina hana lahilahi e pili ana i ka slurry.
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Hoʻohana hou ʻana i ka substrate
Hiki ke hana hou ʻia nā ʻoaka mea hāʻawi no nā pōʻaiapuni hāpai he nui, e hoʻemi nui ana i nā kumukūʻai mea.
Nā Nīnau i Nīnau Pinepine ʻia (FAQ) o nā Lako Hana Lift-Off Laser Semiconductor
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Q1: He aha ka laulā mānoanoa e hiki ai i ka Semiconductor Laser Lift-Off Equipment ke hoʻokō no nā ʻāpana wafer?
A1:ʻO ka mānoanoa maʻamau o ka ʻāpana mai 10 µm a 100 µm ma muli o ka mea a me ke ʻano.Q2: Hiki ke hoʻohana ʻia kēia lako e hoʻomāmā i nā ʻoaka i hana ʻia me nā mea opaque e like me SiC?
A2:ʻAe. Ma ka hoʻonohonoho ʻana i ka nalu laser a me ka hoʻonui ʻana i ka ʻenekinia interface (e laʻa, nā interlayers sacrificial), hiki ke hana ʻia nā mea opaque hapa.Q3: Pehea e hoʻonohonoho ʻia ai ka substrate donor ma mua o ka hāpai ʻana o ka laser?
A3:Hoʻohana ka ʻōnaehana i nā modula hoʻonohonoho e pili ana i ka ʻike sub-micron me nā manaʻo mai nā māka fiducial a me nā scan reflectivity surface.Q4: He aha ka manawa pōʻaiapuni i manaʻo ʻia no hoʻokahi hana hāpai laser?
A4:Ma muli o ka nui o ka wafer a me ka mānoanoa, ʻo nā pōʻaiapuni maʻamau e mau ana mai 2 a 10 mau minuke.Q5: Pono anei ke kaʻina hana i kahi lumi maʻemaʻe?
A5:ʻOiai ʻaʻole ia he mea koi, ua ʻōlelo ʻia ka hoʻohui ʻana o ka lumi maʻemaʻe e mālama i ka maʻemaʻe o ka substrate a me ka loaʻa ʻana o ka hāmeʻa i ka wā o nā hana kiʻekiʻe.
E pili ana iā mākou
He loea ʻo XKH i ka hoʻomohala ʻenehana kiʻekiʻe, ka hana ʻana, a me ke kūʻai aku ʻana i ke aniani optical kūikawā a me nā mea kristal hou. Lawelawe kā mākou huahana i nā mea uila optical, nā mea uila mea kūʻai aku, a me ka pūʻali koa. Hāʻawi mākou i nā ʻāpana optical Sapphire, nā uhi lens kelepona paʻalima, Ceramics, LT, Silicon Carbide SIC, Quartz, a me nā wafers kristal semiconductor. Me ka ʻike loea a me nā lako hana kiʻekiʻe, ʻoi aku mākou i ka hana ʻana i nā huahana maʻamau ʻole, me ka manaʻo e lilo i alakaʻi i nā mea optoelectronic ʻoihana ʻenehana kiʻekiʻe.
