ʻO ka umu ulu SiC Ingot no nā ʻano hana TSSG/LPE Crystal SiC nui-diameter

Wehewehe Pōkole:

Hoʻohana ka umu ulu ingot silicon carbide pae wai o XKH i nā ʻenehana TSSG (Top-Seeded Solution Growth) a me LPE (Liquid Phase Epitaxy) alakaʻi honua, i hoʻolālā kūikawā ʻia no ka ulu ʻana o ke kristal hoʻokahi SiC kiʻekiʻe. Hiki i ke ʻano TSSG ke ulu i nā ingot 4H/6H-SiC nui he 4-8 ʻīniha ma o ka gradient mahana pololei a me ka kaohi wikiwiki o ka hāpai ʻana i nā hua, ʻoiai ʻo ke ʻano LPE e hoʻomaʻamaʻa i ka ulu ʻana o nā papa epitaxial SiC i nā mahana haʻahaʻa, kūpono loa no nā papa epitaxial mānoanoa haʻahaʻa loa. Ua hoʻohana pono ʻia kēia ʻōnaehana ulu ingot silicon carbide pae wai i ka hana ʻoihana o nā kristal SiC like ʻole me ke ʻano 4H/6H-N a me ke ʻano insulating 4H/6H-SEMI, e hāʻawi ana i nā hopena piha mai nā lako a hiki i nā kaʻina hana.


Nā hiʻohiʻona

Kumu Hana

ʻO ke kumumanaʻo nui o ka ulu ʻana o ka silicon carbide ingot wai-phase e pili ana i ka hoʻoheheʻe ʻana i nā mea maka SiC maʻemaʻe kiʻekiʻe i loko o nā metala hoʻoheheʻe ʻia (e laʻa, Si, Cr) ma 1800-2100°C e hana i nā hopena saturated, a ukali ʻia e ka ulu ʻana o nā kristal SiC hoʻokahi ma nā kristal hua ma o ka gradient mahana pololei a me ka hoʻoponopono supersaturation. He kūpono loa kēia ʻenehana no ka hana ʻana i nā kristal hoʻokahi 4H/6H-SiC maʻemaʻe kiʻekiʻe (>99.9995%) me ka haʻahaʻa haʻahaʻa (<100/cm²), e hoʻokō ana i nā koi substrate koʻikoʻi no nā mea uila mana a me nā mea hana RF. Hiki i ka ʻōnaehana ulu wai-phase ke hoʻomalu pololei i ke ʻano conductivity kristal (ʻano N/P) a me ka resistivity ma o ka hoʻonohonoho ʻana o ka hopena i hoʻomaikaʻi ʻia a me nā palena ulu.

Nā ʻĀpana Koʻikoʻi

1. ʻŌnaehana ipu hoʻoheheʻe kūikawā: ipu hoʻoheheʻe graphite/tantalum kiʻekiʻe-maʻemaʻe, kūpaʻa wela >2200°C, kūpaʻa i ka SiC heheʻe corrosion.

2. ʻŌnaehana Hoʻomehana Multi-zone: Hoʻohui ʻia ka hoʻomehana kū'ē/induction me ka pololei o ka hoʻomalu mahana o ±0.5°C (1800-2100°C pae).

3. ʻŌnaehana Neʻe Kūpono: Mana pani pālua no ka hoʻohuli ʻana o ka hua (0-50rpm) a me ka hāpai ʻana (0.1-10mm/h).

4. ʻŌnaehana Mana Lewa: Palekana argon/naikokene kiʻekiʻe-maʻemaʻe, kaomi hana hiki ke hoʻololi ʻia (0.1-1atm).

5. ʻŌnaehana Mana Akamai: PLC + ka mana hoʻomalu hou ʻana o ka PC ʻoihana me ka nānā ʻana i ka pilina ulu manawa maoli.

6. ʻŌnaehana Hoʻoluʻu Kūpono: ʻO ka hoʻolālā hoʻoluʻu wai pae i hōʻoiaʻiʻo ʻia e hōʻoia i ka hana paʻa no ka wā lōʻihi.

Hoʻohālikelike ʻana o TSSG vs. LPE

Nā ʻano Ke ʻAno Hana TSSG Ke ʻAno LPE
Mahana ulu 2000-2100°C 1500-1800°C
Ka wikiwiki o ka ulu ʻana 0.2-1mm/h 5-50μm/h
Ka nui o ke aniani Nā ʻāpana 4-8 ʻīniha 50-500μm epi-papa
Noi Nui Hoʻomākaukau ʻana o ka substrate Nā papa epi-papa o ka hāmeʻa mana
Ka nui o ke kīnā <500/cm² <100/cm²
Nā Polytypes Kūpono 4H/6H-SiC 4H/3C-SiC

Nā Noi Koʻikoʻi

1. Nā Uila Mana: nā substrates 4H-SiC 6-'īniha no nā MOSFET/diodes 1200V+.

2. Nā Hāmeʻa RF 5G: Nā substrates SiC semi-insulating no nā PA kikowaena.

3. Nā noi EV: Nā papa epi mānoanoa loa (>200μm) no nā modula papa kaʻa.

4. Nā mea hoʻohuli PV: Nā substrates kīnā haʻahaʻa e hiki ai ke hoʻololi pono >99%.

Nā Pōmaikaʻi Koʻikoʻi

1. ʻOi aku ka maikaʻi o ka ʻenehana
1.1 Hoʻolālā Hana like ʻole i hoʻohui ʻia
Hoʻohui hou kēia ʻōnaehana ulu ʻano wai SiC i nā ʻenehana ulu kristal TSSG a me LPE. Hoʻohana ka ʻōnaehana TSSG i ka ulu ʻana o ka hopena top-seeded me ka convection melt pololei a me ka kaohi gradient mahana (ΔT≤5 ℃/cm), e hiki ai ke ulu paʻa o nā ʻano SiC nui 4-8 ʻīniha me nā hua holo hoʻokahi o 15-20kg no nā kristal 6H/4H-SiC. Hoʻohana ka ʻōnaehana LPE i ka haku mele solvent i hoʻomaikaʻi ʻia (ʻōnaehana alloy Si-Cr) a me ka kaohi supersaturation (± 1%) e ulu i nā papa epitaxial mānoanoa kiʻekiʻe me ka density kīnā <100/cm² ma nā mahana haʻahaʻa (1500-1800 ℃).

1.2 ʻŌnaehana Mana Akamai
Ua hoʻolako ʻia me ka mana ulu akamai o ka hanauna 4 e hōʻike ana i:
• Nānā ʻana i loko o ka wahi multi-spectral (400-2500nm ka laulā o ka nalu)
• ʻIke ʻana i ka pae heheʻe ma muli o ka laser (± 0.01mm pololei)
• Ka mana o ke anawaena pani ʻia ma muli o CCD (<±1mm fluctuation)
• Hoʻonui ʻia ke ʻano o ka ulu ʻana e AI (15% mālama ikehu)

2. Nā Pōmaikaʻi Hana Hana
2.1 Nā Ikaika Koʻikoʻi o ke Kaʻina Hana TSSG
• Ka hiki ke nui: Kākoʻo i ka ulu ʻana o ke aniani a hiki i ka 8-'īniha me ke ʻano like o ke anawaena >99.5%
• ʻOi aku ka maikaʻi o ke kristalina: Ka nui o ka neʻe ʻana <500/cm², ka nui o ka micropipe <5/cm²
• ʻAno like o ka doping: <8% ʻano kū'ē o ke ʻano n (nā wafers 4-'īniha)
• Ka wikiwiki o ka ulu ʻana i hoʻonohonoho pono ʻia: Hiki ke hoʻololi ʻia he 0.3-1.2mm/h, 3-5× wikiwiki ma mua o nā ʻano hana vapor-phase

2.2 Nā Ikaika Koʻikoʻi o ke Kaʻina Hana LPE
• Epitaxy kīnā haʻahaʻa loa: Ka nui o ke kūlana o ka interface <1×10¹¹cm⁻²·eV⁻¹
• Ka mana mānoanoa pololei: 50-500μm epi-papa me ka loli mānoanoa <±2%
• Ka pono o ka mahana haʻahaʻa: 300-500 ℃ haʻahaʻa ma mua o nā kaʻina hana CVD
• Ka ulu ʻana o ka ʻōnaehana paʻakikī: Kākoʻo i nā hui pn, nā superlattices, a pēlā aku.

3. Nā Pōmaikaʻi Hana Hana
3.1 Ka Mana ʻana i nā Kumukūʻai
• 85% ka hoʻohana ʻana i nā mea maka (vs. 60% maʻamau)
• 40% emi ka hoʻohana ʻana i ka ikehu (hoʻohālikelike ʻia me HVPE)
• 90% ka manawa hana o nā lako (hoʻemi ka hoʻolālā modular i ka manawa hana ʻole)

3.2 Hōʻoiaʻiʻo Kūlana
• 6σ ka mana hana (CPK>1.67)
• ʻIke ʻana i nā hemahema ma ka pūnaewele (hoʻonā 0.1μm)
• Ka hiki ke hahai ʻia ka ʻikepili hana piha (2000+ mau palena manawa maoli)

3.3 Ka hiki ke hoʻonui ʻia
• Kūlike me nā ʻano polytypes 4H/6H/3C
• Hiki ke hoʻonui ʻia i nā modula hana 12-'īniha
• Kākoʻo i ka hoʻohuihui hetero-SiC/GaN

4. Nā Pōmaikaʻi Noi ʻOihana
4.1 Nā Mea Hana Mana
• Nā substrates haʻahaʻa-resistivity (0.015-0.025Ω·cm) no nā mea hana 1200-3300V
• Nā substrates semi-insulating (>10⁸Ω·cm) no nā noi RF

4.2 Nā ʻenehana hou
• Kamaʻilio Quantum: Nā mea hoʻoheheʻe walaʻau haʻahaʻa loa (1/f walaʻau <-120dB)
• Nā wahi ʻino loa: Nā kristal pale i ka radiation (<5% degradation ma hope o ka hoʻomālamalama ʻana o 1 × 10¹⁶n/cm²)

Nā lawelawe XKH

1. Lako Hana i Hoʻopilikino ʻia: Nā hoʻonohonoho ʻōnaehana TSSG/LPE i hana kūikawā ʻia.
2. Ke Aʻo ʻana i ke Kaʻina Hana: Nā papahana hoʻomaʻamaʻa loea piha.
3. Kākoʻo ma hope o ke kūʻai aku: pane loea a me ka mālama ʻana i nā manawa a pau.
4. Nā Hoʻonā Turnkey: Lawelawe piha-spectrum mai ka hoʻouka ʻana a hiki i ka hōʻoia ʻana o ke kaʻina hana.
5. Hoʻolako Mea Hana: Loaʻa nā substrates SiC/epi-wafers 2-12 ʻīniha.

ʻO nā pono nui:
• Ka hiki ke ulu i ke aniani a hiki i ka 8-'īniha.
• ʻO ke kūlike o ke kū'ē ʻana <0.5%.
• Ka manawa hana o nā lako >95%.
• Kākoʻo loea 24/7.

ʻUmu ulu ʻano SiC 2
ʻUmu ulu ʻano SiC 3
ʻUmu ulu ʻano SiC 5

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