ʻO ka mīkini liʻiliʻiʻo Laser Lasching Pepa 1000w-6000W i liʻiliʻiʻo Aperture 0.1M

ʻO ka mīkini liʻiliʻi liʻiliʻiʻo Laser Lasching 1000w-6000W ka liʻiliʻiʻo Aperture 0.1ML

Kākau pōkole:

ʻO ka mīkini liʻiliʻiʻo Laser Laschingʻo Laser ka mea kiʻekiʻe loaʻo Laser i hoʻolālāʻia no ka hoʻomaʻamaʻa maikaʻiʻana. Hoʻohui ia i nāʻenehana Lasered Advanced a me ka pololei o ka hanaʻana i ka papa kuhikuhi ma Microron-Level Me kāna hoʻolālāʻana i ke kino e hoʻohālikelike ai, e pono ai ka hana hana pono a me nā hana hana e pili ana i nā pono hana o ka hana hou no ka nui o nā hana hou.

Ke hoʻohana nei i kahi papaʻo Laser me ka ikaika o ka ikaika e like me keʻano hana, e hiki ke hoʻopiliʻia, a me nā mea hoʻohālike a me ka pololei a me ka pololei o ka hana. I ka manawa like, kākoʻo nā mea hana i nāʻano puʻupuʻu palu a me ke kaʻina hana kaulike, hiki ke hoʻololi i nā mea hoʻohana.

Hoʻouna i ka leka uila iā mākou

Huahana kikoʻipiop

Nā Kūlana Huakaʻi

Mea pono

1. Nā Mea Kahupule: e like me alumini, Vicper, Titanium Alloy, Etc.

2.ʻO nā mea likeʻole: e like me ka plasticsyyylene pe, polyerte collast

3.ʻO nā mea hoʻohui hoʻohui: i hoʻohuiʻia i nā meaʻelua a iʻole nā mea hou aʻe me nā kumuwaiwai likeʻole ma waena o nāʻano kino a iʻole nā mea hoʻonaninani maikaʻi loa.

4. Loaʻa nā mea waiwai

Nā hiʻohiʻona kiko'ī

Inoa	'Ikeʻike
Laser Power:	1000w-6000w
ʻOkiʻoki i ka pololei:	± 0.00mm
ʻO ka Aperture-waiwai nui:	0.1mm
Lōʻihi o kaʻoki:	650mm × 800mm
Kūlana Kūlana:	≤ ± 0.008mm
Hōʻike hewa:	0.008mm
ʻO kaʻokiʻana:	Kōlea
Hoʻohālikelikeʻia:	Pneumatic CLAMPING CLAMPING, Kākoʻo kākoʻo
'Ōnaehana'ōnaehana:	Ke kaʻa kaʻa kaʻa kaʻa magnetic
ʻOkiʻoki i ka mānoanoa	0 0Pohalama-3mmm

Nā Manaʻiʻoniʻiina

1. Hoʻomaʻamaʻa i ka hana:ʻO ka hoʻohanaʻana o ka nui o ka mīkini kiʻekiʻe o ka mīkini non non-piliʻole, 1 kekona e hoʻopau ai i ka hoʻoiliʻana o nā lua liʻiliʻi.

2. MUCHISH SPOISH: E ka paleʻana i ka mana, pulse pinepine a me ka neʻeʻana i ke kūlana o ka laser, hiki ke hoʻokōʻia ka hana o ka micry.

4.ʻO ka hana akamai: ua lako ka mīkini laser laser me ka'ōnaehanaʻoihana a me ka maʻalahi o ka hoʻonohonohoʻana o ka kamepiula a me ke kaʻina hana.

Nā kūlana hana

1.Deversity: hiki ke hoʻokō i kahiʻano o keʻano paʻakikī o ka hoʻoiliʻana, e like me nā lua a me nā lua pākeke.

2. He kiʻekiʻe loa ka maikaʻi: He kiʻekiʻe ka maikaʻi o ka lua, he maloʻo kaʻaoʻao,ʻaʻole liʻiliʻi ka manaʻo, a liʻiliʻi ka deformation.

3.Atomation: Hiki iā ia ke hoʻopau i ka hoʻoiliʻana o ka micro-a me ka nui a me ka hoʻokaʻawaleʻana i ka aperture a me ka weheʻana i ka hana a me ka neʻeʻana o ka lua

Nā hiʻohiʻona nā mea hana

■ʻO ka nui liʻiliʻi o nā mea hana, e hoʻoponopono i ka pilikia o nā wahi liʻiliʻi.

■ʻO ka kiʻekiʻe kiʻekiʻe, hiki i ka lua ka lua ke hōʻea i ka 0.005mm.

■ maʻalahi nā mea hana e hana a maʻalahi hoʻi e hoʻohana.

■ Hiki ke hoʻololiʻia ke kumu māmā e like me nā mea likeʻole, a he ikaika ka hoʻohālikelike.

■

Kahua noi

1.ʻO nāʻoihana uila
● Ka Papa Helu Kānāwai (PCB) Punching:

Michhole matchning: hoʻohanaʻia no nā microholes me ka'āpana o ka lalo o ka ma lalo o 0.1mm ma nā pcbs e hoʻokō ai i nā papa hana kiʻekiʻe
Makapō a kanu i nā lua

● Semiconducoring Kuki:
Alakaʻi i nā pahu pahu hana: Ua hanaʻia nā lua pele i ka semiconnductor alakaʻi no ka hoʻopiliʻana i keʻano o ka carcuit o waho.
ʻO ke kōkua kālā e hoʻololiʻia: nā lua pālani i ka wafer e kōkua i ke kōkua ma hope o keʻokiʻana i nā kaʻina hana.

2.
● Nā Kūlana Kūʻai:
ʻO nā wahi kaiʻo Rulatini
ʻO ka mea hoʻowalewaleʻo Sensor

● Hōʻike Maʻanu hana:
ʻO Mod Holding Hole: Machining Falling Hole i ka Hole Marfction Mold a Died Cading Mod e hoʻonui i ka hana wela o ka neʻeʻana i ka wela.
ʻO ka hoʻoiliʻana o ka Vent: Maching i nā'āpana liʻiliʻi ma ka neʻeʻana i ka neʻe e hōʻemi i nā hemahema.

3, nā polokalamu lapaʻau
● MIMIMALY GRESSATIVE GRAGIcal GRESETES:
ʻO nā mokuahi catheter: ke kaʻinaʻia nā microholeles i nā mea i hikiʻole ai i nā mea hana hoʻonaninani liʻiliʻi no ka laweʻana i ka lāʻau lapaʻau a iʻole ka laweʻana.
Nā mea i hoʻopauʻia: Ua hanaʻia nā lua pelekikena: i nā kīwī a iʻole ke poʻo o ke poʻo o ka hopena e hoʻomaikaʻi ai i ka hana o ka mea hana.

● Hoʻomoe'ōnaehana Pūnaewele:
Microneedle array drilling:ʻO nā microholes ma kahi pahu lāʻau lapaʻau a iʻole microneedle hoʻonohonoho e mālama i ka wikiwiki o ka lāʻau.
ʻO Biochip Drull: Hoʻopiliʻia nā michileles i nā biochips no ka moʻomeheu a iʻole kaʻike.

4. Nā polokalamu Optical
● Ke kāpiliʻana i ka Pūnaewele Port
ʻO ka hopena o ka Flip Frber Frilling Frilling
ʻO ka papa inoaʻo Fiber Array

● He kānana kiʻi koho:
Kānana kānana
ʻO nā palapala machivation Elect:ʻO nā Michugelika ma nā microholes ma nā mea optical i nā mea optical no nā cholit cholit a iʻole ka luluʻana.

5.ʻO ka hana kaʻa kaʻa
● Hoʻomoe'ōnaehana wahie:
Injection nozzle punching

● Hana Sussior:
Ke kaomiʻana i ka Mushing Danhinging:ʻO ka Michookiss Microholes ma ke kaomiʻo Sensor Sensorgm e hoʻomaikaʻi i keʻano a me ka pololei o keʻano.

● Pūnaewele Minu:
ʻO ka pā uila Pole Chip drilling: Machnong Michoholes ma Lithium Battery Pole e hoʻomaikaʻi i ka uila

Hāʻawiʻo Xkh i kahi holoʻokoʻa o nā lawelawe āpau no nā papa hana liʻiliʻiʻo Laser, e pili ana i nāʻoihanaʻoihana