TGV Ma o ke aniani ma ke aniani BF33 Quartz JGS1 JGS2 Mea Sapphire
Hoʻolauna Huahana TGV
Loaʻa kā mākou TGV (Through Glass Via) i loko o nā ʻano mea waiwai e like me BF33 borosilicate glass, fused quartz, JGS1 a me JGS2 fused silica, a me sapphire (hoʻokahi kristal Al₂O₃). Ua koho ʻia kēia mau mea no kā lākou ʻano optical, thermal, a me mechanical, e hoʻolilo iā lākou i substrate kūpono no ka hoʻopili semiconductor kiʻekiʻe, MEMS, optoelectronics, a me nā noi microfluidic. Hāʻawi mākou i ka hana pololei e hoʻokō i kāu kikoʻī ma o nā ana a me nā koi metallization.
Papa TGV Mea a me na Waiwai
| Mea waiwai | ʻAno | ʻAno maʻamau |
|---|---|---|
| BF33 | Aniani Borosilicate | CTE haʻahaʻa, kūpaʻa wela maikaʻi, maʻalahi e wili a poli |
| Quartz | Silika Huipuia (SiO₂) | Haʻahaʻa haʻahaʻa CTE, kiʻekiʻe keʻokeʻo, ʻoi aku ka maikaʻi o ka uila uila |
| JGS1 | Kinohi Quartz Optical | ʻO ka hoʻouna kiʻekiʻe mai UV a i ka NIR, ʻaʻohe ʻōpala, maʻemaʻe kiʻekiʻe |
| JGS2 | Kinohi Quartz Optical | E like me JGS1, hiki i nā ʻōhū liʻiliʻi |
| Sapphire | Hookahi Crystal Al₂O₃ | Kiʻekiʻe paʻakikī, kiʻekiʻe thermal conductivity, RF insulation maikaʻi loa |
palapala noi TGV
Nā noi TGV:
Ma o Glass Via (TGV) ʻenehana i hoʻohana nui ʻia i nā microelectronics kiʻekiʻe a me optoelectronics. Loaʻa nā noi maʻamau:
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3D IC a me ka wafer-level packaging- hiki i ka hoʻohui ʻana i ka uila kū pololei ma o nā pani aniani no ka hoʻohui ʻana i ka paʻa kiʻekiʻe.
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Nā mea hana MEMS- hāʻawi i nā interposers aniani hermetic me through-vias no nā mea ʻike a me nā mea hana.
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Nā ʻāpana RF a me nā modula antenna- ka hoʻohana ʻana i ka nalo dielectric haʻahaʻa o ke aniani no ka hana kiʻekiʻe.
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Hoʻohui optoelectronic- e like me ka micro-lens arrays a me nā kaapuni photonic e koi ana i nā substrate insulating.
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Nā ʻāpana microfluidic- hoʻokomo i nā puka puka pololei no nā kahawai wai a me ke komo uila.
No XINKEHUI
ʻO Shanghai Xinkehui New Material Co., Ltd. kekahi o nā mea hoʻolako optical & semiconductor nui loa ma Kina, i hoʻokumu ʻia ma 2002. Ma XKH, loaʻa iā mākou kahi pūʻulu R&D ikaika i haku ʻia e nā ʻepekema ʻike a me nā ʻenekini i hoʻolaʻa ʻia i ka noiʻi a me ka hoʻomohala ʻana i nā mea uila kiʻekiʻe.
Hoʻoikaika ikaika kā mākou hui i nā papahana hou e like me TGV (Through Glass Via) ʻenehana, e hāʻawi ana i nā hopena kūpono no nā ʻano semiconductor a me nā noi photonic. Ke hoʻohana nei i ko mākou akamai, kākoʻo mākou i nā mea noiʻi hoʻonaʻauao a me nā hoa hana ʻenehana ma ka honua holoʻokoʻa me nā wafers kiʻekiʻe, substrates, a me ka hoʻoponopono aniani pololei.
Nā hoa pili honua
Me kā mākou ʻike loea semiconductor kiʻekiʻe, ua kūkulu ʻo XINKEHUI i nā pilina ākea a puni ka honua. Haʻaheo mākou e hana pū me nā hui alakaʻi honua e like meKoniaKeaniani Schott, ka mea e hiki ai iā mākou ke hoʻoikaika mau i kā mākou mau ʻenehana a hoʻokele i nā mea hou i nā wahi e like me TGV (Through Glass Via), uila uila, a me nā mea optoelectronic.
Ma o kēia mau pilina pili honua, ʻaʻole mākou e kākoʻo wale i nā noi ʻoihana ʻokiʻoki akā komo pū kekahi i nā papahana hoʻomohala hui e hoʻokau i nā palena o ka ʻenehana waiwai. Ma ka hana pū ʻana me kēia mau hoa hanohano, hōʻoia ʻo XINKEHUI e noho mākou ma ke alo o ka semiconductor a me ka ʻoihana uila kiʻekiʻe.
