ʻO ka Wafer Silikon i Uhi ʻia me ka Metala Ti/Cu (Titanium/Keleawe)

Kiʻi i hōʻike ʻia no ka Wafer Silicon i uhi ʻia me ka metala Ti/Cu (Titanium/Keleawe)

Wehewehe Pōkole:

ʻO kā mākouNā wafers silicon i uhi ʻia me ka metala Ti/Cuhōʻike i kahi substrate silicon kiʻekiʻe (a i ʻole ke aniani/quartz koho) i uhi ʻia me kahipapa hoʻopili titaniuma me kahipapa alakaʻi keleaweme ka hoʻohana ʻanaka hoʻoheheʻe ʻana o ka magnetron maʻamauHoʻomaikaʻi nui ka papa hana Ti i ka hoʻopili ʻana a me ke kūpaʻa o ke kaʻina hana, ʻoiai ʻo ka papa luna Cu e hāʻawi ana i kahi ʻili like, haʻahaʻa ke kūpaʻa kūpono no ka hoʻopili uila a me ka hana microfabrication ma lalo.

E leka uila mai iā mākou

Nā hiʻohiʻona

Kiʻikuhi kikoʻī

ʻO ka Wafer Silikon i Uhi ʻia me ka Metala Ti/Cu (Titanium/Keleawe)6

ʻIke laulā

Hoʻolālā ʻia no nā noiʻi a me nā noi hoʻāʻo, loaʻa kēia mau wafers i nā nui like ʻole a me nā pae resistivity, me ka hoʻopilikino maʻalahi no ka mānoanoa, ke ʻano substrate, a me ka hoʻonohonoho uhi.

Nā Hiʻohiʻona Koʻikoʻi

Hoʻopili ikaika a hilinaʻi hoʻi: Hoʻonui ka papa hoʻopaʻa Ti i ka pili ʻana o ka ʻili i ka Si/SiO₂ a hoʻomaikaʻi i ka paʻa o ka lawelawe ʻana
ʻIli conductivity kiʻekiʻeHāʻawi ka uhi ʻana o Cu i ka hana uila maikaʻi loa no nā pilina a me nā ʻano hoʻāʻo
Ka laulā hoʻopilikino ākea: ka nui o ka wafer, ka resistivity, ke kuhikuhi, ka mānoanoa o ka substrate, a me ka mānoanoa o ka ʻiliʻili i loaʻa ma ke noi
Nā substrates mākaukau no ke kaʻina hana: kūlike me nā kahe hana lab a me nā hana fab maʻamau (lithography, electroplating build-up, metrology, etc.)
Loaʻa nā moʻo mea: ma waho aʻe o Ti/Cu, hāʻawi pū mākou i nā wafers i uhi ʻia me ka metala ʻo Au, Pt, Al, Ni, Ag

ʻAno maʻamau a me ka waiho ʻana

Puʻu: Papa hoʻopili substrate + Ti + papa uhi Cu
Kaʻina hana maʻamau: Ka hoʻoheheʻe ʻana o ka Magnetron
Nā kaʻina hana koho: Hoʻoheheʻe wela / Electroplating (no nā koi Cu mānoanoa)

Nā Waiwai Mekanika o ke Aniani Quartz

Mea	Nā koho
Ka nui o ka wafer	2", 4", 6", 8"; 10×10 mm; nā nui ʻokiʻoki maʻamau
ʻAno alakaʻi	ʻAno-P / ʻAno-N / Kūʻē kiʻekiʻe kūloko (Un)
Hoʻonohonoho	<100>, <111>, a pēlā aku.
Ke kū'ē ʻana	<0.0015 Ω·cm; 1–10 Ω·cm; >1000–10000 Ω·cm
Mānoanoa (µm)	2": 200/280/400/500; 4": 450/500/525; 6": 625/650/675; 8": 650/700/725/775; maʻamau
Nā mea hana substrate	Silika; quartz koho, aniani BF33, a pēlā aku.
Mānoanoa o ke kiʻiʻoniʻoni	10 nm / 50 nm / 100 nm / 150 nm / 300 nm / 500 nm / 1 µm (hiki ke hoʻopilikino ʻia)
Nā koho ʻoniʻoni metala	Ti/Cu; loaʻa ʻo Au, Pt, Al, Ni, Ag

ʻO ka Wafer Silikon i Uhi ʻia me ka Metala Ti/Cu (Titanium/Keleawe)4

Nā noi

Hoʻopili Ohmic a me nā substrates conductiveno ka R&D hāmeʻa a me ka hoʻāʻo uila
Nā papa hua no ka electroplating(RDL, nā ʻano MEMS, ka hoʻonui ʻana o Cu mānoanoa)
Nā mea ulu sol-gel a me nā nanomaterialno ka noiʻi nano a me ka ʻili lahilahi
Mikroskopika a me ka metrology ʻili(Hoʻomākaukau a me ke ana ʻana o ka laʻana SEM/AFM/SPM)
Nā ʻili bio/kemikae like me nā kahua moʻomeheu cell, nā microarrays protein/DNA, a me nā substrates reflectometry

FAQ (Ti/Cu Metala-Ui Silikino Wafers)

Q1: No ke aha i hoʻohana ʻia ai kahi papa Ti ma lalo o ka uhi Cu?
A: Hana ʻo Titanium ma ke ʻano hepapa hoʻopili (hoʻopaʻa), hoʻomaikaʻi i ka hoʻopili ʻana o ke keleawe i ka substrate a hoʻonui i ke kūpaʻa o ka interface, kahi e kōkua ai i ka hōʻemi ʻana i ka peeling a i ʻole ka delamination i ka wā e lawelawe ai a me ka hana ʻana.

Q2: He aha ke ʻano maʻamau o ka mānoanoa o Ti/Cu?
A: ʻO nā hui pū ʻana maʻamau e komo pū meTi: nā ʻumi o nm (e laʻa, 10–50 nm)a meCu: 50–300 nmno nā kiʻiʻoniʻoni sputtered. Hoʻokō pinepine ʻia nā papa Cu mānoanoa (µm-level) eka hoʻopili ʻana ma luna o kahi papa hua Cu sputtered, ma muli o kāu noi.

Q3: Hiki iā ʻoe ke uhi i nā ʻaoʻao ʻelua o ka wafer?
ʻAe.ʻO ka uhi ʻaoʻao hoʻokahi a ʻaoʻao pālua pahaloaʻa ma ke noi. E ʻoluʻolu e kuhikuhi i kāu koi i ke kauoha ʻana.

E pili ana iā mākou

He loea ʻo XKH i ka hoʻomohala ʻenehana kiʻekiʻe, ka hana ʻana, a me ke kūʻai aku ʻana i ke aniani optical kūikawā a me nā mea kristal hou. Lawelawe kā mākou huahana i nā mea uila optical, nā mea uila mea kūʻai aku, a me ka pūʻali koa. Hāʻawi mākou i nā ʻāpana optical Sapphire, nā uhi lens kelepona paʻalima, Ceramics, LT, Silicon Carbide SIC, Quartz, a me nā wafers kristal semiconductor. Me ka ʻike loea a me nā lako hana kiʻekiʻe, ʻoi aku mākou i ka hana ʻana i nā huahana maʻamau ʻole, me ka manaʻo e lilo i alakaʻi i nā mea optoelectronic ʻoihana ʻenehana kiʻekiʻe.