Ke kaʻina hana TVG ma ka wafer quartz sapphire BF33 Ke kuʻi ʻana i ka wafer aniani

ʻO nā pono o TGV (Through Glass Via) e hōʻike nui ʻia ana ma:

1) Nā ʻano uila alapine kiʻekiʻe maikaʻi loa. He mea insulator ka mea aniani, ʻo ka dielectric constant ma kahi o 1/3 wale nō o ka mea silicon, ʻo ka mea pohō he 2-3 mau kauoha o ka nui ma mua o ka mea silicon, e hoʻemi nui ʻia ai ka pohō substrate a me nā hopena parasitic e hōʻoia i ka pono o ka hōʻailona i hoʻouna ʻia;

(2) He maʻalahi ke loaʻa ʻana o ka substrate aniani nui a lahilahi loa. Hiki iā mākou ke hāʻawi iā Sapphire, Quartz, Corning, a me SCHOTT a me nā mea hana aniani ʻē aʻe e hiki ke hāʻawi i ka aniani panela nui loa (>2m × 2m) a me nā aniani lahilahi loa (<50µm) a me nā mea aniani palupalu lahilahi loa.

3) Kumukūʻai haʻahaʻa. E pōmaikaʻi mai ka maʻalahi o ke komo ʻana i ke aniani panela lahilahi nui, a ʻaʻole pono ka waiho ʻana o nā papa insulating, ʻo ke kumukūʻai hana o ka papa adapter aniani he 1/8 wale nō o ka papa adapter silicon-based;

4) Kaʻina hana maʻalahi. ʻAʻohe pono e waiho i kahi papa insulating ma ka ʻili substrate a me ka paia o loko o ka TGV (Through Glass Via), a ʻaʻohe pono e lahilahi i loko o ka pā adapter ultra-thin;

(5) Paʻa ikaika o ka mīkini. ʻOiai inā emi ka mānoanoa o ka papa hoʻololi ma mua o 100µm, liʻiliʻi nō ka warpage;

6) Ka laulā o nā noi. Ma waho aʻe o nā manaʻolana noi maikaʻi ma ke kahua o ke alapine kiʻekiʻe, ma ke ʻano he mea aniani, hiki ke hoʻohana ʻia ma ke kahua o ka hoʻohui ʻana o ka ʻōnaehana optoelectronic, ʻo ka ea a me ke kūpaʻa i ka corrosion nā pono e hana ai i ka substrate aniani ma ke kahua o ka MEMS encapsulation he nui ka hiki.

I kēia manawa, hāʻawi kā mākou hui i ka ʻenehana aniani TGV (Through Glass Via), hiki ke hoʻonohonoho i ka hana ʻana o nā mea e hiki mai ana a hāʻawi pololei i ka huahana. Hiki iā mākou ke hāʻawi iā Sapphire, Quartz, Corning, a me SCHOTT, BF33 a me nā aniani ʻē aʻe. Inā he pono kāu, hiki iā ʻoe ke hoʻokaʻaʻike pololei mai iā mākou i kēlā me kēia manawa! Welina mai i ka nīnau!