Kaʻina TVG ma ka quartz sapphire BF33 wafer Glass wafer kuʻi

ʻO nā mea maikaʻi o TGV (Ma o Glass Via) i hōʻike nui ʻia ma:

1) ʻO nā hiʻohiʻona uila alapine kiʻekiʻe maikaʻi loa. ʻO ka mea aniani he mea insulator, ʻo ka dielectric mau ma kahi o 1/3 wale nō o ka mea silika, ʻo ka mea nalowale he 2-3 mau kauoha o ka nui ma lalo o ka mea silika, e hoʻemi nui ʻia ka poho substrate a me nā hopena parasitic e hōʻoia i ka ka pono o ka hōʻailona i hoʻounaʻia;

(2) He maʻalahi ka loaʻa ʻana o ka substrate aniani nui a me ka ultra-thin. Hiki iā mākou ke hāʻawi i ka Sapphire, Quartz, Corning, a me SCHOTT a me nā mea hana aniani ʻē aʻe hiki ke hāʻawi i ka nui nui (>2m × 2m) a me nā aniani panel ultra-thin (<50µm) a me nā mea aniani hikiwawe loa.

3) Ke kumu kūʻai haʻahaʻa. E pōmaikaʻi mai ka maʻalahi o ke komo ʻana i ke aniani panel ultra-thin nui, a ʻaʻole pono i ka deposition o nā papa insulating, ʻo ke kumukūʻai hana o ke aniani adapter plate aia wale nō ma kahi o 1/8 o ka pā mea hoʻopili silicon;

4) Kaʻina hana maʻalahi. ʻAʻole pono e waiho i kahi papa insulating ma ka ʻili o ka substrate a me ka paia i loko o ka TGV (Ma o Glass Via), a ʻaʻohe mea e koi ʻia i ka thinning ma ka pā hoʻololi ultra-thin;

(5) Paʻa mechanical ikaika. ʻOiai ʻoi aku ka liʻiliʻi o ka mānoanoa o ka pā adapter ma mua o 100µm, liʻiliʻi ka warpage;

6) Nui o nā noi. Ma waho aʻe o ka maikaʻi noi prospects i loko o ke kahua o kiʻekiʻe-frequency, e like me ka malamalama mea, hiki no hoi ke hoʻohana 'ia i loko o ke kahua o ka optoelectronic'ōnaehana hoʻohui, airtightness a me ka corrosion kū'ē pono e hana i ka aniani substrate i loko o ke kahua o MEMS encapsulation i nui mana.

I kēia manawa, hāʻawi kā mākou hui i ke aniani TGV (Through Glass Via) ma o ka ʻenehana hole, hiki ke hoʻonohonoho i ka hana ʻana o nā mea komo a hāʻawi pololei i ka huahana. Hiki iā mākou ke hāʻawi iā Sapphire, Quartz, Corning, a me SCHOTT, BF33 a me nā aniani ʻē aʻe. Inā he hemahema kāu, hiki iā ʻoe ke hoʻokaʻaʻike pololei mai iā mākou i kēlā me kēia manawa! Welina nīnau!