ʻO ka substrate SiC 3'iniha 350um ka mānoanoa HPSI ʻano Prime Grade Dummy grade
Nā Waiwai
| Palena | Papa Hana | Papa Noiʻi | Papa Dummy | ʻĀpana |
| Papa | Papa Hana | Papa Noiʻi | Papa Dummy | |
| Anawaena | 76.2 ± 0.5 | 76.2 ± 0.5 | 76.2 ± 0.5 | mm |
| Mānoanoa | 500 ± 25 | 500 ± 25 | 500 ± 25 | µm |
| Hoʻonohonoho Wafer | Ma ke axis: <0001> ± 0.5° | Ma ke axis: <0001> ± 2.0° | Ma ke axis: <0001> ± 2.0° | kekelē |
| Ka nui o ka Micropipe (MPD) | ≤ 1 | ≤ 5 | ≤ 10 | kenimika−2^-2−2 |
| Ke kū'ē uila | ≥ 1E10 | ≥ 1E5 | ≥ 1E5 | Ω·kenimi |
| Dopant | Hoʻopau ʻia | Hoʻopau ʻia | Hoʻopau ʻia | |
| Kūlana Pālahalaha Mua | {1-100} ± 5.0° | {1-100} ± 5.0° | {1-100} ± 5.0° | kekelē |
| Ka Lōʻihi Palahalaha Mua | 32.5 ± 3.0 | 32.5 ± 3.0 | 32.5 ± 3.0 | mm |
| Ka Lōʻihi Pālahalaha Lua | 18.0 ± 2.0 | 18.0 ± 2.0 | 18.0 ± 2.0 | mm |
| Kūlana Pālahalaha Lua | 90° CW mai ka pālahalaha mua ± 5.0° | 90° CW mai ka pālahalaha mua ± 5.0° | 90° CW mai ka pālahalaha mua ± 5.0° | kekelē |
| Hoʻokaʻawale ʻana i ka lihi | 3 | 3 | 3 | mm |
| LTV/TTV/Kakaka/Warp | 3 / 10 / ±30 / 40 | 3 / 10 / ±30 / 40 | 5 / 15 / ±40 / 45 | µm |
| ʻO ka ʻōʻili | ʻAoʻao-ʻaoʻao: CMP, ʻAoʻao-C: Hoʻopili ʻia | ʻAoʻao-ʻaoʻao: CMP, ʻAoʻao-C: Hoʻopili ʻia | ʻAoʻao-ʻaoʻao: CMP, ʻAoʻao-C: Hoʻopili ʻia | |
| Nā Māwae (Kukui Ikaika) | ʻAʻohe | ʻAʻohe | ʻAʻohe | |
| Nā Papa Hex (Kukui Ikaika) | ʻAʻohe | ʻAʻohe | ʻĀpana hōʻuluʻulu 10% | % |
| Nā Wahi Polytype (Kukui Ikaika) | ʻĀpana hōʻuluʻulu 5% | ʻĀpana hōʻuluʻulu 20% | ʻĀpana hōʻuluʻulu 30% | % |
| Nā ʻōpala (Kukui Ikaika) | ≤ 5 mau ʻōpala, ka lōʻihi hōʻuluʻulu ≤ 150 | ≤ 10 mau ʻōpala, ka lōʻihi hōʻuluʻulu ≤ 200 | ≤ 10 mau ʻōpala, ka lōʻihi hōʻuluʻulu ≤ 200 | mm |
| ʻOkiʻoki lihi | ʻAʻohe ≥ 0.5 mm ka laulā/hohonu | 2 i ʻae ʻia ≤ 1 mm ka laulā/hohonu | 5 i ʻae ʻia ≤ 5 mm ka laulā/hohonu | mm |
| Ka haumia ʻili | ʻAʻohe | ʻAʻohe | ʻAʻohe |
Nā noi
1. Nā Uila Mana Kiʻekiʻe
ʻO ke alakaʻi wela kiʻekiʻe a me ka bandgap ākea o nā wafers SiC e hoʻolilo iā lākou i mea kūpono no nā mea hana mana kiʻekiʻe, alapine kiʻekiʻe:
●MOSFET a me IGBT no ka hoʻololi mana.
● Nā ʻōnaehana mana kaʻa uila holomua, me nā inverters a me nā mea hoʻoili.
●ʻO ke kahua pūnaewele akamai a me nā ʻōnaehana ikehu hou.
2. Nā ʻōnaehana RF a me Microwave
Hoʻohana nā substrates SiC i nā noi RF a me microwave kiʻekiʻe me ka liʻiliʻi o ka nalowale ʻana o ka hōʻailona:
● Nā ʻōnaehana kamaʻilio a me nā ukali.
●Nā ʻōnaehana radar mokulele.
●Nā ʻāpana pūnaewele 5G holomua.
3. Nā Optoelectronics a me nā Sensors
Kākoʻo nā waiwai kūikawā o SiC i nā ʻano noi optoelectronic like ʻole:
●Nā mea ʻike UV no ka nānā ʻana i ke kaiapuni a me ka ʻike ʻana i nā ʻoihana.
●Nā substrates LED a me ka laser no nā kukui paʻa a me nā mea hana pololei.
●Nā mea ʻike wela kiʻekiʻe no nā ʻoihana aerospace a me nā kaʻa.
4. Noiʻi a me ka Hoʻomohala ʻana
ʻO ka ʻokoʻa o nā māka (Hana, Noiʻi, Dummy) e hiki ai i ka hoʻokolohua ʻoi loa a me ke kumu hoʻohālike o nā hāmeʻa ma ke kula nui a me ka ʻoihana.
Nā Pōmaikaʻi
● Hilinaʻi:ʻO ke kūpaʻa a me ke kūpaʻa maikaʻi loa ma nā papa.
● Hoʻopilikino:Nā hoʻonohonoho a me nā mānoanoa i hana ʻia e kūpono i nā pono like ʻole.
●Maʻemaʻe Kiʻekiʻe:ʻO ka hoʻohuihui i hoʻokaʻawale ʻole ʻia e hōʻoia i nā ʻokoʻa liʻiliʻi e pili ana i ka haumia.
●Ka hiki ke hoʻonui ʻia:Hoʻokō i nā koi o ka hana nui a me ka noiʻi hoʻokolohua.
ʻO nā wafers SiC maʻemaʻe 3-'īniha kou puka komo i nā polokalamu hana kiʻekiʻe a me nā holomua ʻenehana hou. No nā nīnau a me nā kikoʻī kikoʻī, e kelepona mai iā mākou i kēia lā.
Hōʻuluʻulu manaʻo
ʻO nā Wafers Silicon Carbide (SiC) Kiʻekiʻe 3-'īniha, i loaʻa ma Production, Research, a me Dummy Grades, he mau substrates premium i hoʻolālā ʻia no nā electronics mana kiʻekiʻe, nā ʻōnaehana RF/microwave, optoelectronics, a me R&D holomua. Loaʻa i kēia mau wafers nā waiwai undoped, semi-insulating me ka resistivity maikaʻi loa (≥1E10 Ω·cm no Production Grade), haʻahaʻa micropipe density (≤1 cm−2^-2−2), a me ke ʻano ʻili maikaʻi loa. Ua hoʻonohonoho pono ʻia lākou no nā noi hana kiʻekiʻe, me ka hoʻololi mana, nā kelepona, ka ʻike UV, a me nā ʻenehana LED. Me nā kuhikuhi hiki ke hoʻopilikino ʻia, ka conductivity thermal kiʻekiʻe, a me nā waiwai mechanical paʻa, hiki i kēia mau wafers SiC ke hana i nā mea hana pono a hilinaʻi hoʻi a me nā hana hou groundbreaking ma nā ʻoihana.
Kiʻikuhi kikoʻī
