SiC substrate 3inihi 350um mānoanoa HPSI ʻano Prime Grade Dummy grade

SiC substrate 3inihi 350um mānoanoa HPSI type Prime Grade Dummy grade Kiʻi Hōʻikeʻike

ʻO ka wehewehe pōkole:

ʻO ka 3-inch High Purity Silicon Carbide (SiC) wafers i hoʻonohonoho ponoʻia no ke koiʻana i nā noi i ka uila uila, optoelectronics, a me ka noiʻi holomua. Loaʻa i ka Production, Research, a me Dummy Grades, hāʻawi kēia mau wafers i ke kū'ē kūʻokoʻa, haʻahaʻa haʻahaʻa kīnā, a me ka maikaʻi o ka ʻili. Me nā waiwai semi-insulating undoped, hāʻawi lākou i ke kahua kūpono no ka hana ʻana i nā mea hana kiʻekiʻe e hana ana ma lalo o nā kūlana wela a me nā uila.

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

Waiwai

ʻĀpana	Papa Hana Hana	Papa noiʻi	Papa Dummy	Unite
Papa	Papa Hana Hana	Papa noiʻi	Papa Dummy
Anawaena	76.2 ± 0.5	76.2 ± 0.5	76.2 ± 0.5	mm
mānoanoa	500 ± 25	500 ± 25	500 ± 25	µm
Kūlana Wafer	Ma ka axis: <0001> ± 0.5°	Ma ka axis: <0001> ± 2.0°	Ma ka axis: <0001> ± 2.0°	degere
ʻOiʻa Micropipe (MPD)	≤ 1	≤ 5	≤ 10	knm−2^-2−2
Kū'ē Uila	≥ 1E10	≥ 1E5	≥ 1E5	Ω·cm
Dopant	Wehe ʻia	Wehe ʻia	Wehe ʻia
Kūlana Pāha mua	{1-100} ± 5.0°	{1-100} ± 5.0°	{1-100} ± 5.0°	degere
Ka lōʻihi pālahalaha	32.5 ± 3.0	32.5 ± 3.0	32.5 ± 3.0	mm
Ka lōʻihi pālahalaha lua	18.0 ± 2.0	18.0 ± 2.0	18.0 ± 2.0	mm
Kūlana Pāpā lua	90° CW mai ka papahele mua ± 5.0°	90° CW mai ka papahele mua ± 5.0°	90° CW mai ka papahele mua ± 5.0°	degere
Hoʻokuʻu Edge	3	3	3	mm
LTV/TTV/Bow/Warp	3 / 10 / ±30 / 40	3 / 10 / ±30 / 40	5 / 15 / ±40 / 45	µm
ʻAole ʻili	Si-maka: CMP, C-maka: Polina	Si-maka: CMP, C-maka: Polina	Si-maka: CMP, C-maka: Polina
Nā māwae (māmā Kiʻekiʻe)	ʻAʻohe	ʻAʻohe	ʻAʻohe
Nā Papa Hex (Kukui Kiʻekiʻe)	ʻAʻohe	ʻAʻohe	ʻĀpana hui 10%	%
Nā ʻāpana Polytype (Kukui Kiʻekiʻe)	ʻĀpana hui 5%	ʻĀpana hui 20%	ʻĀpana hui 30%	%
Nā ʻōpala (Kukui Kiʻekiʻe)	≤ 5 ʻōpala, hui pū ʻia ≤ 150	≤ 10 ʻōpala, hui pū ʻia ≤ 200	≤ 10 ʻōpala, hui pū ʻia ≤ 200	mm
ʻO ka ʻoki ʻoki	ʻAʻohe ≥ 0.5 mm laula/hohonu	2 ʻae ʻia ≤ 1 mm laula/hohonu	5 ʻae ʻia ≤ 5 mm laula/hohonu	mm
Hoʻohaumia ʻili	ʻAʻohe	ʻAʻohe	ʻAʻohe

Nā noi

1. Kiekie-Mana Electronics
ʻO ka conductivity thermal kiʻekiʻe a me ka bandgap ākea o nā wafers SiC e kūpono iā lākou no nā mea mana kiʻekiʻe, kiʻekiʻe.
●MOSFET a me IGBT no ka hoʻololi mana.
● ʻO nā ʻōnaehana mana kaʻa uila kiʻekiʻe, me nā mea hoʻohuli a me nā loina.
●Smart grid infrastructure a me nā ʻōnaehana ikehu hou.
2. RF a me nā Pūnaehana Microwave
Hiki i nā substrate SiC ke hiki i ka RF kiʻekiʻe a me nā noi microwave me ka liʻiliʻi o ka nalowale o ka hōʻailona:
●Ke kelepona a me nā ʻōnaehana ukali.
● Pūnaehana radar aerospace.
● ʻO nā ʻāpana pūnaewele 5G kiʻekiʻe.
3. Optoelectronics a me nā meaʻike
Kākoʻo nā waiwai kūʻokoʻa o SiC i nā ʻano noi optoelectronic:
●UV detectors no ka nānā 'ana i ke kaiapuni a me ka 'ike 'oihana.
●LED a me ka laser substrate no ka paʻa-kūlana kukui a me ka pololei mea kani.
● ʻO nā mea ʻike wela kiʻekiʻe no ka aerospace a me nā ʻoihana kaʻa.
4. Noiʻi a hoʻomohala
ʻO ka ʻokoʻa o nā māka (Production, Research, Dummy) hiki i ka hoʻokolohua ʻokiʻoki a me ka prototyping hāmeʻa ma ke kula a me ka ʻoihana.

Pono

● Pono:ʻO ke kūpaʻa maikaʻi a me ke kūpaʻa ma waena o nā papa.
● Hoʻopilikino:Hoʻonohonoho ʻia a me nā mānoanoa e kūpono i nā pono like ʻole.
●Maʻemaʻe Kiʻekiʻe:ʻO ka haku mele ʻole ʻia e hōʻoia i nā ʻokoʻa liʻiliʻi pili i ka haumia.
●Scalability:Hoʻokō i nā koi o ka hana nui a me ka noiʻi hoʻokolohua.
ʻO nā wafers SiC maʻemaʻe kiʻekiʻe 3-inihi kou ʻīpuka i nā mea hana kiʻekiʻe a me nā holomua ʻenehana hou. No nā nīnau a me nā kikoʻī kikoʻī, e kelepona mai iā mākou i kēia lā.

Hōʻuluʻulu manaʻo

ʻO ka 3-inch High Purity Silicon Carbide (SiC) Wafers, i loaʻa i ka Production, Research, and Dummy Grades, he mau substrates premium i hoʻolālā ʻia no nā uila uila kiʻekiʻe, RF/microwave system, optoelectronics, a me R&D kiʻekiʻe. ʻO kēia mau wafers e pili ana i ka undoped, semi-insulating waiwai me ka resistivity maikaʻi loa (≥1E10 Ω·cm no ka Papa Hana Hana), haʻahaʻa micropipe haʻahaʻa (≤1 cm−2^-2−2), a me ka maikaʻi o ka ʻili. Hoʻolālā ʻia lākou no nā noi hana kiʻekiʻe, me ka hoʻololi ʻana i ka mana, kelepona, UV sensing, a me nā ʻenehana LED. Me nā hoʻonohonoho hoʻonohonoho maʻamau, ʻoi aku ka maikaʻi o ka thermal conductivity, a me nā waiwai mechanical ikaika, hiki i kēia mau wafers SiC ke hiki i ka hana pono a me ka hilinaʻi ʻana i nā mea hana hou i nā ʻoihana.