ʻO ka wafer Silicon Dioxide SiO2 wafer mānoanoa i poli ʻia, Prime And Test Grade

Wehewehe Pōkole:

ʻO ka oxidation thermal ka hopena o ka hōʻike ʻana i kahi wafer silicon i ka hui pū ʻana o nā mea oxidizing a me ka wela e hana i kahi papa o ka silicon dioxide (SiO2). Hiki i kā mākou hui ke hoʻopilikino i nā ʻāpana silicon dioxide oxide me nā palena like ʻole no nā mea kūʻai aku, me ka maikaʻi maikaʻi loa; ua hoʻokō ʻia ka mānoanoa o ka papa oxide, ka compactness, ka uniformity a me ke kuhikuhi kristal resistivity e like me nā kūlana aupuni.


Nā hiʻohiʻona

Hoʻolauna i ka pahu wafer

Huahana Nā wafers Thermal Oxide (Si+SiO2)
ʻAno Hana LPCVD
Ka hoʻowali ʻili SSP/DSP
Anawaena 2 ʻīniha / 3 ʻīniha / 4 ʻīniha / 5 ʻīniha / 6 ʻīniha
ʻAno ʻAno P / ʻAno N
Mānoanoa o ka papa ʻokikene 100nm ~1000nm
Hoʻonohonoho <100> <111>
Ke kū'ē uila 0.001-25000(Ω•cm)
Noi Hoʻohana ʻia no ka mea lawe hāpana radiation synchrotron, ka uhi ʻana o PVD/CVD ma ke ʻano he substrate, ka hāpana ulu magnetron sputtering, XRD, SEM,Ka ikaika atomika, spectroscopy infrared, spectroscopy fluorescence a me nā substrates hoʻāʻo loiloi ʻē aʻe, nā substrates ulu epitaxial beam molecular, ka nānā ʻana o X-ray o nā semiconductors crystalline

ʻO nā wafers silicon oxide he mau kiʻiʻoniʻoni silicon dioxide i ulu ʻia ma luna o ka ʻili o nā wafers silicon ma o ka oxygen a i ʻole ka mahu wai ma nā mahana kiʻekiʻe (800°C ~ 1150°C) me ka hoʻohana ʻana i ke kaʻina hana oxidation thermal me nā lako paipu umu kaomi lewa. ʻO ka mānoanoa o ke kaʻina hana mai 50 nanometers a i 2 microns, ʻo ka mahana o ke kaʻina hana a hiki i 1100 degere Celsius, ua māhele ʻia ke ʻano ulu i ʻelua ʻano "oxygen pulu" a me "oxygen maloʻo". ʻO ka Thermal Oxide kahi papa oxide "ulu", nona ke ʻano like kiʻekiʻe, ʻoi aku ka maikaʻi o ka densification a me ka ikaika dielectric kiʻekiʻe ma mua o nā papa oxide i waiho ʻia e CVD, e hopena ana i ka maikaʻi kiʻekiʻe.

ʻOkikeneka Oxygen Maloʻo

Hoʻopili ka Silicon me ka oxygen a ke neʻe mau nei ka papa oxide i ka papa substrate. Pono e hana ʻia ka oxidation maloʻo ma nā mahana mai 850 a 1200°C, me nā helu ulu haʻahaʻa, a hiki ke hoʻohana ʻia no ka ulu ʻana o ka puka insulated MOS. Makemake ʻia ka oxidation maloʻo ma mua o ka oxidation pulu ke koi ʻia kahi papa silicon oxide kiʻekiʻe a lahilahi. Ka hiki ke oxidation maloʻo: 15nm~300nm.

2. Hoʻomake ʻia ka pulu

Hoʻohana kēia ʻano hana i ka mahu wai e hana i kahi papa oxide ma ke komo ʻana i loko o ka ʻōmole umu ma lalo o nā kūlana wela kiʻekiʻe. ʻOi aku ka ʻino o ka densification o ka oxidation oxygen pulu ma mua o ka oxidation oxygen maloʻo, akā i ka hoʻohālikelike ʻana me ka oxidation oxygen maloʻo, ʻo kona pono he kiʻekiʻe ka ulu ʻana, kūpono no ka ulu ʻana o ka ʻili ma mua o 500nm. Ka hiki ke oxidation pulu: 500nm~2µm.

ʻO ka paipu umu hoʻomakeʻe kaomi lewa o AEMD he paipu umu pālahalaha Czech, i hōʻailona ʻia e ke kūpaʻa hana kiʻekiʻe, ke ʻano like o ka ʻili maikaʻi a me ka kaohi ʻāpana kiʻekiʻe. Hiki i ka paipu umu silicon oxide ke hana a hiki i 50 mau wafers no kēlā me kēia paipu, me ke ʻano like maikaʻi loa o loko a me waena o nā wafers.

Kiʻikuhi kikoʻī

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IMG_1589(1)

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