ʻO ka mīkini ʻili daimana he nui no ka SiC Sapphire Ultra-Hard Brittle Materials
Hoʻolauna i ka Multi-Wire Diamond Sawing Machine
ʻO ka mīkini ʻili daimana multi-wire he ʻōnaehana slicing kiʻekiʻe i hoʻolālā ʻia no ka hana ʻana i nā mea paʻakikī loa a palupalu. Ma ka hoʻohana ʻana i nā uea i uhi ʻia i ke daimana like ʻole, hiki i ka mīkini ke ʻoki i nā wafers he nui i ka manawa hoʻokahi, e loaʻa ana i ka throughput kiʻekiʻe a me ka pololei. Ua lilo kēia ʻenehana i mea hana pono i nā ʻoihana e like me semiconductors, solar photovoltaics, LEDs, a me nā seramika kiʻekiʻe, ʻoi aku no nā mea e like me SiC, sapphire, GaN, quartz, a me alumina.
Ke hoʻohālikelike ʻia me ka ʻoki uea hoʻokahi maʻamau, hāʻawi ka hoʻonohonoho multi-wire i nā haneli i nā haneli o nā ʻāpana i kēlā me kēia pūʻulu, e hōʻemi nui ana i ka manawa pōʻai me ka mālama ʻana i ka palahalaha maikaʻi loa (Ra <0.5 μm) a me ke kiko kiko (± 0.02 mm). Hoʻohui kona hoʻolālā modular i ka hoʻopaʻa ʻana i ka uea maʻemaʻe, nā ʻōnaehana lawelawe ʻana i nā mea hana, a me ka nānā ʻana ma ka pūnaewele, e hōʻoia ana i ka hana lōʻihi, kūpaʻa, a piha hoʻi.
Nā ʻāpana ʻenehana o ka mīkini ʻili daimana nui
| 'ikamu | Hōʻike | 'ikamu | Hōʻike |
|---|---|---|---|
| Ka nui o ka hana (Square) | 220 × 200 × 350 mm | Kaʻa kaʻa | 17.8 kW × 2 |
| Nui hana kiʻekiʻe loa (Rāpuni) | Φ205 × 350 mm | Kaʻa uila | 11.86 kW × 2 |
| Kaʻawale ʻana o spindle | Φ250 ±10 × 370 × 2 axis (mm) | Mekini hoʻokiʻekiʻe papa hana | 2.42 kW × 1 |
| axis kumu | 650 mm | Kaʻa ʻauʻau | 0.8 kW × 1 |
| Uea holo māmā | 1500 m/min | Moki hoʻonohonoho | 0.45 kW × 2 |
| Anawaena uwea | Φ0.12–0.25 mm | kaʻa hoʻopaʻapaʻa | 4.15 kW × 2 |
| Hapai ka mama | 225 mm/min | ʻO ka motika slurry | 7.5 kW × 1 |
| Max. ka hoʻololi papaʻaina | ±12° | Kaha pahu pahu slurry | 300 L |
| Huli koli | ±3° | Kahe hooluu | 200 L/min |
| ʻO ke alapine ʻana | ~ 30 manawa / min | Temp. pololei | ±2 °C |
| Laki hānai | 0.01–9.99 mm/min | Lako ikehu | 335+210 (mm²) |
| Laki hānai uea | 0.01–300 mm/min | Ea kōmi | 0.4–0.6 MPa |
| Nui mīkini | 3550 × 2200 × 3000 mm | Kaumaha | 13,500 kg |
Mekani Hana o ka Mīkini Sawing Diamond Wire Nui
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Ka Oki Uea Nui
ʻO nā uea daimana he nui e neʻe i nā wikiwiki i hoʻonohonoho ʻia a hiki i 1500 m/min. ʻO nā pulley alakaʻi pololei a me ka mana hoʻopaʻapaʻa pani pani ʻia (15-130 N) mālama i nā uwea paʻa, e hōʻemi ana i ka manawa o ka ʻae a i ʻole nahā. -
ʻO ka hānai pono ʻana a me ka hoʻonohonoho ʻana
Loaʻa i ka ± 0.005 mm ka pololei o ka hoʻonohonoho ʻana i ka Servo. Hoʻonui ka laser koho a i ʻole ka alignment kōkua ʻike i nā hopena no nā ʻano paʻakikī. -
ʻO ka hoʻoluʻu a me ka wehe ʻana i nā ʻōpala
Hoʻopau mau ka mea hoʻoluʻu kiʻekiʻe i nā ʻāpana a hoʻomaʻalili i ka wahi hana, e pale ana i ka pōʻino wela. Hoʻonui ʻia ke ola hoʻoluʻu a hōʻemi i ka wā hoʻomaha. -
Papahana Mana akamai
Hoʻololi ikaika nā mea hoʻokele servo pane kiʻekiʻe (<1 ms) i ka hānai, ka haʻalulu, a me ka wikiwiki uea. ʻO ka hoʻokele meaʻai hoʻohui ʻia a me ka hoʻololi ʻana i ka hoʻololi ʻana i hoʻokahi kaomi hoʻololi i ka hana nui.
Nā Pōmaikaʻi Koʻikoʻi o ka mīkini ʻili daimana nui
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Huahana Kiʻekiʻe
Hiki ke ʻoki i nā wafers 50-200 i kēlā me kēia holo, me ka poho kerf <100 μm, hoʻomaikaʻi i ka hoʻohana ʻana i nā mea a hiki i 40%. ʻO ka throughput he 5-10x ka nui o nā ʻōnaehana uea kuʻuna. -
Manao pololei
ʻO ke kūpaʻa ʻana o ka uea i loko o ka ± 0.5 N e hōʻoia i nā hopena kūlike ma nā mea palupalu. Kākoʻo ka nānā ʻana i ka manawa maoli ma kahi 10" HMI interface i ka mālama ʻana i ka meaʻai a me ka hana mamao. -
Hiki ke hoʻololi, hana modular
E kūpono me nā anawaena uwea mai 0.12–0.45 mm no nā kaʻina ʻoki like ʻole. Hiki i ka lawelawe robotic ke koho i nā laina hana ʻakomi piha. -
Paʻa Paʻa Hana Hana
ʻO nā kiʻi hoʻoheheʻe koʻikoʻi/paʻa ʻia e hōʻemi i ka hoʻololi ʻana (<0.01 mm). Hāʻawi nā pulleys alakaʻi me ka seramika a i ʻole carbide coatings ma luna o 8000 mau hola o ke ola lawelawe.
Na Kihapai Noi o ka Mīkini Sawing Diamond Wire
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Semiconductors: Ke ʻoki ʻana i ka SiC no nā modula mana EV, nā substrates GaN no nā mea 5G.
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Photovoltaics: Kiekie-wikiwiki silika wafer slicing me ± 10 μm like.
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LED & Optik: Nā pani Sapphire no ka epitaxy a me ka pololei o nā mea ʻenehana me ka <20 μm ʻoki ʻoki.
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ʻO nā Seramika Kiʻekiʻe: Ka hana ʻana o nā alumina, AlN, a me nā mea like no ka aerospace a me nā ʻāpana hoʻokele wela.
FAQ – Multi-Wire Diamond Sawing Machine
Q1: He aha nā mea maikaʻi o ka sawing multi-wire i hoʻohālikelike ʻia me nā mīkini uila hoʻokahi?
A: Hiki i nā ʻōnaehana uea nui ke ʻoki i nā haneli a i nā haneli o nā wafers i ka manawa like, e hoʻonui ana i ka pono e 5-10 ×. ʻOi aku ka kiʻekiʻe o ka hoʻohana ʻana i nā mea me ka nalowale o ke kerf ma lalo o 100 μm, i mea kūpono no ka hana nui.
Q2: He aha nā ʻano mea hiki ke hana?
A: Hoʻolālā ʻia ka mīkini no nā mea paʻakikī a palupalu, me ka silicon carbide (SiC), sapphire, gallium nitride (GaN), quartz, alumina (Al₂O₃), a me alumini nitride (AlN).
Q3: He aha ka pololei achievable a me ka maikaʻi o ka ʻili?
A: Hiki i ka ʻili o ka ʻili ke hiki i ka Ra <0.5 μm, me ka pololei ʻana o ± 0.02 mm. Hiki ke hoʻomalu ʻia ka ʻoki ʻoki ʻana i <20 μm, e hālāwai me nā kūlana semiconductor a me optoelectronic.
Q4: ʻO ke kaʻina hana e ʻoki ai i nā māwae a i ʻole ka pōʻino?
A: Me ka mea hoʻoheheʻe kiʻekiʻe a me ka hoʻopaʻa ʻana i ka hoʻopaʻa ʻana i ka hoʻopaʻa ʻana, hoʻemi ʻia ka pilikia o nā micro-cracks a me ka pōʻino koʻikoʻi, e hōʻoiaʻiʻo ana i ka pono wafer maikaʻi loa.
